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1. 发明申请

WO2011139308A1 VARIABLE ELECTRIC FIELD STRENGTH METAL AND METAL OXIDE MICROPLASMA LAMPS AND FABRICATION 审中-公开
标题翻译：可变电场强度金属和金属氧化物微波炉和制造
公开(公告)号：WO2011139308A1
公开(公告)日：2011-11-10
申请号：PCT/US2010/060759
申请日：2010-12-16
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-jin , READLE, Jason, D. , YOON, Jekwon , PRICE, Andrew , PUTNEY, Jeffrey
发明人： EDEN, J., Gary , PARK, Sung-jin , READLE, Jason, D. , YOON, Jekwon , PRICE, Andrew , PUTNEY, Jeffrey
IPC分类号： H01J17/49 , H01J61/02
CPC分类号： H01J17/49 , H01J17/16 , H01J65/046
摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers (13a, 13b, 13c, 13d, 13e) defining a plurality of arrays of microcavities (12) and encapsulated thin metal electrodes. Packaging (20) encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E /p ) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
摘要翻译：本发明的优选实施例提供了具有限定多个微腔阵列（12）和封装的薄金属电极的多个金属和金属氧化物层（13a，13b，13c，13d，13e）的微腔等离子体灯。包装（20）在等离子体介质中包围多个金属和金属氧化物层。金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

2. 发明申请

WO2012015943A3 ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICES, ARRAYS AND FABRICATION METHODS 审中-公开
标题翻译：包封的金属微型微器械装置，阵列和制造方法
公开(公告)号：WO2012015943A3
公开(公告)日：2012-04-05
申请号：PCT/US2011045564
申请日：2011-07-27
申请人： UNIV ILLINOIS , EDEN J GARY , PARK SUNG-JIN , YOON JEKWON , CHUNG BRIAN
发明人： EDEN J GARY , PARK SUNG-JIN , YOON JEKWON , CHUNG BRIAN
IPC分类号： H05H1/24 , B01D53/00 , C01B13/11 , C02F1/48
CPC分类号： H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip ( 12a, 50a) opposing a second metal microtip ( 12b, 50b) with a gap ( 16, 48) therebetween. The first and second metal microtips are encapsulated in metal oxide ( 14) that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays (62, 64, 66, 86, 92, 100) can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
摘要翻译：本发明的一个实施方案是具有与第二金属微尖端（12b，50b）相对并在其间具有间隙（16,48）的第一金属微尖端（12a，50a）的微尖端微等质力装置。第一和第二金属微尖端封装在金属氧化物（14）中，该金属氧化物电隔离并物理连接第一和第二金属微尖端。在优选的装置中，第一和第二金属微尖端和金属氧化物构成整体式单一结构。阵列（62,64,66,86,92,100）可以是柔性的，可以堆叠排列，并且可以形成为圆柱体，例如用于气体和液体处理装置，空气过滤器和其他应用。形成微尖端微等离子体装置阵列的优选方法提供了其中具有微孔开口阵列的金属网。金属网的电极区域被掩蔽，留下未被掩蔽的金属网的规划连接金属氧化物区域。电化学蚀刻计划连接的金属氧化物区域以将所计划的连接金属氧化物区域转换为金属氧化物，其中封装相对的金属微尖端。面具被删除。对电极区域进行电化学蚀刻以将电极区域封装在金属氧化物中。

3. 发明申请

WO2012015943A2 ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICES, ARRAYS AND FABRICATION METHODS 审中-公开
标题翻译：包埋金属微孔微波器件，阵列和制造方法
公开(公告)号：WO2012015943A2
公开(公告)日：2012-02-02
申请号：PCT/US2011/045564
申请日：2011-07-27
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , EDEN, J., Gary , PARK, Sung-Jin , YOON, JeKwon , CHUNG, Brian
发明人： EDEN, J., Gary , PARK, Sung-Jin , YOON, JeKwon , CHUNG, Brian
IPC分类号： H05H1/24 , B01D53/00 , C02F1/48 , C01B13/11
CPC分类号： H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip ( 12a, 50a) opposing a second metal microtip ( 12b, 50b) with a gap ( 16, 48) therebetween. The first and second metal microtips are encapsulated in metal oxide ( 14) that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays (62, 64, 66, 86, 92, 100) can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
摘要翻译：本发明的一个实施方案是具有与第二金属微尖端（12b，50b）相对的第一金属微尖端（12a，50a）的微尖端微型装置，其间具有间隙（16,48）。第一和第二金属微尖端被封装在金属氧化物（14）中，其电隔离并物理地连接第一和第二金属微尖端。在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。阵列（62,64,66,86,92,100）可以是柔性的，可以以堆叠方式布置，并且可以形成为气瓶，例如用于气体和液体处理装置，空气过滤器和其它应用。形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。去除面具。电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

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