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1. 发明申请

WO2012148777A1 MECHANICAL LAYER AND METHODS OF MAKING THE SAME 审中-公开
标题翻译：机械层及其制造方法
公开(公告)号：WO2012148777A1
公开(公告)日：2012-11-01
申请号：PCT/US2012/034276
申请日：2012-04-19
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , TAO, Yi , LEE, Hojin , ZHONG, Fan
发明人： TAO, Yi , LEE, Hojin , ZHONG, Fan
IPC分类号： G02B26/00
CPC分类号： G02B26/001
摘要： This disclosure provides mechanical layers and methods of forming the same. In one aspect, a method of forming a pixel includes depositing a black mask on a substrate, depositing an optical stack over the black mask, and forming a mechanical layer over the optical stack. The black mask is disposed along at least a portion of a side of the pixel, and the mechanical layer defines a cavity between the mechanical layer and the optical stack. The mechanical layer includes a reflective layer, a dielectric layer, and a cap layer, and the dielectric layer is disposed between the reflective layer and the cap layer. The method further includes forming a notch in the dielectric layer of the mechanical layer along the side of the pixel so as to reduce the overlap of the dielectric layer with the black mask along the side of the pixel.
摘要翻译：本公开提供了机械层及其形成方法。一方面，形成像素的方法包括在衬底上沉积黑色掩模，在黑色掩模上沉积光学堆叠，以及在光学堆叠上形成机械层。黑色掩模沿着像素的一侧的至少一部分设置，并且机械层在机械层和光学堆叠之间限定空腔。机械层包括反射层，电介质层和盖层，并且介电层设置在反射层和盖层之间。该方法还包括沿着像素的侧面在机械层的电介质层中形成凹口，以便沿像素的侧面减小电介质层与黑色掩模的重叠。

2. 发明申请

WO2012138577A1 PIXEL VIA AND METHODS OF FORMING THE SAME 审中-公开
标题翻译：像素及其形成方法
公开(公告)号：WO2012138577A1
公开(公告)日：2012-10-11
申请号：PCT/US2012/031643
申请日：2012-03-30
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LEE, Hojin , ZHONG, Fan , TAO, Yi
发明人： LEE, Hojin , ZHONG, Fan , TAO, Yi
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0841 , G02B26/001
摘要： This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask (23) on a substrate (20) at each of four corners and along at least one edge region of each pixel, depositing a dielectric layer (35) over the black mask, depositing an optical stack (16) including a stationary electrode over the dielectric layer, and depositing a mechanical layer (14) over the optical stack. The method further includes providing a conductive via (138) in a first pixel of the plurality of pixels, the via disposed in the dielectric layer and electrically connecting the stationary electrode to the black mask, the via disposed in a position along an edge of the first pixel, spaced offset from the edge of the first pixel in a direction towards the center of the first pixel.
摘要翻译：本公开提供了用于像素通孔的系统，方法和装置。在一个方面，一种形成具有多个像素的机电装置的方法包括在四个拐角中的每一个并且沿着每个像素的至少一个边缘区域在基底（20）上沉积导电黑色掩模（23），将电介质层（35），在所述电介质层上沉积包括固定电极的光学堆叠（16），并在所述光学堆叠上沉积机械层（14）。所述方法还包括在所述多个像素的第一像素中提供导电通孔（138），所述通孔设置在所述电介质层中并将所述固定电极电连接到所述黑色掩模，所述通孔设置在沿着第一像素，在朝向第一像素的中心的方向上与第一像素的边缘偏离。

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