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1. 发明申请

WO2009037655A2 PRODUCTION OF PRE-COLLAPSED CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS AND APPLICATIONS THEREOF 审中-公开
标题翻译：预拉伸电容式微机超声波传感器的生产及其应用
公开(公告)号：WO2009037655A2
公开(公告)日：2009-03-26
申请号：PCT/IB2008/053778
申请日：2008-09-17
申请人： KONINKLIJKE PHILIPS ELECTRONICS, N.V. , U.S. PHILIPS CORPORATION , DIRKSEN, Peter , VAN DER LUGT, Anthonie
发明人： DIRKSEN, Peter , VAN DER LUGT, Anthonie
CPC分类号： B06B1/0292 , A61B8/00 , H04R19/005 , Y10T29/43 , Y10T29/49005 , Y10T29/4908
摘要： Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g., ultrasound transducer-based applications, catheter-based applications, needle-based applications and flowmeter applications.
摘要翻译：提供了用于生产预塌陷电容式微加工超声波换能器（cMUT）的方法。所公开的方法通常包括以下步骤：在蚀刻和密封膜之前获得几乎完成的传统cMUT结构，通过cMUT结构的膜定义孔，用于相对于膜的顶面固定的每个电极环，施加偏压 cMUT结构的膜和基底，以便将膜的靠近孔的区域折叠到基底或朝向基底，通过施加包封层将膜的折叠区域固定和密封到基底，并且中断或者减少偏压。提供CMUT组件，包括封装组件，具有集成电路/芯片（例如，光束转向芯片）和cMUT /透镜组件的集成组件。还提供了利用所公开的预塌陷cMUT的有利的基于cMUT的应用，例如基于超声换能器的应用，基于导管的应用，基于针的应用和流量计应用。

2. 发明申请

WO2009037655A3 PRODUCTION OF PRE-COLLAPSED CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS AND APPLICATIONS THEREOF 审中-公开
标题翻译：预拉伸电容式微机超声波传感器的生产及其应用
公开(公告)号：WO2009037655A3
公开(公告)日：2010-07-01
申请号：PCT/IB2008053778
申请日：2008-09-17
申请人： KONINKL PHILIPS ELECTRONICS NV , PHILIPS CORP , DIRKSEN PETER , VAN DER LUGT ANTHONIE
发明人： DIRKSEN PETER , VAN DER LUGT ANTHONIE
IPC分类号： A61B8/00 , B06B1/02
CPC分类号： B06B1/0292 , A61B8/00 , H04R19/005 , Y10T29/43 , Y10T29/49005 , Y10T29/4908
摘要： Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g., ultrasound transducer-based applications, catheter-based applications, needle-based applications and flowmeter applications.
摘要翻译：提供了用于生产预塌陷电容式微加工超声波换能器（cMUT）的方法。所公开的方法通常包括以下步骤：在蚀刻和密封膜之前获得几乎完成的传统cMUT结构，通过cMUT结构的膜定义孔，用于相对于膜的顶面固定的每个电极环，施加偏压 cMUT结构的膜和基底，以便将膜的靠近孔的区域折叠到基底或朝向基底，通过施加包封层将膜的折叠区域固定和密封到基底，并且中断或者减少偏压。提供CMUT组件，包括封装组件，具有集成电路/芯片（例如，光束转向芯片）和cMUT /透镜组件的集成组件。还提供了利用所公开的预塌陷cMUT的有利的基于cMUT的应用，例如基于超声换能器的应用，基于导管的应用，基于针的应用和流量计应用。

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