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    • 2. 发明申请
    • APPARATUS AND METHOD FOR TREATING USED ELECTROLESS PLATING SOLUTIONS
    • 用于处理使用的电镀镀层解决方案的装置和方法
    • WO2005065208A3
    • 2006-02-02
    • PCT/US2004042416
    • 2004-12-16
    • BOC GROUP INC
    • CLARK JAMES ROBERTYI RICHARD CJANGBARWALA JUZER
    • C23C18/16C25D21/18C02F1/461C25D17/00
    • C23C18/1617
    • A method and apparatus for treating an electroless plating solution is provided. The apparatus includes a reaction vessel, a cathode and an anode disposed in the interior of the reaction vessel and in electrical communication with a power source, a drain disposed in the reaction vessel, and a nozzle in fluid communication with the drain, disposed in the reaction vessel such that the nozzle and the drain are separated by the cathode and the anode. The method includes disposing an electroless plating solution in the reaction vessel, recirculating the plating solution through the reaction vessel by draining the plating solution from the reaction vessel and subsequently re-injecting the plating solution into the reaction vessel through the nozzle. A current is driven through the anode and cathode to oxidize reducing agents in the liquid and plate out the metal as the elemental metal.
    • 提供一种处理化学镀溶液的方法和装置。 该装置包括设置在反应容器内部并与电源电连通的反应容器,阴极和阳极,设置在反应容器中的排水口以及与排水口流体连通的喷嘴, 反应容器使得喷嘴和排水管被阴极和阳极隔开。 该方法包括在反应容器中设置化学镀溶液,通过从反应容器中排出电镀溶液将镀液再循环通过反应容器,随后通过喷嘴将电镀溶液重新注入反应容器。 电流通过阳极和阴极驱动,以氧化液体中的还原剂并将金属作为元素金属排出。