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    • 1. 发明申请
    • THERMO-ELECTRIC COOLING SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES
    • 热电冷却系统和冷却电子设备的方法
    • WO2011083462A2
    • 2011-07-14
    • PCT/IL2011/000005
    • 2011-01-05
    • NOVATRANS GROUP SACONNOLLY, JohnROULSTON, JohnMANDELIK, Daniel
    • CONNOLLY, JohnROULSTON, JohnMANDELIK, Daniel
    • H01S3/1317F25B21/02F25B2321/021G01N21/3586H01L35/325H01S1/02H01S3/0405H01S5/02415
    • A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.
    • 提出了一种用于冷却器件(例如激光器)的热电冷却(TEC)系统。 TECT系统包括第一和第二热泵组件,以及至少与所述第二热泵组件相连的控制单元。 每个热泵组件都具有一个热源,热量从该热源被泵送,并且一个散热通过该热量消散。 至少第一和第二热泵组件布置成级联关系,其具有在第二热泵组件的热源​​和第一热泵组件的热源​​之间的至少一个热界面,第一热泵送的热源 组件热耦合到待通过从其中排出热量而被冷却的电子设备。 控制单元被配置和操作以执行以下至少一个:(i)操作所述第二热泵组件以提供期望的温度条件,使得所述第一热泵组件的排水温度理想地为低或 低于所述第一热泵组件的热源​​的温度的一定值; 和(ii)操作所述第二热泵组件以维持所述热界面的预定温度。
    • 2. 发明申请
    • THERMO-ELECTRIC COOLING SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES
    • 热电冷却系统和冷却电子设备的方法
    • WO2011083462A3
    • 2012-10-18
    • PCT/IL2011000005
    • 2011-01-05
    • NOVATRANS GROUP SACONNOLLY JOHNROULSTON JOHNMANDELIK DANIEL
    • CONNOLLY JOHNROULSTON JOHNMANDELIK DANIEL
    • F25B21/02H01L35/00
    • H01S3/1317F25B21/02F25B2321/021G01N21/3586H01L35/325H01S1/02H01S3/0405H01S5/02415
    • A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.
    • 提出了一种用于冷却器件(例如激光器)的热电冷却(TEC)系统。 TECT系统包括第一和第二热泵组件,以及至少与所述第二热泵组件相连的控制单元。 每个热泵组件都具有一个热源,热量从该热源被泵送,并且一个散热通过该热量消散。 至少第一和第二热泵组件布置成级联关系,其具有在第二热泵组件的热源​​和第一热泵组件的热源​​之间的至少一个热界面,第一热泵送的热源 组件热耦合到待通过从其中排出热量而被冷却的电子设备。 控制单元被配置和操作以执行以下至少一个:(i)操作所述第二热泵组件以提供期望的温度条件,使得所述第一热泵组件的排水温度理想地为低或 低于所述第一热泵组件的热源​​的温度的一定值; 和(ii)操作所述第二热泵组件以维持所述热界面的预定温度。