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    • 1. 发明申请
    • POWER MODULE PRODUCTION METHOD, AND POWER MODULE PRODUCED THEREBY
    • 电源模块生产方法及其生产的电源模块
    • WO2011086641A1
    • 2011-07-21
    • PCT/JP2010/007356
    • 2010-12-20
    • TOYOTA JIDOSHA KABUSHIKI KAISHAYOSHIDA, Yuji
    • YOSHIDA, Yuji
    • H01L23/373H05K7/20
    • H05K7/209H01L23/24H01L23/3735H01L23/42H01L2224/48091H01L2224/73265H01L2224/92247H05K7/20472Y10T29/49002Y10T29/49117Y10T29/49124Y10T29/4913Y10T29/49144H01L2924/00014
    • There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat sink block 3, and a semiconductor chip 2, wherein a first insulating resin sheet 41, which forms a lower layer of the insulating resin sheet 4, is first bonded to the cooler 5 by thermal compression. Next, with a second insulating resin sheet 42, which forms an upper layer of the insulating resin sheet 4, interposed between the first insulating resin sheet 41 and the heat sink block 3, the second insulating resin sheet 42 is bonded to the first insulating resin sheet 41 by thermal compression, and the heat sink block 3 is bonded to the second insulating resin sheet 42 by thermal compression. The semiconductor chip 2 is then soldered onto the heat sink block 3. Thus, bonding defects at the respective bonding interfaces are prevented, and dielectric breakdown of the insulating resin sheet 4 is prevented.
    • 提供了能够稳定地生产具有高度可靠性能的功率模块等的功率模块制造方法。 功率模块制造方法通过堆叠冷却器5,绝缘树脂片4,散热块3和半导体芯片2来生成功率模块1,其中形成绝缘的下层的第一绝缘树脂片41 树脂片4首先通过热压接而与冷却器5接合。 接着,在形成绝缘树脂片4的上层的第二绝缘树脂片42插入在第一绝缘树脂片41和散热块3之间,第二绝缘树脂片42与第一绝缘树脂 片材41通过热压缩,并且散热块3通过热压接接合到第二绝缘树脂片42。 然后将半导体芯片2焊接到散热块3上。因此,防止了在各个接合界面处的接合缺陷,并且防止了绝缘树脂片4的绝缘击穿。