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1. 发明申请

WO1997015446A1 METHOD OF PROTECTING THE SURFACE OF A FOIL, RELEASABLY ADHERING PROTECTIVE FILM AND FILM-COATED FOIL 审中-公开
标题翻译：保护薄膜表面的方法，可贴膜保护膜和薄膜包衣
公开(公告)号：WO1997015446A1
公开(公告)日：1997-05-01
申请号：PCT/IB1996001151
申请日：1996-10-25
申请人： METALLIZED PRODUCTS INC. , WILHEIM, Martin, J. , KEOUGH, Allen, H.
发明人： METALLIZED PRODUCTS INC.
IPC分类号： B32B31/12
CPC分类号： B32B37/0038 , B32B37/26 , B32B2309/02 , B32B2309/12 , B32B2310/0887 , B32B2311/12 , B32B2367/00 , B32B2457/08 , H05K3/022 , H05K3/025 , H05K2203/0156
摘要： A method for protecting a substrate sheet (46) such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer (28) to one side of a protective film (12), and applying a preferably electron beam curable adhesive pressure-sensitive coating (42) to the other side of the film, curing the adhesive coating, and laminating the protective film to the foil (46) or other substrate sheet, which, in turn, may be laminated to other substrates such as dielectric sheets (60). The laminate product is a protected substrate sheet having a protective film laminated to one side of the sheet (or both), the film having a lamination mold-release layer on one side thereof and an electron beam cured pressure-sensitive adhesive coating on the other side thereof, said other side contacting but being releasably detachable from said substrate sheet. Where the substrate sheet is a foil or similar surface, protection is thus provided during handling and storage as well as during lamination, and the protective film is peelably detachable from the foil.
摘要翻译：一种用于保护适合用于制造印刷电路板的导电箔的基片（46）的方法，包括将层压脱模层（28）施加到保护膜（12）的一侧，并施加优选电子束可固化粘合剂压敏涂层（42）到膜的另一侧，固化粘合剂涂层，并将保护膜层压到箔片（46）或其它基材片材上，其又可以层压到其它基板例如电介质片（60）。层压制品是具有层压在片材（或两者）的一面上的保护膜的被保护的基材片，该膜在其一侧具有层压脱模层，而在另一侧具有电子束固化的压敏粘合剂涂层所述另一侧接触，但是可释放地从所述基片剥离。在基片是箔片或类似表面的情况下，在处理和储存期间以及层压期间提供保护，并且保护膜可剥离地从箔片剥离。

2. 发明申请

WO2004056161A1 A METHOD OF PROTECTING METAL FOIL SUBTRATES 审中-公开
标题翻译：保护金属箔片的方法
公开(公告)号：WO2004056161A1
公开(公告)日：2004-07-01
申请号：PCT/IB2003/005890
申请日：2003-12-12
申请人： METALLIZED PRODUCTS INC
发明人： WILHEIM, Martin, J. , ALOIS, Edward, J.
IPC分类号： H05K3/00
CPC分类号： B32B27/08 , B29C63/0043 , B29C63/0056 , B32B7/06 , B32B15/08 , B32B15/20 , B32B27/36 , B32B37/00 , B32B2255/10 , B32B2255/205 , B32B2310/025 , B32B2311/12 , B32B2457/08 , H05K3/022 , Y10T156/1994
摘要： An improved method of an apparatus for producing novel preferably thin plastic protective or masking film layer products (2) for thin shiny copper foils (1) and the like, as for PCB applications and the like, with an inner releasable film surface coating (2’’) carrying a permanent electric-charge for adhering to the shiny foil surface (1’), but with the opposite outer surface (2’) of the film being maintained uncharged and electrically neutral.
摘要翻译：一种用于制造用于薄发光铜箔（1）等的新型优选薄塑料保护或掩蔽膜层产品（2）的设备的改进方法，对于PCB应用等，具有内部可释放膜表面涂层（2 （1'），但是膜的相对的外表面（2'）保持不带电和电中性。

3. 发明申请

WO1998041904A1 A METHOD OF PRODUCING EMBOSSE, LIGHT-DIFFRACTING PATTERNS 审中-公开
标题翻译：一种生产嵌体，光分散图案的方法
公开(公告)号：WO1998041904A1
公开(公告)日：1998-09-24
申请号：PCT/IB1997000999
申请日：1997-08-18
申请人： METALLIZED PRODUCTS INC. , DELANEY, William , HOVASSE, Richard
发明人： METALLIZED PRODUCTS INC.
IPC分类号： G03H01/02
CPC分类号： B44C1/24 , B29C35/08 , B29C43/021 , B29C43/18 , B29C43/222 , B29C43/30 , B29D11/00 , B29L2011/00 , B29L2031/7224 , G03H1/0276 , G03H2001/185 , G03H2227/04 , G03H2250/12 , G03H2270/12
摘要： A method of producing on a substrate surface (P) predetermined, multi-colour diffraction/refraction patterns or hologram (L), where the said method comprises: applying a radiation-curable adhesive coating (A) between a flexible film master (I) and the substrate surface; pressing the flexible film master and the substrate together with the coating (A) interposed in order to cause the surface of the coating adjacent the film master to become impressed with a faithful reproduction of the predetermined pattern (L) of the film master; radiation-curing the adhesive coating in order to set the impressed pattern (L) in the coating surface, while integrally bonding the coating to the substrate surface; and stripping the resulting integral, patterned, coated substrate from the flexible film master. The film master may also be metallised, in which case the metal layer is adhered to the substrate in order to generate additional decorative effects.
摘要翻译：一种在基板表面（P）上制造预定的多色衍射/折射图案或全息图（L）的方法，其中所述方法包括：将可辐射固化粘合剂涂层（A）施加在柔性膜主体（I）和基板表面; 将柔性胶片主体和基板与涂层（A）一起按压，以使与胶片主体相邻的涂层的表面被印象深刻地印刷在胶片主体的预定图案（L）上; 辐射固化粘合剂涂层，以便将涂层图案（L）设置在涂层表面中，同时将涂层一体地粘合到基材表面; 并从柔性膜主体剥离得到的整体的，图案化的涂覆的基底。胶片母版也可以金属化，在这种情况下，金属层粘附到基底上，以产生额外的装饰效果。

4. 发明申请

WO2004004429A1 RELEASABLE PROTECTIVE INSULATING LAYERS FOR SUBSTRATES 审中-公开
标题翻译：可剥离的基材保护绝缘层
公开(公告)号：WO2004004429A1
公开(公告)日：2004-01-08
申请号：PCT/IB2002/004025
申请日：2002-09-30
申请人： METALLIZED PRODUCTS INC.
发明人： WILHEIM, Martin, J.
IPC分类号： H05K3/00
CPC分类号： B32B15/08 , B29C63/0043 , B29C63/0056 , B29L2031/3425 , B32B7/06 , B32B27/36 , B32B37/00 , B32B2310/025 , B32B2311/12 , B32B2457/08 , H05K3/022 , Y10T29/49826 , Y10T156/1067 , Y10T428/31681 , Y10T428/31909
摘要： An improved method of and apparatus for producing preferably thin plastic protective film layers (2) for thin shiny copper foils (1) and the like, as for PCB applications, with electric charge adhering of the same to the foil (1) and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.
摘要翻译：一种用于生产优选薄的塑料保护膜层（2）的改进方法和设备，用于薄的发光铜箔（1）等，对于PCB应用，其电荷与箔（1）附着并且具有剥离提供相同的原始原始光泽的铜箔表面，无污染，损坏或其他物理，化学或其他残留物，尽管处理和其他加工程序。

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