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1. 发明申请

WO2012121584A1 AN APPARATUS FOR PRODUCTION OF CARBON NANOTUBES AND THE METHOD THEREOF 审中-公开
标题翻译：用于生产碳纳米管的装置及其方法
公开(公告)号：WO2012121584A1
公开(公告)日：2012-09-13
申请号：PCT/MY2011/000205
申请日：2011-09-22
申请人： UNIVERSITI SAINS MALAYSIA , MOHAMED, Abdul Rahman , CHAI, Siang, Piao , YEOH, Wei Ming
发明人： MOHAMED, Abdul Rahman , CHAI, Siang, Piao , YEOH, Wei Ming
IPC分类号： D01F9/12 , B82Y40/00 , C01B31/02
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/162 , C01B32/164 , D01F9/133
摘要： An apparatus for production of carbon nanotubes, comprising a reaction chamber, arranged to receive at least one catalyst and a carbon precursor; and a rotatable helical structure within said reaction chamber arranged to carry the at least one catalyst and arranged to traverse the at least one catalyst along the length of the reaction chamber.
摘要翻译：一种用于生产碳纳米管的装置，包括反应室，其被设置为容纳至少一种催化剂和碳前体; 以及在所述反应室内的可旋转的螺旋结构，其布置成承载所述至少一种催化剂，并布置成沿所述反应室的长度横穿所述至少一种催化剂。

2. 发明申请

WO2005078789A1 CHIP-SIZED FILP-CHIP SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：芯片尺寸的FILP-CHIP半导体封装及其制造方法
公开(公告)号：WO2005078789A1
公开(公告)日：2005-08-25
申请号：PCT/IB2004/000047
申请日：2004-01-13
申请人： INFINEON TECHNOLOGIES AG , KEONG, Bun-Hin , MOHAMED, Abdul, Rahman , GOH, Koh-Hoo
发明人： KEONG, Bun-Hin , MOHAMED, Abdul, Rahman , GOH, Koh-Hoo
IPC分类号： H01L21/768
CPC分类号： H01L21/561 , H01L21/56 , H01L21/568 , H01L23/3114 , H01L24/10 , H01L24/13 , H01L24/96 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/181 , H01L2924/00
摘要： A semiconductor package (10; 14) comprises a semiconductor die (2; 2') with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2') and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2') and sides of the electrically conductive bumps (7).
摘要翻译：半导体封装（10; 14）包括在其有源表面上具有多个接触区域（4）的半导体管芯（2; 2'）和每个接触区域（4）上的导电凸块（7）。模具（2; 2'）和导电凸块（7）被封装在塑料外壳（11）中，使得塑料外壳（11）至少封装模具（2; 2'）的两侧，导电凸块（7）。

3. 发明申请

WO2007122438A1 A METHOD FOR PRODUCING A THIN SEMICONDUCTOR CHIP 审中-公开
标题翻译：一种生产半导体芯片的方法
公开(公告)号：WO2007122438A1
公开(公告)日：2007-11-01
申请号：PCT/IB2006/000966
申请日：2006-04-21
申请人： INFINEON TECHNOLOGIES AG , KRÖNINGER, Werner , KOTEK, Manfred , KOLLER, Adolf , MOHAMED, Abdul, Rahman
发明人： KRÖNINGER, Werner , KOTEK, Manfred , KOLLER, Adolf , MOHAMED, Abdul, Rahman
IPC分类号： H01L21/68 , H01L21/78
CPC分类号： H01L21/78 , H01L21/6835 , H01L2221/68318 , H01L2221/68331
摘要： A method of fabricating a semiconductor chip, the method includes the step of providing an adhesive layer (6) on the outer area of the active surface (13) of a device wafer (1) . Next, a rigid body (3) is attached to the active surface (13) of the device wafer (1) by the adhesive layer (6) . After this, the device wafer (1) is thinned by treating the passive surface of the device wafer (1) that is opposite to the active surface (13) . Following this, a first backing tape (21, 23) is connected to the passive surface of the device wafer (1) . Then, the outer portion (32) of the rigid body (3) is separated from the central portion (33) of the rigid body (3) . In addition, the outer portion (12) of the device wafer (1) is separated from the central portion (14) of the device wafer (1) . After this, the central portion (33) of the rigid body (3) is removed from the first backing tape (21, 23) . Next, the outer portion (12) of the device wafer (1) and the outer portion (32) of the rigid body (3) is removed from the first backing tape (21, 23) . After this, the device wafer (1) is diced into semiconductor chips .
摘要翻译：一种制造半导体芯片的方法，该方法包括在器件晶片（1）的有源表面（13）的外部区域上提供粘合剂层（6）的步骤。接下来，通过粘合剂层（6）将刚体（3）附接到装置晶片（1）的有源表面（13）。之后，通过处理与有源表面（13）相对的器件晶片（1）的被动表面，使器件晶片（1）变薄。之后，第一背衬带（21,23）连接到器件晶片（1）的被动表面。然后，刚性体（3）的外部（32）与刚体（3）的中心部分（33）分离。另外，器件晶片（1）的外部部分（12）与器件晶片（1）的中心部分（14）分离。此后，刚性体（3）的中心部分（33）从第一背衬带（21,23）移除。接下来，从第一背衬带（21,23）移除装置晶片（1）的外部部分（12）和刚体（3）的外部部分（32）。之后，将器件晶片（1）切成半导体芯片。

4. 发明申请

WO2010059027A3 A PROCESS FOR PRODUCING CARBON NANOTUBES (CNTs) 审中-公开
标题翻译：生产碳纳米管（CNT）的方法
公开(公告)号：WO2010059027A3
公开(公告)日：2011-03-10
申请号：PCT/MY2008000143
申请日：2008-11-18
申请人： UNIV SAINS MALAYSIA , MOHAMED ABDUL RAHMAN , CHAI SIANG PIAO
发明人： MOHAMED ABDUL RAHMAN , CHAI SIANG PIAO
IPC分类号： C01B31/02
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/162 , C01B2202/06 , C01B2202/36
摘要： The present invention provides a process for producing substantially uniform-sized carbon nanotubes (CNTs), the process includes the step of contacting methane with with catalytic particles at a temperature of between 650 to 850 °C.
摘要翻译：本发明提供一种制备基本均匀尺寸的碳纳米管（CNT）的方法，该方法包括在650至850℃的温度下使甲烷与催化剂颗粒接触的步骤。

5. 发明申请

WO2010059027A2 A PROCESS FOR PRODUCING CARBON NANOTUBES (CNTs) 审中-公开
标题翻译：生产碳纳米管（CNT）的方法
公开(公告)号：WO2010059027A2
公开(公告)日：2010-05-27
申请号：PCT/MY2008/000143
申请日：2008-11-18
申请人： UNIVERSITI SAINS MALAYSIA , MOHAMED, Abdul, Rahman , CHAI, Siang Piao
发明人： MOHAMED, Abdul, Rahman , CHAI, Siang Piao
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/162 , C01B2202/06 , C01B2202/36
摘要： The present invention provides a process for producing substantially uniform-sized carbon nanotubes (CNTs), the process includes the step of contacting methane with with catalytic particles at a temperature of between 650 to 850 °C.
摘要翻译：本发明提供一种制备基本均匀尺寸的碳纳米管（CNT）的方法，该方法包括在650至850℃的温度下使甲烷与催化剂颗粒接触的步骤。

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