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    • 1. 发明申请
    • INTEGRATED CIRCUIT CHIP CARD AND THE METHOD AND SYSTEM FOR THE MANUFACTURE OF SAME
    • 集成电路芯片卡及其制造方法与系统
    • WO1997003466A1
    • 1997-01-30
    • PCT/US1996012009
    • 1996-07-05
    • RAND McNALLY & COMPANYBREEN, Thomas, J.TAYLOR, Charles, W.
    • RAND McNALLY & COMPANY
    • H01L23/02
    • G06K19/07718G06K19/07745H01L2924/0002H01L2924/00
    • An integrated circuit chip card made by a plurality of lamina (11, 12, 13) and forming a chip module cavity (15) complementarily-shaped to the sides of the contact stratum of a chip module (14) for achieving a nested relation. A method and system of manufacturing an integrated circuit chip wherein one of said webs (A, B, C) forming the lamina (11, 12, 13) may be processed in parallel and wherein one of said webs has integrated chip modules (14) premounted thereon for subsequent lamination with the other webs (A, B, C), and wherein the registration of the webs (A, B, C) and seating of the integrated circuit chip module (14) within a cavity (15) occurs at substantially the same time, and while chemical bonding media therebetween remains fluid and open. The cards may be cut from the laminate while the chemical bond is not yet cured.
    • 一种由多个层片(11,12,13)制成的集成电路芯片卡片,并形成一个芯片模块腔体(15),该芯片模块腔体互补地形成在芯片模块(14)的接触层的侧面上,以实现嵌套关系。 一种制造集成电路芯片的方法和系统,其中形成薄片(11,12,13)的所述腹板(A,B,C)中的一个可以并行加工,并且其中一个所述腹板具有集成芯片模块(14) 预先安装在其上用于随后与其它腹板(A,B,C)层压,并且其中腹板(A,B,C)的对准和集成电路芯片模块(14)在腔(15)内的安置位于 基本相同的时间,并且当它们之间的化学粘合介质保持流体和打开时。 这些卡可以从层压板切割而化学键尚未固化。