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1. 发明申请

WO2018194929A1 POLISHING APPARATUS USING NEURAL NETWORK FOR MONITORING 审中-公开
公开(公告)号：WO2018194929A1
公开(公告)日：2018-10-25
申请号：PCT/US2018/027562
申请日：2018-04-13
申请人： APPLIED MATERIALS, INC.
发明人： XU, Kun , IRAVANI, Hassan G. , IVANOV, Denis , SWEDEK, Boguslaw A. , SHEN, Shih-Haur , LEE, Harry Q. , CHERIAN, Benjamin
IPC分类号： H01L21/304 , H01L21/66 , H01L21/3105 , H01L21/321
摘要： A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.

2. 发明申请

WO2019195087A1 POLISHING APPARATUS USING MACHINE LEARNING AND COMPENSATION FOR PAD THICKNESS 审中-公开
公开(公告)号：WO2019195087A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/024687
申请日：2019-03-28
申请人： APPLIED MATERIALS, INC.
发明人： XU, Kun , IVANOV, Denis , LEE, Harry Q. , QIAN, Jun
IPC分类号： B24B37/005 , B24B37/20 , B24B49/10 , H01L21/304 , H01L21/67
摘要： Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of the measured signal values are adjusted based on the thickness of the polishing pad. For each scan of the plurality of scans and each location of the plurality of different locations, a value is generated representing a thickness of the layer at the location. This includes processing the adjusted signal values using one or more processors configured by machine learning. A polishing endpoint is detected or a polishing parameter is modified based on the values representing the thicknesses at the plurality of different locations.

3. 发明申请

WO2021045991A1 METHODS AND APPARATUS FOR DYNAMICAL CONTROL OF RADIAL UNIFORMITY WITH TWO-STORY MICROWAVE CAVITIES 审中-公开
公开(公告)号：WO2021045991A1
公开(公告)日：2021-03-11
申请号：PCT/US2020/048752
申请日：2020-08-31
申请人： APPLIED MATERIALS, INC.
发明人： KOBAYASHI, Satoru , SUGAI, Hideo , IVANOV, Denis , SCUDDER, Lance , LUBOMIRSKY, Dmitry
IPC分类号： H01J37/32
摘要： Methods and apparatus provide plasma generation for semiconductor process chambers. In some embodiments, the plasma is generated by a system that may comprise a process chamber having at least two upper microwave cavities separated from a lower microwave cavity by a metallic plate with a plurality of radiation slots, at least one microwave input port connected to a first one of the at least two upper microwave cavities, at least two microwave input ports connected to a second one of the at least two upper microwave cavities, and the lower microwave cavity receives radiation through the plurality of radiation slots in the metallic plate from both of the at least two upper microwave cavities, the lower microwave cavity is configured to form an electric field that provides uniform plasma distribution in a process volume of the process chamber.

4. 发明申请

WO2018075260A1 CORE CONFIGURATION FOR IN-SITU ELECTROMAGNETIC INDUCTION MONITORING SYSTEM 审中-公开
标题翻译：地磁电磁感应监测系统的核心配置
公开(公告)号：WO2018075260A1
公开(公告)日：2018-04-26
申请号：PCT/US2017/055377
申请日：2017-10-05
申请人： APPLIED MATERIALS, INC.
发明人： IRAVANI, Hassan G. , XU, Kun , IVANOV, Denis , SHEN, Shih-Haur , SWEDEK, Boguslaw A.
IPC分类号： B24B49/10 , B24B37/013 , H01L21/306
摘要： An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
摘要翻译：用于化学机械抛光的设备包括用于具有抛光表面的抛光垫的支撑件和产生磁场以监测被抛光垫抛光的基板的电磁感应监视系统。电磁感应监控系统包括芯体和缠绕在芯体的一部分周围的线圈。芯包括后部，从后部沿与抛光表面垂直的第一方向延伸的中心柱，以及环形边缘，该环形边缘从后部延伸并平行于中心柱并且围绕中心柱并与中心柱间隔开一个沟。间隙的宽度小于中心柱的宽度，并且环形边缘的顶表面的表面积至少比中心柱的顶表面的表面积大两倍。

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