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1. 发明申请

WO2004022351A2 METHOD AND APPARATUS FOR RELEASING MATERIALS FROM STENCILS 审中-公开
标题翻译：用于从材料中释放材料的方法和设备
公开(公告)号：WO2004022351A2
公开(公告)日：2004-03-18
申请号：PCT/US2003/027149
申请日：2003-08-27
申请人： SPEEDLINE TECHNOLOGIES, INC. , VAN-DIEP, Gerald, Pham , ANDRES, Frank
发明人： VAN-DIEP, Gerald, Pham , ANDRES, Frank
IPC分类号： B41M
CPC分类号： H05K3/1233 , B41L13/02 , H05K2203/0285 , H05K2203/0292
摘要： An apparatus and method for depositing material on a surface of an electronic substrate includes a frame, a substrate support coupled to the frame to support the electronic substrate, a stencil coupled to the frame having at least one aperture to receive a material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of material on the substrates, and a vibration system, coupled to one of the stencil, the frame and the substrate support, and coupled to the controller, that introduces a vibration to the stencil, wherein the vibration has a frequency controlled by the controller based on characteristics of at least one of the material, the stencil and the electronic substrate. Release of material from the apertures is accomplished while the vibration is applied to the stencil.
摘要翻译：用于在电子基板的表面上沉积材料的设备和方法包括框架，耦合到框架以支撑电子基板的基板支撑件，耦合到框架的模板具有至少一个孔通过孔将沉积材料接收到电子基板的表面上;控制器，控制基板上材料的分配;以及振动系统，与模板，框架和基板支撑件中的一个耦合，传送给控制器，该控制器向模板引入振动，其中振动具有由控制器基于材料，模板和电子基板中的至少一个的特性控制的频率。当振动施加到模板上时，从孔中释放材料。

2. 发明申请

WO2004022351A3 METHOD AND APPARATUS FOR RELEASING MATERIALS FROM STENCILS 审中-公开
标题翻译：用于从茎上释放材料的方法和装置
公开(公告)号：WO2004022351A3
公开(公告)日：2004-07-29
申请号：PCT/US0327149
申请日：2003-08-27
申请人： SPEEDLINE TECHNOLOGIES INC , VAN-DIEP GERALD PHAM , ANDRES FRANK
发明人： VAN-DIEP GERALD PHAM , ANDRES FRANK
IPC分类号： B41L13/02 , H05K3/12 , B41L13/18
CPC分类号： H05K3/1233 , B41L13/02 , H05K2203/0285 , H05K2203/0292
摘要： An apparatus and method for depositing material on a surface of an electronic substrate includes a frame, a substrate support coupled to the frame to support the electronic substrate, a stencil coupled to the frame having at least one aperture to receive a material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of material on the substrates, and a vibration system, coupled to one of the stencil, the frame and the substrate support, and coupled to the controller, that introduces a vibration to the stencil, wherein the vibration has a frequency controlled by the controller based on characteristics of at least one of the material, the stencil and the electronic substrate. Release of material from the apertures is accomplished while the vibration is applied to the stencil.
摘要翻译：用于在电子基板的表面上沉积材料的装置和方法包括框架，耦合到框架以支撑电子基板的基板支撑件，耦合到框架的模板具有至少一个孔以接收要沉积的材料电子基板的表面上的孔径，控制基板上的材料分配的控制器和耦合到模板，框架和基板支撑件之一并耦合到控制器的振动系统，其引入振动其中所述振动具有基于所述材料，所述模板和所述电子基板中的至少一个的特性由所述控制器控制的频率。当将振动施加到模板时，实现从孔中释放材料。

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