专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2004078411A3 METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL 审中-公开
公开(公告)号：WO2004078411A3
公开(公告)日：2004-09-16
申请号：PCT/US2004/006385
申请日：2004-03-03
申请人： APPLIED MATERIALS, INC. , TSAI, Stan , LIU, Fen, Q. , WANG, Yan , MAVLIEV, Rashid , CHEN, Liang-Yuh , DUBOUST, Alain
发明人： TSAI, Stan , LIU, Fen, Q. , WANG, Yan , MAVLIEV, Rashid , CHEN, Liang-Yuh , DUBOUST, Alain
IPC分类号： C25F3/16
摘要： A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

2. 发明申请

WO2005113193A1 RETAINING RING WITH CONDUCTIVE PORTION 审中-公开
标题翻译：带导电部件的保持环
公开(公告)号：WO2005113193A1
公开(公告)日：2005-12-01
申请号：PCT/US2005/016431
申请日：2005-05-11
申请人： APPLIED MATERIALS, INC. , MANENS, Antoine, P. , SHRAUTI, Suresh , DUBOUST, Alain , WANG, Yan , CHEN, Liang-Yuh , LUI, Feng, Q. , BUTTERFIELD, Paul, D. , MAVLIEV, Rashid
发明人： MANENS, Antoine, P. , SHRAUTI, Suresh , DUBOUST, Alain , WANG, Yan , CHEN, Liang-Yuh , LUI, Feng, Q. , BUTTERFIELD, Paul, D. , MAVLIEV, Rashid
IPC分类号： B24B37/04
CPC分类号： B24B37/32
摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
摘要翻译：描述了一种用于电化学机械加工的保持环。保持环具有形成有导电部分和非导电部分的大致环形体。非导电部分在抛光期间接触基板。导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

3. 发明申请

WO2006014728A1 POLISHING SOLUTION RETAINER 审中-公开
标题翻译：抛光解决方案
公开(公告)号：WO2006014728A1
公开(公告)日：2006-02-09
申请号：PCT/US2005/025733
申请日：2005-07-19
申请人： APPLIED MATERIALS, INC. , ZHANG, Hanzhong , LIU, Feng, Q. , TSAI, Stan, D. , MAVLIEV, Rashid , OLGADO, Donald , CHEN, Liang-Yuh
发明人： ZHANG, Hanzhong , LIU, Feng, Q. , TSAI, Stan, D. , MAVLIEV, Rashid , OLGADO, Donald , CHEN, Liang-Yuh
IPC分类号： B24B37/04
CPC分类号： B24B37/04 , B24B57/02
摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
摘要翻译：对基板研磨装置和方法进行说明。基座包括至少一个可移动的压板以接合抛光垫。在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。抛光溶液保持机构附接到基座或承载头组件中的一个。保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

4. 发明申请

WO2021202741A1 METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS 审中-公开
公开(公告)号：WO2021202741A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/025183
申请日：2021-03-31
申请人： MAVLIEV, Rashid
发明人： MAVLIEV, Rashid
IPC分类号： H01L21/768 , H01L23/52 , H01L21/485 , H01L21/6835 , H01L2221/1084 , H01L2221/68345 , H01L2221/68359 , H01L23/528 , H01L23/552 , H01L24/00
摘要： Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This "off-device" approach of forming MILs reduces the complexity and costs of the overall process and also reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. The MIL may be annealed and/or subjected to selective cobalt capping right on the engineered template. During the transfer, the engineered template and device substrate are stacked together and then separated.

5. 发明申请

WO2010004516A1 SYSTEM AND METHODS FOR IN-LINE MONITORING OF PARTICLES IN OPAQUE FLOWS AND SELECTIVE OBJECT MANIPULATION IN MULTI-COMPONENT FLOW 审中-公开
标题翻译：在OPAQUE流中对粒子进行在线监测的系统和方法以及多组分流中的选择性对象操作
公开(公告)号：WO2010004516A1
公开(公告)日：2010-01-14
申请号：PCT/IB2009/052974
申请日：2009-07-08
申请人： IPGRIP, INC. , SCHWEIGER, Martin , MAVLIEV, Rashid , MAVLIEV, Andrew
发明人： MAVLIEV, Rashid , MAVLIEV, Andrew
IPC分类号： G01N15/00 , B01D43/00
CPC分类号： G01N15/1404 , B01D43/00 , G01N15/1425 , G01N35/1097 , G01N2015/0092
摘要： Systems and methods are disclosed for particle monitoring, in particular in-line particle monitoring and selective object manipulation in multi-component flow. An exemplary system can include a detection system for the monitoring of a component, such as a particle in a opaque flow carrier. An exemplary system includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths enabling optical means for particle detection. The system can also include a device such as a valve or actuator to manipulate the detected component from other components in the flow carrier. A controller or other processor can receive and process detected component data and distinguish a component of interest from the remaining flowable sample. Once the component is recognized, the controller synchronizes the flow manipulation device with the detection system to manipulate the detected component from the flow carrier.
摘要翻译：公开了用于粒子监测的系统和方法，特别是在多分量流中的在线粒子监测和选择性对象操作。示例性系统可以包括用于监测部件（例如不透明流动载体中的颗粒）的检测系统。示例性系统包括限制对至少第一波长波长的光波是不透明的可流动样品; 同时在与第一和第二方向正交的第三方向延伸样品的同时将样品限制在平行于可流动样品的流动方向并与第一方向正交的第二方向上，同时沿着第一方向压缩可流动样品。当样品在第一方向被压缩时，样品变得透明，使得能够进行粒子检测的光学装置的第一波长范围中的至少一个波长。该系统还可以包括诸如阀门或致动器的装置，以便从流动载体中的其它部件操纵检测到的部件。控制器或其他处理器可以接收和处理检测到的组件数据并将感兴趣的组件与剩余的可流动样本区分开。一旦识别出部件，控制器将流量操纵装置与检测系统同步，以便从流动载体中操纵检测到的部件。

6. 发明申请

WO2004005894A1 METHOD AND APPARATUS FOR DETECTING INDIVIDUAL PARTICLES IN A FLOWABLE SAMPLE 审中-公开
标题翻译：用于检测可流动样品中的个体颗粒的方法和装置
公开(公告)号：WO2004005894A1
公开(公告)日：2004-01-15
申请号：PCT/US2003/020640
申请日：2003-07-01
申请人： MAVLIEV, Rashid
发明人： MAVLIEV, Rashid
IPC分类号： G01N15/02
CPC分类号： G01N15/1404 , G01N15/1459 , G01N2015/1406 , G01N2015/1409 , G01N2015/1413 , G01N2015/1497
摘要： An apparatus (100) and method are disclosed for the optical characterization of particles in highly concentrated systems (i.e. suspensions and dispersions, hereinafter referred to as the "sample"), such as solid-particle slurries and liquid-in-liquid (e.g. oil-in-water) emulsions, which do not require dilution of the samples. Reduction of the optical transparency of the sample, which is required to avoid the influence of multiple light scattering, is achieved by forming the sample into a sheet flow with controlled thickness. The sample transparency is measured by using a light extinction method and the sample thickness in the optical cell (102) is controlled in order to keep the sample transparency within a range of predetermined values. By this means, an improved efficiency of single-particle detection is achieved and the usual reduction of signal quality due to multiple light scattering is avoided.
摘要翻译：公开了一种用于光学表征高浓度系统（即悬浮液和分散体，以下称为“样品”）中的颗粒的装置（100）和方法，例如固体颗粒浆液和液体液体（例如油 - 水）乳液，其不需要稀释样品。通过将样品形成具有受控厚度的片材流，实现了避免多次光散射影响所需的样品的光学透明度的降低。通过使用消光方法测量样品透明度，并且控制光学单元（102）中的样品厚度，以将样品透明度保持在预定值的范围内。通过这种方式，可以实现提高单粒子检测效率，避免由于多光散射引起的信号质量的普遍降低。

7. 发明申请

WO2002085570A2 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光导电抛光法
公开(公告)号：WO2002085570A2
公开(公告)日：2002-10-31
申请号：PCT/US2002/011009
申请日：2002-04-10
申请人： APPLIED MATERIALS, INC.
发明人： CHEN, Liang-Yuh , WANG, Yuchun , WANG, Yan , DUBOUST, Alain , CARL, Daniel, A. , WADENSWEILER, Ralph , BIRANG, Manoocher , BUTTERFIELD, Paul, D. , MAVLIEV, Rashid , TSAI, Stan, D.
IPC分类号： B24B37/04
CPC分类号： B23H5/08
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
摘要翻译：提供制造和装置的物品（205），用于平坦化基底表面。在一个方面，提供了一种用于抛光衬底的制品（205），该衬底包括具有至少部分导电表面（510）的主体的抛光制品，该表面适于抛光衬底和安装表面（530）。可以在抛光制品（205）中形成多个穿孔（505），用于材料流过其中。另一方面，用于抛光衬底的抛光制品（205）包括具有抛光表面和设置在其中的导电元件的主体。导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。抛光表面可以具有形成在其中的一个或多个凹穴。导电元件可以设置在每个抛光槽中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式