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    • 3. 发明申请
    • IMPROVED BACKDRILLING OF MULTILAYER PRINTED CIRCUIT BOARDS
    • 改进多层印刷电路板的背板
    • WO2011126646A2
    • 2011-10-13
    • PCT/US2011027483
    • 2011-03-08
    • FLEXTRONICS AP LLCLAU CHEUK PING
    • LAU CHEUK PING
    • H05K3/40B23B41/00
    • H05K1/0251H05K3/0047H05K3/429H05K2203/0207Y10T29/49156Y10T29/49165Y10T29/49167
    • Methods of backdrilling printed circuit boards (PCBs) to remove via stubs and related apparatuses. The method may include removing a via stub through a combination of backdrilling and chemical etching. The backdrilling may remove a masking layer from the via stub. Portions of an underlying layer may remain in the region of the via stub after the backdrilling is completed. The remaining portions of the underlying layer may be removed in a subsequent etching process thereby removing the via stub from the PCB. As the backdrilling step may be used for the limited purpose of removing the outer layer and portions of the underlying layer remaining in the via can be tolerated, the diameter of the backdrilling need not be as large as traditional backdrilling where all layers within the via must be ensured of being completely removed.
    • 背板印刷电路板(PCB)通过短线和相关设备去除的方法。 该方法可以包括通过反钻和化学蚀刻的组合去除通孔短截线。 回钻可以从通孔短截线去除掩模层。 在回钻完成之后,下层的部分可能保留在通孔短截线的区域中。 可以在随后的蚀刻工艺中去除下层的剩余部分,从而从PCB去除通孔短截线。 由于回钻步骤可用于去除外层的有限目的,并且残留在通孔中的下层的部分可以被允许,所以回钻的直径不需要像传统的回钻一样大,其中通孔内的所有层必须 确保被完全清除。