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    • 1. 发明申请
    • THIN FILM DEVICE HAVING COATING FILM, LIQUID CRYSTAL PANEL, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE THIN FILM DEVICE
    • 具有涂膜,薄膜晶体管,电子设备的薄膜装置和制造薄膜装置的方法
    • WO1997043689A1
    • 1997-11-20
    • PCT/JP1997001618
    • 1997-05-14
    • SEIKO EPSON CORPORATIONYUDASAKA, IchioSHIMODA, TatsuyaKANBE, SadaoMIYAZAWA, Wakao
    • SEIKO EPSON CORPORATION
    • G02F01/136
    • G02F1/136227H01L27/12H01L27/1285H01L27/1292H01L29/66757H01L29/66765Y10T428/1064Y10T428/31663
    • Liquid is applied and subjected to a heat treatment to form one thin film among an insulating thin film, a silicon thin film and a conductive thin film constituting a TFT. A substrate is spin-coated with the liquid which contains a thin film component and is supplied from the coating liquid storing part (105) of a spin-coater (102). The substrate to which the coating liquid is applied is subjected to a heat treatment by a heat treatment unit (103) to form a coating film on the substrate. If, further, the coating film is subjected to laser annealing, etc., one of the film qualities, crystallinity, denseness and adhesion is improved. If the coating liquid or resist is applied by an ink-jet method, the utilization efficiency of coating liquid can be improved and, further, a patterned coating film can be formed. A thin film device which is low in cost and has a high throughput can be obtained. By manufacturing TFTs with a manufacturing apparatus having the high utilization efficiency of the coating liquid, the initial investment and the cost of a liquid crystal display are significantly reduced.
    • 施加液体并进行热处理以在构成TFT的绝缘薄膜,硅薄膜和导电薄膜中形成一个薄膜。 用包含薄膜成分的液体旋涂基材,并从旋转涂布机(102)的涂液储存部(105)供给基材。 涂布涂布液的基板通过热处理单元(103)进行热处理,以在基板上形成涂膜。 此外,如果涂膜经受激光退火等,则膜质量,结晶度,致密性和粘附性之一得到改善。 如果通过喷墨法涂布涂布液或抗蚀剂,则可以提高涂布液的利用效率,并且还可以形成图案化的涂膜。 可以获得成本低且吞吐量高的薄膜器件。 通过制造具有涂布液利用率高的制造装置的TFT,液晶显示器的初始投入和成本显着降低。
    • 5. 发明申请
    • ACTIVE MATRIX SUBSTRATE AND THIN FILM TRANSISTOR, AND METHOD OF ITS MANUFACTURE
    • 有源矩阵基板和薄膜晶体管及其制造方法
    • WO1994018706A1
    • 1994-08-18
    • PCT/JP1994000189
    • 1994-02-09
    • SEIKO EPSON CORPORATIONYUDASAKA, IchioMATSUO, MinoruTAKENAKA, Satoshi
    • SEIKO EPSON CORPORATION
    • H01L29/784
    • G02F1/13454H01L21/2236H01L21/3003H01L27/1251H01L27/127H01L29/66757H01L29/78618H01L29/78621
    • In forming a thin film transistor (620) whose OFF-current characteristics are improved, the source and drain regions (602 and 603) of low impurity concentration are formed. In this process, all the ions (indicated by arrow Ion-1) of around 80 keV energy produced from a mixed gas (doping gas) containing 5 % PH3 and the rest of H2 gas, are implanted into a polycrystalline silicon film (604) so that the concentration of impurities in a range of 3 x 10 /cm to 1 x 10 /cm in terms of P ions. Then all the ions (indicated by arrow Ion-2) of about 20 keV energy produced from a doping gas of pure hydrogen are implanted into a low concentration region (604a) so that the concentration of impurities is in a range of 1 x 10 /cm to 1 x 10 /cm in terms of H ions. After that, the impurities are activated by thermally treating the low concentration region (604a) in a nitrogen atmosphere at a temperature of approximately 300 DEG C for approximately one hour.
    • 在形成截止电流特性提高的薄膜晶体管(620)的场合,形成低杂质浓度的源区(602,603)。 在该过程中,将由含有5%PH 3和其余H 2气体的混合气体(掺杂气体)产生的约80keV能量的所有离子(由箭头Ion-1表示)注入到多晶硅膜(604)中, 使得以P +换算为3×10 13 / cm 2至1×10 14 / cm 2范围内的杂质浓度。 然后将由纯氢的掺杂气体产生的约20keV能量的所有离子(由箭头Ion-2表示)注入到低浓度区域(604a)中,使得杂质浓度在1×10 5 14> / cm 2至1×10 15 / cm 2。 之后,通过在约300℃的氮气气氛中热处理低浓度区域(604a)约1小时使杂质活化。