专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2010126289A2 BINDER WITH A DOCUMENT PUNCHING STRUCTURE 审中-公开
标题翻译：与文件打孔结构的绑定
公开(公告)号：WO2010126289A2
公开(公告)日：2010-11-04
申请号：PCT/KR2010002653
申请日：2010-04-27
申请人： LEE CHUNG-REAL
发明人： LEE CHUNG-REAL
IPC分类号： B42F13/40 , B42F13/16
CPC分类号： B42F13/404
摘要： Disclosed is a binder with a document punching structure. The disclosed binder has an interior in which a medium with binding holes is accommodated. The binder comprises: a binder body having a cover portion, a medium-binding portion, and a central portion which has a predetermined width and which is interposed between the cover portion and the medium-binding portion such that the central portion is bendable; a fixing holder arranged in the medium-binding portion to bind the medium via the binding-holes of the medium; and a puncher arranged at a predetermined point in the central portion of the binder body to punch binding holes into the medium, wherein the predetermined point in the central portion does not interfere with the medium bound to the fixing holder.
摘要翻译：公开了具有文件打孔结构的粘合剂。所公开的粘合剂具有其中容纳具有结合孔的介质的内部。粘合剂包括：具有盖部分，中等粘合部分和具有预定宽度的中心部分的粘合剂主体，并且介于粘合部分和介质粘合部分之间，使得中心部分是可弯曲的; 固定保持器，布置在所述介质结合部分中，以经由所述介质的粘合孔粘合所述介质; 以及布置在所述粘合剂主体的中心部分中的预定点处的打孔机，用于将粘合孔打入到所述介质中，其中所述中心部分中的所述预定点不与所述固定保持器结合的介质干涉。

IPRDB

热门服务

关于我们

友情链接

联系方式