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    • 1. 发明申请
    • PROCESS FOR PRODUCING A NON-VOLATILE MEMORY CELL
    • 处理对非易失性存储单元
    • WO1997006559A2
    • 1997-02-20
    • PCT/DE1996001477
    • 1996-08-07
    • SIEMENS AKTIENGESELLSCHAFTPLASA, Gunther
    • SIEMENS AKTIENGESELLSCHAFT
    • H01L21/8247
    • H01L27/11521H01L29/66825
    • A process for producing a non-volatile memory cell is disclosed. The desired polysilicon structure is masked by an oxidation-inhibiting layer, preferably a nitride layer. The polysilicon above the source/drain regions and field effect regions is then converted into silicon dioxide. The interval between adjacent polysilicon paths is thus filled with silicon dioxide. The conversion of polysilicon also increases the field oxide thickness in the field effect regions. A second polysilicon layer is applied on a field effect region so as to include the oxidation-inhibiting layer located therein, and one capacitor electrode is formed therefrom by masking and etching. The first polysilicon layer below the oxidation-inhibiting layer forms the other capacitor electrode and the oxidation-inhibiting layer forms the dielectric. The advantages of the invention consist in a less complex masking and etching technique and in an improved reliability of the components.
    • 将描述用于非易失性存储单元的制造方法。 所需的多晶硅结构由抗氧化层,优选掩蔽的氮化物形成。 随后,在多晶硅在源/漏区和场区的转化中二氧化硅被执行。 相邻的多晶硅轨道之间,同时用二氧化硅填充发生。 另外,在字段区,场氧化物厚度增加了多晶硅的转换。 在字段区域,第二多晶硅层被施加,包括本有氧化抑制层。 通过标记和蚀刻产生从中电容器的电极,来其中所述第一多晶硅的氧化抑制层,另一电极和所述氧化抑制层形成介电底层。 本发明的优点是在较不复杂的掩模和蚀刻技术和改进的器件的可靠性。
    • 4. 发明申请
    • PROCESS FOR PRODUCING A NON-VOLATILE MEMORY CELL
    • 生产非挥发性记忆细胞的方法
    • WO9706559A3
    • 1997-03-20
    • PCT/DE9601477
    • 1996-08-07
    • SIEMENS AGPLASA GUNTHER
    • PLASA GUNTHER
    • H01L21/336H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11521H01L29/66825
    • A process for producing a non-volatile memory cell is disclosed. The desired polysilicon structure is masked by an oxidation-inhibiting layer, preferably a nitride layer. The polysilicon above the source/drain regions and field effect regions is then converted into silicon dioxide. The interval between adjacent polysilicon paths is thus filled with silicon dioxide. The conversion of polysilicon also increases the field oxide thickness in the field effect regions. A second polysilicon layer is applied on a field effect region so as to include the oxidation-inhibiting layer located therein, and one capacitor electrode is formed therefrom by masking and etching. The first polysilicon layer below the oxidation-inhibiting layer forms the other capacitor electrode and the oxidation-inhibiting layer forms the dielectric. The advantages of the invention consist in a less complex masking and etching technique and in an improved reliability of the components.
    • 一种用于制造存储单元的方法包括用氧化抑制层(优选氮化物层)掩蔽期望的多晶硅结构。 然后将源极/漏极区域和场区域上的多晶硅转化为二氧化硅。 同时,在相邻的多晶硅路径之间进行填充二氧化硅。 通过场区域中的多晶硅的转化也增加了场氧化物厚度。 在场区域上施加第二多晶硅层,其中存在氧化抑制层。 通过使用标记和蚀刻从而产生电容器的一个电极,其中位于氧化抑制层下方的第一多晶硅形成另一电极,氧化抑制层形成电介质。 该结构提供了较不复杂的掩模和蚀刻技术以及提高部件的可靠性。