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1. 发明申请

WO2004057909A2 SILICON-BASED TRANSDUCER FOR USE IN HEARING INSTRUMENTS AND LISTENING DEVICES 审中-公开
标题翻译：用于听觉仪器和听筒装置的硅基传感器
公开(公告)号：WO2004057909A2
公开(公告)日：2004-07-08
申请号：PCT/NL0300906
申请日：2003-12-18
申请人： SONIONMEMS AS , MUELLENBORN MATTHIAS , VAN HALTEREN AART ZEGER
发明人： MUELLENBORN MATTHIAS , VAN HALTEREN AART ZEGER
IPC分类号： H04R19/00 , H04R
CPC分类号： H04R19/005 , B33Y80/00 , H04R25/407 , H04R25/48 , H04R25/556 , H04R25/604 , H04R2225/61
摘要： A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.
摘要翻译：耦合到听力仪器中的可移动结构的硅基换能器组件。换能器组件包括至少一个麦克风芯片和具有多个集成组件的ASIC，例如DSP，A / D转换器，放大器，滤波器或无线接口的任何组合。可移动结构可以是电池存取门，音量拨盘，开关或触摸板。保护带可以跨越电池检修门设置，以防止碎屑堵塞硅基换能器组件。换能器组件还可以包括麦克风芯片的阵列，以实现自适应波束控制或方向性。当配备无线接口时，听力仪器与另一个听力仪器或网络无线通信。

2. 发明申请

WO0119134A3 SILICON-BASED SENSOR SYSTEM 审中-公开
标题翻译：硅基传感器系统
公开(公告)号：WO0119134A3
公开(公告)日：2001-09-07
申请号：PCT/DK0000491
申请日：2000-09-06
申请人： MICROTRONIC AS , MUELLENBORN MATTHIAS , KUHMANN JOCHEN F , SCHEEL PETER U
发明人： MUELLENBORN MATTHIAS , KUHMANN JOCHEN F , SCHEEL PETER U
IPC分类号： H04R19/00 , H04R19/04 , H04R25/00
CPC分类号： H04R19/005 , H04R19/04 , H04R25/60
摘要： The present invention relates to solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.
摘要翻译：本发明涉及适合批量生产的固态硅基电容麦克风系统。与现有技术中公开的任何其他系统相比，形成麦克风系统的不同元件的组合更加灵活。麦克风系统的不同元件之间的电气连接通过使用倒装芯片技术的硅载体经济可靠地建立。本发明使用集成电子电路芯片，优选地是专用集成电路（ASIC），其可以分开设计和制造，而与麦克风的换能器元件的设计和制造无关。完整的传感器系统可以通过表面贴装技术与外部基板电连接，触点面向系统的一侧，不与上述与环境的界面相冲突。这允许用户为组装整个系统应用简单而有效的表面贴装技术。

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