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    • 4. 发明申请
    • FABRICATION OF CONDUCTIVE PATHWAYS, MICROCIRCUITS AND MICROSTRUCTURES IN MICROFLUIDIC NETWORKS
    • 微流控网络中导电通路,微环境和微结构的制作
    • WO2007061448A2
    • 2007-05-31
    • PCT/US2006/019787
    • 2006-05-18
    • PRESIDENT AND FELLOWS OF HARVARD COLLEGEBRUZEWICZ, Derek, A.BONCHEVA-BETTEX, MilaWHITESIDES, George, M.SIEGEL, AdamWEIBEL, Douglas, B.SHEVKOPLYAS, SergeyMARTINEZ, Andres
    • BRUZEWICZ, Derek, A.BONCHEVA-BETTEX, MilaWHITESIDES, George, M.SIEGEL, AdamWEIBEL, Douglas, B.SHEVKOPLYAS, SergeyMARTINEZ, Andres
    • H05K3/10
    • H05K3/101B01L3/5027B01L3/502707B01L2200/12B01L2300/0645B01L2300/0816B01L2300/0874B01L2400/0415B33Y80/00H05K1/0272H05K1/032H05K3/389H05K2201/0162H05K2201/0305H05K2203/128Y10T29/49117
    • Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.
    • 这里公开了各种微流体装置和固体,典型地导电装置,其可以使用诸如模具的装置形成。 在某些实施例中,形成的器件包括通过凝固存在于一个或多个微流体通道中的液态金属(以下称为“微型固态”器件)形成的导电通路。 在某些这样的装置中,其中可以在微流体结构中的区域之间形成和/或重新形成电连接; 在一些情况下,形成的器件/电路可以是柔性的和/或涉及柔性电子部件。 在某些实施方案中,在微流体通道中形成的固体金属丝/导电通路可保持包含在微流体结构内。 在某些这样的实施例中,所形成的导电通路可位于承载流动流体的结构的其他微流体通道附近,使得导电通路可产生与其相互作用的能量(例如电磁能和/或热能),并且 /或影响流动的流体和/或包含在其中或由其承载的组件。 在其他实施例中,可以将微观结构从微流体模具移除以形成独立结构。 在某些实施方案中,所形成的固体金属结构可与入射在结构上的光能相互作用或可用于制造轻质电极。 本发明的另一方面涉及可以包括这些导电通路/连接的自组装结构的形成。