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    • 1. 发明申请
    • THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE COMPRISING ANISOTROPIC BORON NITRIDE AGGLOMERATES
    • 包含各向异性硼氮化物集合体的热传导型压敏粘合剂
    • WO2017105921A1
    • 2017-06-22
    • PCT/US2016/065103
    • 2016-12-06
    • 3M INNOVATIVE PROPERTIES COMPANY
    • WIENEKE, Jan U.RIEDER-OTTERBURG, Susanne H.KAYSER, ArminUIBEL, Krishna B.ENGLER, MartinSCHÄDEL, Robert M.YAMABE, Takujiro
    • C08K3/38C09J11/04C09J133/02
    • C09J133/02C08K3/38C08K2003/385C09J9/00C09J11/04
    • The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d 50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d 50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii. (optionally), free hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 50 micrometer; and wherein the content of the boron nitride mixture composition is greater than 15 vol%, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.
    • 本公开涉及一种导热性压敏粘合剂组合物,其包含:a)丙烯酸类聚合物组分; 和b)氮化硼混合物组合物,其包含:i。 包含六方氮化硼初级颗粒的各向异性氮化硼团聚体,其中所述六方氮化硼初级颗粒具有1至50微米的平均初级粒径d 50,其中所述各向异性氮化硼团聚体具有平均团聚体 尺寸d 50包括在50和250微米之间并且纵横比大于1.5,并且其中当根据测试测量时,各向异性氮化硼团聚体的包络密度大于1g / cm 3δ 方法在实验部分描述; 和ii。 (任选地)具有3至50微米的平均一次粒径d50的游离六方氮化硼一次粒子; 并且其中基于所述导热压敏粘合剂组合物的体积,所述氮化硼混合物组合物的含量大于15体积%。 本公开还涉及制造这种导热压敏粘合剂的方法及其用途。