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    • 2. 发明申请
    • ALUMINUM EMI / RF SHIELD WITH FINS
    • 铝箔EMI / RF屏蔽与FINS
    • WO2017106242A1
    • 2017-06-22
    • PCT/US2016/066479
    • 2016-12-14
    • A.K. STAMPING COMPANY, INC.
    • KURZ, AthurSCHNEIDER, MichaelBARRY, Bret
    • H05K9/00H05K7/20
    • H05K9/0032H01L23/3672H01L23/3675H01L23/60H05K7/20418
    • A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for electronic components on a circuit board comprising a base having an upper surface and one or more sidewalls extending from a perimeter of the upper surface, the sidewalls configured to engage a fence of the circuit board, and a fin array attached to the upper surface of the base, the fin array having a plurality of stackable fins, each of the stackable fins having a wall and one or more engagement tabs extending from one or more edges of the wall, the engagement tabs interlocking the plurality of stackable fins together.
    • 由铝(AL)制成的屏蔽层或涂覆有诸如镍或锡之类的可焊接电镀层的铝基合金提供了对现有屏蔽材料的热改善。 电路板上的电子组件的屏蔽,包括:基座,具有上表面和从上表面的周边延伸的一个或多个侧壁,侧壁配置成接合电路板的栅栏;翅片阵列,附接到上 翅片阵列具有多个可堆叠翅片,每个可叠置翅片具有壁以及从壁的一个或多个边缘延伸的一个或多个接合片,接合片将多个可堆叠翅片互锁在一起。