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1. 发明申请

WO2010138811A2 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AT HIGH TEMPERATURES AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 审中-公开
标题翻译：在高温下提供柔性半导体器件的方法及其柔性半导体器件
公开(公告)号：WO2010138811A2
公开(公告)日：2010-12-02
申请号：PCT/US2010/036569
申请日：2010-05-28
申请人： ARIZONA BOARD OF REGENTS, FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , O'ROURKE, Shawn , MOYER, Curtis , AGENO, Scott , BOTTESCH, Dirk , O'BRIEN, Barry , MARRS, Michael
发明人： O'ROURKE, Shawn , MOYER, Curtis , AGENO, Scott , BOTTESCH, Dirk , O'BRIEN, Barry , MARRS, Michael
IPC分类号： H01L21/20
CPC分类号： H01L21/6835 , H01L29/66765 , H01L29/78603 , H01L2221/6835 , H01L2924/3025 , H05K1/0393 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/068
摘要： Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 1800C; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
摘要翻译：一些实施例包括提供半导体器件的方法。该方法可以包括：（a）提供柔性基底; （b）在所述柔性基底上沉积至少一层材料，其中所述至少一层材料层在所述柔性基底上的沉积在至少180℃的温度下发生; 和（c）在金属层和a-Si层之间提供扩散阻挡层。在本申请中公开了其它实施例。

2. 发明申请

WO2010051106A3 METHODS FOR ATTACHING FLEXIBLE SUBSTRATES TO RIGID CARRIERS AND RESULTING DEVICES 审中-公开
公开(公告)号：WO2010051106A3
公开(公告)日：2010-05-06
申请号：PCT/US2009/056501
申请日：2009-09-10
申请人： ARIZONA BOARD OF REGENTS, A BODY CORPORATE ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , LOY, Douglas, E. , O'ROURKE, Shawn, M.
发明人： LOY, Douglas, E. , O'ROURKE, Shawn, M.
IPC分类号： H01L21/68
摘要： Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219 °C and 1000 °C and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.

3. 发明申请

WO2010138811A3 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AT HIGH TEMPERATURES AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 审中-公开
标题翻译：在高温下提供柔性半导体器件的方法及其柔性半导体器件
公开(公告)号：WO2010138811A3
公开(公告)日：2011-03-03
申请号：PCT/US2010036569
申请日：2010-05-28
申请人： UNIV ARIZONA , O'ROURKE SHAWN , MOYER CURTIS , AGENO SCOTT , BOTTESCH DIRK , O'BRIEN BARRY , MARRS MICHAEL
发明人： O'ROURKE SHAWN , MOYER CURTIS , AGENO SCOTT , BOTTESCH DIRK , O'BRIEN BARRY , MARRS MICHAEL
IPC分类号： H01L21/20
CPC分类号： H01L21/6835 , H01L29/66765 , H01L29/78603 , H01L2221/6835 , H01L2924/3025 , H05K1/0393 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/068
摘要： Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180°C; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
摘要翻译：一些实施例包括提供半导体器件的方法。该方法可以包括：（a）提供柔性基底; （b）在所述柔性基底上沉积至少一层材料，其中所述至少一层材料在所述柔性基底上的沉积在至少180℃的温度下发生; 和（c）在金属层和a-Si层之间提供扩散阻挡层。在本申请中公开了其它实施例。

4. 发明申请

WO2008089401A9 FLEXIBLE TRANSPARENT ELECTRODES VIA NANOWIRES AND SACRIFICIAL CONDUCTIVE LAYER 审中-公开
标题翻译：柔性透明电极通过纳米线和牺牲导电层
公开(公告)号：WO2008089401A9
公开(公告)日：2008-10-23
申请号：PCT/US2008051424
申请日：2008-01-18
申请人： UNIV ARIZONA , O'ROURKE SHAWN , SMITH PETE
发明人： O'ROURKE SHAWN , SMITH PETE
IPC分类号： H01L21/31
CPC分类号： H01L51/444 , B82Y10/00 , G02F1/133305 , G02F1/13439 , H01B1/04 , H01B1/08 , H01L51/5215 , H01L2251/5338 , H05B33/28 , Y02E10/549 , Y10T428/24926
摘要： A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.
摘要翻译：提供了一种柔性的透明电极结构及其制造方法，其包括透明电极，该透明电极可以维持跨越柔性衬底表面的电连接性，使得衬底可以弯曲而不影响电触点的完整性。透明电极包括通过导电氧化物层耦合到衬底的导电纳米线。导电氧化物层有效地提供了纳米线沉积在其上的模板并且用于将纳米线锚定到衬底表面。

5. 发明申请

WO2008089401A3 FLEXIBLE TRANSPARENT ELECTRODES VIA NANOWIRES AND SACRIFICIAL CONDUCTIVE LAYER 审中-公开
标题翻译：柔性透明电极，通过纳米级和极性导电层
公开(公告)号：WO2008089401A3
公开(公告)日：2008-09-04
申请号：PCT/US2008051424
申请日：2008-01-18
申请人： UNIV ARIZONA , O'ROURKE SHAWN , SMITH PETE
发明人： O'ROURKE SHAWN , SMITH PETE
IPC分类号： H01L21/31
CPC分类号： H01L51/444 , B82Y10/00 , G02F1/133305 , G02F1/13439 , H01B1/04 , H01B1/08 , H01L51/5215 , H01L2251/5338 , H05B33/28 , Y02E10/549 , Y10T428/24926
摘要： A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.
摘要翻译：提供了一种灵活的透明电极结构及其制造方法，其包括透明电极，其可以保持穿过柔性基底的表面的电连接，使得基底可以弯曲而不影响电接触的完整性。透明电极包括通过导电氧化物层耦合到衬底的导电纳米线。导电氧化物层有效地提供了一种模板，纳米线被沉积在该模板上，并用于将纳米线锚固到衬底表面。

6. 发明申请

WO2010065542A1 METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBSTRATE ASSEMBLY THEREFROM 审中-公开
标题翻译：制造柔性基板组件的方法和柔性基板组装
公开(公告)号：WO2010065542A1
公开(公告)日：2010-06-10
申请号：PCT/US2009/066259
申请日：2009-12-01
申请人： ARIZONA BOARD OF REGENTS, FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , HAQ, Jesmin , AGENO, Scott , LOY, Douglas, E. , O'ROURKE, Shawn , NAUJOKAITIS, Robert
发明人： HAQ, Jesmin , AGENO, Scott , LOY, Douglas, E. , O'ROURKE, Shawn , NAUJOKAITIS, Robert
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
摘要翻译：一些实施例教导了制备柔性衬底组件的方法。该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底耦合到塑料衬底。在本申请中公开了其它实施例。

7. 发明申请

WO2010051106A2 METHODS FOR ATTACHING FLEXIBLE SUBSTRATES TO RIGID CARRIERS AND RESULTING DEVICES 审中-公开
标题翻译：将柔性基板连接到刚性载体和结构设备的方法
公开(公告)号：WO2010051106A2
公开(公告)日：2010-05-06
申请号：PCT/US2009056501
申请日：2009-09-10
申请人： UNIV ARIZONA , LOY DOUGLAS E , O'ROURKE SHAWN M
发明人： LOY DOUGLAS E , O'ROURKE SHAWN M
IPC分类号： H01L33/48
CPC分类号： H01L21/6835 , H01L2221/6835 , H05K1/0393 , H05K3/007 , H05K3/341 , Y10T428/24826
摘要： Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219 °C and 1000 °C and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.
摘要翻译：柔性基底可以临时附接到刚性载体上，以通过在柔性基底和刚性载体之间的一个或多个接触点处沉积接合材料来处理其表面，在柔性基底和刚性载体之间，在一个或多个接触点 ; 以及将所述一个或多个接触点暴露于219℃至1000℃之间的温度，并且在适于通过所述接合材料在所述一个或多个接触点处附接所述柔性基底和所述刚性载体的条件下暴露。合适的接合材料的实例包括但不限于焊接或钎焊材料。这种支撑的基底可以用于制备在柔性显示器的表面上包括至少一个电子部件和/或电路的柔性显示器。

8. 发明申请

WO2008005979A1 METHOD OF TEMPORARILY ATTACHING A RIGID CARRIER TO A SUBSTRATE 审中-公开
标题翻译：将刚性载体连接到基板的方法
公开(公告)号：WO2008005979A1
公开(公告)日：2008-01-10
申请号：PCT/US2007/072737
申请日：2007-07-03
申请人： THE ARIZONA BOARD OF REGENTS, A BODY CORPORATE ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , O'ROURKE, Shawn
发明人： O'ROURKE, Shawn
IPC分类号： H01L21/50
CPC分类号： H01L24/89 , C09J5/06 , C09J2203/326 , C09J2205/302 , C09J2469/00 , H01L21/6835 , H01L23/4985 , H01L2221/68318 , H01L2221/68345 , H01L2221/6835 , H01L2224/80007 , H01L2224/80047 , H01L2224/8085 , H01L2224/80948 , H01L2924/0002 , H05K1/0393 , H05K3/007 , H05K3/386 , H05K2203/016 , H05K2203/083 , H05K2203/085 , H05K2203/1105 , Y10T29/49156 , H01L2924/00
摘要： Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.
摘要翻译：描述了将基板临时附接到刚性载体的方法，其包括形成可热分解的聚合物（例如聚（碳酸亚烷基酯））的牺牲层，并将柔性基板粘合到刚性载体上，牺牲层位于它们之间。然后可以制造电子元件和/或电路或在所附接的衬底上采用其他半导体处理步骤（例如，背面研磨）。一旦制造完成，可以通过加热组件来分解牺牲层，从而将基板从刚性载体上拆下。

9. 发明申请

WO2009126544A1 ASSEMBLIES AND METHODS FOR REDUCING WARP AND BOW OF A FLEXIBLE SUBSTRATE DURING SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：用于在半导体处理期间减少柔性基板的翘曲和弯曲的组件和方法
公开(公告)号：WO2009126544A1
公开(公告)日：2009-10-15
申请号：PCT/US2009/039577
申请日：2009-04-06
申请人： ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY , O'ROURKE, Shawn , LOY, Douglas , JIANG, Hanqing
发明人： O'ROURKE, Shawn , LOY, Douglas , JIANG, Hanqing
IPC分类号： B32B7/12 , B32B15/08 , B32B27/36 , H01L23/498 , H05K3/00
CPC分类号： H01L29/78603 , H05K1/0393 , H05K3/007 , H05K3/386 , H05K2201/0175 , H05K2203/016 , H05K2203/0191 , Y10T428/31515 , Y10T428/31551 , Y10T428/31663 , Y10T428/31678 , Y10T428/31721 , Y10T428/31786 , Y10T428/31942
摘要： Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.
摘要翻译：描述了用于解决由于半导体处理的热挑战而发生的附接到刚性载体的柔性基板的弯曲和/或翘曲的方法。特别地，提供了粘弹性粘合剂，其可以将柔性基底粘合到刚性载体上并介导由于大多数柔性基底（例如塑料膜）相对于刚性载体明显不同的材料性质而常存在的热失配作为硅晶片。还提供了根据本文所述的方法制造的组件。

10. 发明申请

WO2008089401A2 FLEXIBLE TRANSPARENT ELECTRODES VIA NANOWIRES AND SACRIFICIAL CONDUCTIVE LAYER 审中-公开
标题翻译：柔性透明电极通过纳米线和牺牲导电层
公开(公告)号：WO2008089401A2
公开(公告)日：2008-07-24
申请号：PCT/US2008/051424
申请日：2008-01-18
申请人： ARIZONA BOARD OF REGENTS, ACTING FOR AND ON BEHALFOF ARIZONA STATE UNIVERSITY , O'ROURKE, Shawn , SMITH, Pete
发明人： O'ROURKE, Shawn , SMITH, Pete
IPC分类号： H01L51/00
CPC分类号： H01L51/444 , B82Y10/00 , G02F1/133305 , G02F1/13439 , H01B1/04 , H01B1/08 , H01L51/5215 , H01L2251/5338 , H05B33/28 , Y02E10/549 , Y10T428/24926
摘要： A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.
摘要翻译：提供了一种柔性透明电极结构及其制造方法，其包括透明电极，该透明电极可以维持跨过柔性衬底的表面的电连接性，使得衬底可以弯曲而不影响电接触。透明电极包括通过导电氧化物层耦合到衬底的导电纳米线。导电氧化物层有效地提供了纳米线沉积在其上的模板并用于将纳米线锚定到基板表面。

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