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    • 3. 发明申请
    • BEZEL PACKAGING OF FRIT-SEALED OLED DEVICES
    • BEZEL包装封闭的OLED器件
    • WO2008057143A1
    • 2008-05-15
    • PCT/US2007/011389
    • 2007-05-11
    • CORNING INCORPORATEDBAYNE, John, F.WESTBROOK, Jamie, T.WIDAJA, Sujanto
    • BAYNE, John, F.WESTBROOK, Jamie, T.WIDAJA, Sujanto
    • B65D81/05B65D85/48C03C27/04H01L51/52
    • B65D81/05C03C27/048H01L51/5237
    • Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.
    • 方法和组件涉及密封玻璃组件的边框包装,例如玻璃料密封的OLED装置。 表圈包装包括施加在密封玻璃组件和表圈之间的低弹性材料材料的减震中间层。 可以包括低弹性模量材料和/或单独的粘合材料的粘合剂将密封的玻璃组合件固定在边框上。 可以进行挡板修改以使挡板稳定。 示例性的边框修改包括加强的边框侧壁和附接在边框壁之间的支撑带。 边框设计可以包括密封玻璃组件的边缘与边框壁之间的间隙,以避免与其直接接触。 间隙可以至少部分地由低弹性有机粘合剂填充以提供额外的冲击吸收性。 低弹性材料材料可以包括泡沫,陶瓷纤维布和/或低弹性聚合物有机涂层。