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1. 发明申请

WO2004106945A3 ELECTRONIC COMPONENT TESTING APPARATUS 审中-公开
标题翻译：电子元件测试设备
公开(公告)号：WO2004106945A3
公开(公告)日：2005-02-17
申请号：PCT/JP2004007363
申请日：2004-05-28
申请人： ADVANTEST CORP , ITO AKIHIKO , YAMASHITA KAZUYUKI
发明人： ITO AKIHIKO , YAMASHITA KAZUYUKI
IPC分类号： G01R31/28 , G01R31/26
CPC分类号： G01R31/2891 , G01R31/2887 , G11C29/56016
摘要： An electronic component testing apparatus where a test is performed by pressing an input/output terminal (HB) of an IC chip (IC) to a contact portion of a test head. The testing apparatus has an IC moving device (410) for holding and moving the IC chip (IC) held by a holding portion (414) at its front face to which the input/output terminal (HB) is led and exposed, a first camera (415) for imaging the front face of the IC chip (IC) before it is held by the IC moving device (410), a second camera (420) for imaging the rear face of the IC chip (IC) held by the IC moving device (410), and an image processing device calculating the position of the input/output terminal (HB) of the IC chip (IC) held by the IC moving device (410) and specifying based on the calculated result the relative position of the input/output terminal (HB) of the IC chip (IC), held by the IC moving device (410), to the contact portion. The IC moving device (410) corrects the position of the IC chip based on the relative position specified by the image processing device.
摘要翻译：一种电子部件测试装置，其中通过将IC芯片（IC）的输入/输出端子（HB）按压到测试头的接触部分进行测试。测试装置具有用于保持和移动由保持部分（414）保持的IC芯片（IC）的IC移动装置（410），其前端面与输入/输出端子（HB）被引导和暴露，第一用于在被IC移动装置（410）保持之前对IC芯片（IC）的前表面进行成像的相机（415）;用于对由IC移动装置（410）保持的IC芯片（IC）的背面进行成像的第二相机 IC移动装置（410），以及计算由IC移动装置（410）保持的IC芯片（IC）的输入输出端子（HB）的位置的图像处理装置，并根据计算结果指定相对位置由IC移动装置（410）保持的IC芯片（IC）的输入/输出端子（HB）连接到接触部分。 IC移动装置（410）根据由图像处理装置指定的相对位置校正IC芯片的位置。

2. 发明申请

WO1997017619A1 IC CONVEYOR, IC POSTURE CHANGER AND IC TAKEOUT APPARATUS 审中-公开
标题翻译： IC输送机，IC更换器和IC采购设备
公开(公告)号：WO1997017619A1
公开(公告)日：1997-05-15
申请号：PCT/JP1995002393
申请日：1995-11-24
申请人： ADVANTEST CORPORATION , WATANABE, Yutaka , OKUDA, Hiroshi , YAMASHITA, Kazuyuki , SAGAWA, Makoto , NAKAJIMA, Haruki , KAWANO, Shigenori
发明人： ADVANTEST CORPORATION
IPC分类号： G01R31/26
CPC分类号： G01R31/2851 , G01R31/01 , G01R31/2893 , G01R31/31903 , Y10T29/49124 , Y10T29/53191
摘要： A semiconductor device transfer system used in a semiconductor tester of a tray-magazine type, which comprises a semiconductor device conveyor and a device for changing the attitude of devices being conveyed. The semiconductor devices are loaded into a horizontal testing tray from a magazine which is supported obliquely to feed them by gravity. The inclined semiconductor devices from the magazine are turned to be horizontal by means of a rail extending gently downward and ending in horizontal state, or a movable rail which rotates in a horizontal direction after receiving inclined semiconductor devices, or a rotary arm which holds inclined semiconductor devices and puts them in horizontal state while turning 180 DEG .
摘要翻译：一种用于托盘型半导体测试器的半导体器件传输系统，其包括半导体器件输送器和用于改变被传送器件的姿态的器件。将半导体器件从倾斜地支撑的料仓装载到水平测试托盘中，以通过重力进给它们。来自盒体的倾斜半导体器件通过轻轻地向下延伸并且以水平状态结束的轨道被转动成水平的，或者在接收倾斜的半导体器件之后沿水平方向旋转的活动导轨或者保持倾斜半导体的旋转臂装置，并将其置于水平状态，同时转动180度。

3. 发明申请

WO2004106944A3 ELECTRONIC PART TEST DEVICE 审中-公开
标题翻译：电子部件测试装置
公开(公告)号：WO2004106944A3
公开(公告)日：2005-02-17
申请号：PCT/JP2004007362
申请日：2004-05-28
申请人： ADVANTEST CORP , YAMASHITA KAZUYUKI , ITO AKIHIKO
发明人： YAMASHITA KAZUYUKI , ITO AKIHIKO
IPC分类号： G01R31/28 , G01R31/26
CPC分类号： G01R31/2893 , G01R31/2886 , G01R31/2887
摘要： There is provided an electronic part test device for performing a test by pressing an I/O terminal (HB) of an IC chip (IC) against a contact section (151) of a test head (150). The electronic part test device includes a test plate (110) holding a holding section (113) in a rockable way in a test plate main body (111). The holding section (113) holds a rear surface of the IC chip (IC) where no I/O terminal (HB) is lead out, on a substantially flat holding surface (114) greater than the rear surface. During a test, the side surface (113b) of the holding section (113) is guided onto a guide surface (153) arranged around the contact section (151) while the IC chip (IC) held in the holding section (113) is pressed against the contact pin of the contact section.
摘要翻译：提供了一种用于通过将IC芯片（IC）的I / O端子（HB）压靠在测试头（150）的接触部分（151）上来进行测试的电子部件测试装置。电子部件测试装置包括在测试板主体（111）中以可摇摆的方式保持保持部（113）的测试板（110）。保持部（113）将没有I / O端子（HB）引出的IC芯片（IC）的背面保持在大于后表面的大致平坦的保持面（114）上。在试验中，保持部（113）的侧面（113b）被引导到设置在接触部（151）周围的引导面（153）上，而保持在保持部（113）的IC芯片（IC）为压靠接触部分的接触销。

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