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    • 1. 发明申请
    • WAFER DRYING DEVICE AND A WAFER DRYING METHOD EMPLOYING THE SAME
    • 干燥干燥装置和使用其的干燥方法
    • WO2011005055A3
    • 2011-04-07
    • PCT/KR2010004484
    • 2010-07-09
    • APETHONG SUNG HONO BONG HOCHOI HEON SIKKIM DEOK HO
    • HONG SUNG HONO BONG HOCHOI HEON SIKKIM DEOK HO
    • H01L21/304
    • H01L21/67034
    • The object of the present invention is to provide a wafer drying device which can reduce damage to wafers and can reduce the amount of gas used, and to provide a wafer drying method employing the same. The present invention relates to a wafer drying device and to a wafer drying method employing the same, wherein the device comprises: a chamber which has a first rotational shaft secured to one surface, has a movable second rotational shaft formed in an upper part, and has a first water discharge port formed in a lower part; a tilt arm which is secured to the first rotational shaft and the second rotational shaft, and on the end of which is secured a cassette for mounting wafers; a first nozzle for supplying IPA/nitrogen gas to the cassette; a screw whereby the second rotational shaft is moved in a first direction or a second direction; and a drive motor for rotating the screw.
    • 本发明的目的是提供一种晶片干燥装置,其可以减少对晶片的损害并且可以减少所使用的气体的量,并提供使用该晶片干燥装置的晶片干燥方法。 本发明涉及一种晶片干燥装置及使用该晶片干燥装置的晶片干燥方法,其特征在于,所述装置包括:具有固定在一个表面上的第一旋转轴的室,具有形成在上部的可动第二旋转轴, 具有形成在下部的第一排水口; 倾斜臂固定到第一旋转轴和第二旋转轴,并且其顶端固定有用于安装晶片的盒; 用于向所述盒提供IPA /氮气的第一喷嘴; 螺钉,其中所述第二旋转轴沿第一方向或第二方向移动; 以及用于旋转螺杆的驱动马达。