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    • 10. 发明申请
    • ENCAPSULATED DEVICES AND METHOD OF MAKING
    • 封装设备及其制造方法
    • WO2007025140A1
    • 2007-03-01
    • PCT/US2006/033244
    • 2006-08-25
    • VITEX SYSTEMS, INC.MORO, LorenzaKRAJEWSKI, Todd, A.
    • MORO, LorenzaKRAJEWSKI, Todd, A.
    • H01L51/52
    • H01L51/5256H01L51/448Y02E10/549
    • A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C-C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C=C bonds. An encapsulated environmentally sensitive device is also described.
    • 封装环境敏感设备的方法。 该方法包括提供基板; 将至少一个环境敏感的装置放置在与基板相邻的位置; 至少一个阻挡层叠层包括至少一个阻挡层和至少一个聚合物去耦层,其中所述至少一个聚合物去耦层由至少一个聚合物前体制成, ,并且其中所述聚合物去耦层具有以下至少一种:极数区域数目的减少; 高填充密度; 具有比C-C共价键弱的键能的区域数量减少; 减少数量的酯部分; 增加所述至少一种聚合物前体的Mw; 增加所述至少一种聚合物前体的链长度; 或降低C = C键的转化率。 还描述了封装的环境敏感设备。