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1. 发明申请

WO2015175353A1 METHOD OF PROVIDING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREOF 审中-公开
标题翻译：提供电子设备的方法及其电子设备
公开(公告)号：WO2015175353A1
公开(公告)日：2015-11-19
申请号：PCT/US2015/029991
申请日：2015-05-08
申请人： ARIZONA BOARD OF REGENTS, FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY
发明人： HOWARD, Emmett , MUNIZZA, Nicholas , YEE, Paul , MARRS, Michael
IPC分类号： H01L21/60
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/29 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2224/8309 , H01L2224/83359
摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.
摘要翻译：一些实施例包括一种方法。该方法可以包括：提供载体衬底; 在所述载体基底上提供粘附修饰层; 提供器件衬底; 以及将所述器件衬底和所述载体衬底耦合在一起时，当所述器件衬底和所述载体衬底耦合在一起时，所述粘附修饰层位于所述器件衬底和所述载体衬底之间。在这些实施例中，粘合改性层可以被配置成使得器件衬底通过粘合改性层间接地与载体衬底相互耦合，第一结合力大于第二结合力，器件衬底与载体基材不存在粘附改性层。还公开了相关方法和装置的其它实施例。

2. 发明申请

WO2012021196A2 METHOD FOR MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICES THEREOF 审中-公开
标题翻译：制造电子器件的方法及其电子器件
公开(公告)号：WO2012021196A2
公开(公告)日：2012-02-16
申请号：PCT/US2011/037207
申请日：2011-05-19
申请人： ARIZONA BOARD OF REGENTS, FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , LOY, Douglas E. , HOWARD, Emmett , HAQ, Jesmin , MUNIZZA, Nicholas
发明人： LOY, Douglas E. , HOWARD, Emmett , HAQ, Jesmin , MUNIZZA, Nicholas
IPC分类号： H01L21/20 , H01L29/786
CPC分类号： H01B13/00 , B32B7/02 , H01L21/2007 , H01L21/6835 , H01L23/49833 , H01L27/1218 , H01L27/1266 , H01L29/78603 , H01L29/78636 , H01L51/003 , H01L51/0097 , H01L51/0508 , H01L2221/6835 , H01L2221/68381 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y02E10/549 , Y02P70/521 , Y10T156/10 , Y10T156/11 , Y10T156/1153 , Y10T156/1158 , Y10T428/24942 , Y10T428/24959 , Y10T428/24975 , H01L2924/00
摘要： In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.
摘要翻译：在一些实施例中，一种制造电子器件的方法，包括在第一侧提供具有第一侧，第二侧和第一粘合剂的载体衬底; 提供第一柔性基底; 以及将所述第一柔性基板接合到所述载体基板的第一侧。第一粘合剂将第一柔性基底粘结到载体基底的第一侧。载体基板包括构造成补偿载体基板的变形的机构。公开了其他实施例。

3. 发明申请

WO2015057719A1 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 审中-公开
标题翻译：提供柔性半导体器件及其柔性半导体器件的方法
公开(公告)号：WO2015057719A1
公开(公告)日：2015-04-23
申请号：PCT/US2014/060501
申请日：2014-10-14
申请人： ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY
发明人： MARRS, Michael A. , HOWARD, Emmett M. , LOY, Douglas E. , MUNIZZA, Nicholas
IPC分类号： H01L21/60
CPC分类号： H01L27/1266 , H01L21/6835 , H01L2221/6835 , H01L2221/68381 , H01L2221/68386
摘要： Some embodiments include a method. The method can include providing a carrier substrate. The carrier substrate has an edge, a first surface, and a second surface opposite the first surface. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate. The flexible substrate has an edge, a first surface, and a second surface opposite the first surface. Further still, the method can include coupling the second surface of the flexible substrate to the first surface of the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive after coupling the second surface of the flexible substrate to the first surface of the carrier substrate. Other embodiments of related methods and devices are also disclosed.
摘要翻译：一些实施例包括一种方法。该方法可以包括提供载体衬底。载体衬底具有边缘，第一表面和与第一表面相对的第二表面。此外，该方法可以包括提供交联粘合剂，并提供柔性基材。柔性基板具有边缘，第一表面和与第一表面相对的第二表面。此外，该方法可以包括使用交联粘合剂将柔性基板的第二表面耦合到载体基板的第一表面，使得柔性基板的边缘的至少一部分从载体的边缘凹陷并且使得交联粘合剂在载体基材的第一表面的偏移部分处具有在柔性基材的边缘的至少部分与载体的边缘之间的交联粘合剂的暴露部分基质。同时，该方法可以包括在将柔性基板的第二表面连接到载体基板的第一表面之后蚀刻交联粘合剂的暴露部分。还公开了相关方法和装置的其它实施例。

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