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1. 发明申请

WO03003757A3 SPLITTER ASSEMBLY WITH HIGH DENSITY BACKPLANE BOARD 审中-公开
标题翻译：分离器组件与高密度背板
公开(公告)号：WO03003757A3
公开(公告)日：2003-06-19
申请号：PCT/US0219861
申请日：2002-06-24
申请人： ADC TELECOMMUNICATIONS INC
发明人： SCHMOKEL PAUL W
IPC分类号： H04Q1/06 , H04Q1/14 , H05K1/02 , H04Q1/10 , H04M11/06 , H05K7/00
CPC分类号： H05K1/0216 , H04Q1/06 , H04Q1/14 , H04Q2201/10 , H04Q2201/12 , H04Q2201/14 , H05K2201/044 , H05K2201/0723 , H05K2201/09336
摘要： A telecommunications device including a plurality of splitter cards (55) mounted in a chassis (52). The device also includes a circuit board (68) and plurality of card edge connectors (96) for providing electrical connections between the splitter cards and the circuit board. The device further includes POTS connectors, LINE connectors and DATA connectors. The circuit board includes a first layer having first tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; a second layer having second tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; and a third layer having third tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors. The second layer is positioned between the first and third layers. A majority of the second layer is covered by a grounding plane. The grounding plane and the second tracings are co-planar such that the grounding plane adds no additional thickness to the second layer. The grounding plane is positioned between the first and third tracings to reduce cross-talk between the first and third tracings.
摘要翻译：一种电信设备，包括安装在底盘（52）中的多个分配卡（55）。该装置还包括电路板（68）和用于提供分配卡和电路板之间的电连接的多个卡缘连接器（96）。该设备还包括POTS连接器，LINE连接器和DATA连接器。电路板包括具有第一跟踪的第一层，其将POTS，LINE或DATA连接器中的至少一个的触点电连接到至少一个卡缘连接器; 具有将POTS，LINE或DATA连接器中的至少一个的触点电连接到至少一个卡缘连接器的第二跟踪的第二层; 以及第三层，其具有将POTS，LINE或DATA连接器中的至少一个的触点电连接到所述卡缘连接器中的至少一个的第三跟踪。第二层位于第一层和第三层之间。大多数第二层被接地平面覆盖。接地平面和第二跟踪是共平面的，使得接地平面不向第二层增加额外的厚度。接地平面位于第一和第三迹线之间，以减少第一和第三迹线之间的串扰。

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