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    • 2. 发明申请
    • METHOD FOR MANUFACTURING A PIEZOELECTRIC CERAMIC BODY
    • 制造压电陶瓷体的方法
    • WO2010147675A1
    • 2010-12-23
    • PCT/US2010/001778
    • 2010-06-21
    • SONAVATION, INC.LIUFU, DeREGNIERE, Louis
    • LIUFU, DeREGNIERE, Louis
    • H01L41/22H04R17/00
    • H01L41/1871H01L41/1875H01L41/1876H01L41/333H01L41/37H01L41/43Y10T29/42
    • The present invention relates to a method of manufacturing a piezoelectric ceramic body and devices therefrom. The method comprises mixing a piezoelectric ceramic powder with a polymer binder and surfactant to form a slip mixture, casting the slip mixture into a mold and setting to the slip mixture in the mold to form a green body, cutting the green body to form a cut green body with an array of micron-sized ceramic elements and separation, and sintering the cut green body to form a sintered ceramic body. The sintered ceramic body can be further process to encasing in a polymer material to form a piezoelectric ceramic-polymer composite. The piezoelectric ceramic-polymer composite can be further processed to form devices such as acoustic transducers and sensors.
    • 本发明涉及压电陶瓷体的制造方法及其装置。 该方法包括将压电陶瓷粉末与聚合物粘合剂和表面活性剂混合以形成滑爽混合物,将滑动混合物浇注到模具中并固定在模具中的滑动混合物中以形成生坯体,切割生坯以形成切口 具有微米级陶瓷元件阵列的生坯和分离,并烧结切割的生坯以形成烧结陶瓷体。 烧结陶瓷体可以进一步包装在聚合物材料中以形成压电陶瓷 - 聚合物复合材料。 可以进一步处理压电陶瓷 - 聚合物复合材料,以形成诸如声换能器和传感器的装置。
    • 4. 发明申请
    • COMPOSITIONS FOR HIGH POWER PIEZOELECTRIC CERAMICS
    • 高功率压电陶瓷组合物
    • WO2006110722A1
    • 2006-10-19
    • PCT/US2006/013442
    • 2006-04-11
    • PIEZOTECH, LLCLIUFU, De
    • LIUFU, De
    • H01L41/08C04B35/493
    • H01L41/1876C01G45/006C01P2002/50C04B35/493C04B2235/32C04B2235/3213C04B2235/3224C04B2235/3229C04B2235/3244C04B2235/3251C04B2235/3256C04B2235/3262C04B2235/3281C04B2235/3284C04B2235/3293C04B2235/3294C04B2235/3418C04B2235/6567C04B2235/768C04B2235/79H01L41/43
    • A class of ceramic compositions according to the formula Pb (1-z) M z (Mn 1/3 Sb 2/3 ) x (Zr y Ti 1-y ) 1-x 0 3 where M is selected to be either Sr or Ba, x is selected to be between 0.01 and 0.1, y is selected to be between 0.35 and 0.55, and z is selected to be between 0.01 and 0.10. In some embodiments of the above composition, one or more dopants is added to the compositions. The dopant (s) may be selected from the group comprising: PbO, CeO 2 , SnO 2 , Sm 2 O 3 , TeO 2 , MoO 3 , Nb 2 O 5 , SiO 2 , CuO, CdO, HfO 2 , Pr 2 O 3 , and mixtures thereof . The dopants can be added to the ceramic composition in individual amounts ranging from 0.01 wt% to up to 5.0 wt%. The preferred ceramic compositions exhibit one or more of the following electromechanical properties: a relative dielectric constant (ε) of between 1200 and 2000, a mechanical quality factor (Q m ) of between l500 and 2800; a piezoelectric strain constant (d 33 ) of between 250-450 pC/N, a dielectric loss factor (tan δ) of between 0.002- 0.008 and a thickness electromechanical coupling coefficient (k t ) of between 0.45 and 0.7.
    • 一类根据下式的陶瓷组合物Pb(1-z)M z(Mn 1/3 Sb 3/3) 1 / x 3(x 1)x 1(x 1)x 1 x 1 2 x 3 其中M选择为Sr或Ba,x选择在0.01和0.1之间,y选择在0.35和0.55之间,z选择在0.01和0.10之间。 在上述组合物的一些实施方案中,将一种或多种掺杂剂加入到组合物中。 掺杂剂可以选自PbO,CeO 2,SnO 2,Sm 2 O 3, ,O 2 O 3,O 2 O 3,O 2 O 3,O 2 O 3, SUB,CuO,CdO,HfO 2,Pr 2 O 3,及其混合物。 掺杂剂可以以0.01重量%至高达5.0重量%的单独量加入陶瓷组合物中。 优选的陶瓷组合物表现出以下机电性质中的一种或多种:介于1200和2000之间的相对介电常数(e),在1500和2800之间的机械品质因数(Q> m N); 250-450pC / N之间的压电应变常数(d 33 N),0.001- 0.008之间的介电损耗系数(tan d)和厚度机电耦合系数(k < / SUB>)在0.45和0.7之间。