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    • 1. 发明申请
    • IMPROVED METAL FRAME FOR ELECTRONIC HARDWARE AND FLAT PANEL DISPLAYS
    • 改进的电子硬件和平板显示器的金属框架
    • WO2003009088A2
    • 2003-01-30
    • PCT/US2002/018129
    • 2002-06-07
    • LIQUID METAL TECHNOLOGIESPEKER, AtakanJOHNSON, William, L.
    • PEKER, AtakanJOHNSON, William, L.
    • G06F
    • C22C45/10C22C33/003C22C45/02H05K5/02H05K5/04Y10T428/30
    • A metal frame for electronic hardware and a method of manufacturing such a frame wherein at least a portion of the frame is made of bulk-solidifying amorphous alloys or bulk-solidifying amorphous alloy-composites is provided. The metal frames of the invention are preferably made of bulk-forming amorphous alloys or bulk-forming amorphous alloy- composites having an elastic limit for the metal frame of at least about 1.5%, and preferably greater than about 2.0%, a ΔTsc of more than 30°C, and at least one of the following properties: a hardness value of about 4 GP A or more, and preferably 5.5 GPA or more; a yield strength of about 2 GPa or more; a fracture toughness of about 10 ksi-sqrt(in) (sqrt:squre root) or more, and preferably 20 ksi sqrt(in) or more; and a density of at least 4.5 g/cc or more.
    • 一种用于电子硬件的金属框架和一种制造这种框架的方法,其中框架的至少一部分由块状固化的非晶合金或块状固化的非晶态合金复合材料制成。 本发明的金属框架优选地由对于金属框架具有至少约1.5%,优选大于约2.0%的具有弹性极限的块体形成非晶合金或块状形成的非晶态合金复合材料制成,更多的ΔTsc 30℃以下,以下性质中的至少一个:硬度值约4GPA以上,优选5.5GPA以上; 屈服强度约2GPa以上; 断裂韧性约10ksi-sqrt(in)(sqrt:squre root)或更大,优选20ksi sqrt(in)或更大; 并且密度为至少4.5g / cc或更高。