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1. 发明申请

WO2005027729A2 SILICON BLADES FOR SURGICAL AND NON-SURGICAL USE 审中-公开
标题翻译：硅外科手术和非手术使用
公开(公告)号：WO2005027729A2
公开(公告)日：2005-03-31
申请号：PCT/US2004/030550
申请日：2004-09-17
申请人： BECTON, DICKINSON AND COMPANY , DASKAL, Vadim, M. , KEENAN, Joseph, F. , HUGHES, James, J. , KISS, Attila, N. , CHAVEZ, Susan, M.
发明人： DASKAL, Vadim, M. , KEENAN, Joseph, F. , HUGHES, James, J. , KISS, Attila, N. , CHAVEZ, Susan, M.
IPC分类号： A61B
CPC分类号： A61B17/3211 , A61B2017/00526 , A61B2017/0088 , A61F9/0133 , B81C99/0095
摘要： Ophthalmic surgical blades (734) are manufactured from either a crystalline or polycrystalline material, preferably in the form of a wafer. The method comprises preparing the crystalline or polycrystalline wafers by mounting them and machining trenches into the wafers. Methods for machining the trenches, which form the bevel blade surfaces (752), include a diamond blade saw, laser system, ultrasonic machine, a hot forge press and a router. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or polycrystalline material are removed uniformly, producing single, double or multiple bevel blades (734). Nearly any bevel angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost. The ophthalmic surgical blades can be used for cataract and refractive surgical procedures, as well as microsurgical, biological and non-medical, non-biological purposes.
摘要翻译：眼科手术刀片（734）由结晶或多晶材料制成，优选为晶片形式。该方法包括通过安装晶片或多晶晶片并将沟槽加工到晶片中来制备晶片或多晶晶片。用于加工形成斜角刀片表面（752）的沟槽的方法包括金刚石刀片锯，激光系统，超声波机器，热锻造机和路由器。然后将晶片置于蚀刻剂溶液中，该蚀刻剂溶液以均匀的方式各向同性地蚀刻晶片，使得晶体或多晶材料层被均匀地去除，从而产生单斜角，双斜角或多斜角叶片（734）。蚀刻后残留的晶片几乎可以加工任何斜角。由此产生的刀刃半径为5-500纳米，与钻石切割刀片的口径相同，但制造成本只有一小部分。眼科手术刀片可用于白内障和屈光手术程序，以及显微手术，生物和非医学，非生物学目的。

2. 发明申请

WO2005027728A3 METHOD FOR CREATING TRENCHES IN SILICON WAFERS USING A ROUTER 审中-公开
公开(公告)号：WO2005027728A3
公开(公告)日：2005-03-31
申请号：PCT/US2004/030536
申请日：2004-09-17
申请人： BECTON, DICKINSON AND COMPANY , DASKAL, Vadim, M. , KEENAN, Joseph, F. , HUGHES, James, J.
发明人： DASKAL, Vadim, M. , KEENAN, Joseph, F. , HUGHES, James, J.
IPC分类号： H05B6/00
摘要： A method for manufacturing blades for surgical and other uses from either a crystalline or polycrystalline material, preferably in the form of a wafer, comprises mounting the wafer material, drilling through-holes to define the starting locations of the trenches, inserting a spinning router into said holes, and machining trenches into the wafer material. After the trenches are formed, the wafers are placed in an isotropic etchant solution, in which layers of material are removed uniformly, producing single or double bevel blades, with each bevel having one or more facets. Nearly any bevel angle can be machined. The resulting radii of the blade edges is 5-500 nm, the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.

3. 发明申请

WO2005027729A3 SILICON BLADES FOR SURGICAL AND NON-SURGICAL USE 审中-公开
标题翻译：外科手术和非手术用硅片
公开(公告)号：WO2005027729A3
公开(公告)日：2005-08-04
申请号：PCT/US2004030550
申请日：2004-09-17
申请人： BECTON DICKINSON CO , DASKAL VADIM M , KEENAN JOSEPH F , HUGHES JAMES J , KISS ATTILA N , CHAVEZ SUSAN M
发明人： DASKAL VADIM M , KEENAN JOSEPH F , HUGHES JAMES J , KISS ATTILA N , CHAVEZ SUSAN M
IPC分类号： A61B20060101 , A61B17/00 , A61B17/32 , C23F1/00
CPC分类号： A61B17/3211 , A61B2017/00526 , A61B2017/0088 , A61F9/0133 , B81C99/0095
摘要： Ophthalmic surgical blades (734) are manufactured from either a crystalline or polycrystalline material, preferably in the form of a wafer. The method comprises preparing the crystalline or polycrystalline wafers by mounting them and machining trenches into the wafers. Methods for machining the trenches, which form the bevel blade surfaces (752), include a diamond blade saw, laser system, ultrasonic machine, a hot forge press and a router. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or polycrystalline material are removed uniformly, producing single, double or multiple bevel blades (734). Nearly any bevel angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost. The ophthalmic surgical blades can be used for cataract and refractive surgical procedures, as well as microsurgical, biological and non-medical, non-biological purposes.
摘要翻译：眼科手术刀片（734）由结晶或多晶材料制成，优选为晶片形式。该方法包括通过将晶圆或多晶晶片安装并将沟槽加工成晶片来制备晶体或多晶晶片。用于加工形成斜面刀片表面（752）的沟槽的方法包括金刚石锯片锯，激光系统，超声波机器，热锻压机和路由器。然后将晶片放置在蚀刻剂溶液中，其均匀地蚀刻晶片，使得均匀地去除晶体或多晶材料层，产生单个，双重或多个斜面叶片（734）。蚀刻后保留的晶片中几乎可以加工任何斜角。叶片边缘的最终半径为5-500nm，其与金刚石边缘刀片相同的口径，但是以成本的一小部分制造。眼科手术刀片可用于白内障和屈光手术，以及显微手术，生物和非医学，非生物学目的。

4. 发明申请

WO2005027728A2 SYSTEM AND METHOD FOR CREATING LINEAR AND NON-LINEAR TRENCHES IN SILICON AND OTHER CRYSTALLINE MATERIALS WITH A ROUTER 审中-公开
标题翻译：用于在硅和其他晶体材料中制造线性和非线性梯度的系统和方法
公开(公告)号：WO2005027728A2
公开(公告)日：2005-03-31
申请号：PCT/US2004030536
申请日：2004-09-17
申请人： BECTON DICKINSON CO , DASKAL VADIM M , KEENAN JOSEPH F , HUGHES JAMES J
发明人： DASKAL VADIM M , KEENAN JOSEPH F , HUGHES JAMES J
IPC分类号： A61B20060101 , A61B17/00 , A61B17/32 , B26B21/58 , A61B
CPC分类号： A61B17/32 , A61B17/3211 , A61B2017/00526 , B26B21/58
摘要： A method for manufacturing blades for surgical and other uses from either a crystalline or polycrystalline material, preferably in the form of a wafer (202), comprises preparing the crystalline or polycrystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, a hot forge press and a router (620). When a router (620) is used, throughholes (622) are drilled in the wafer (202) to define the starting locations of the trenches. After the trenches are formed, the wafers are placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or polycrystalline material are removed uniformly, producing single or double bevel blades, with each bevel having one or more facets. Nearly any bevel angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
摘要翻译：用于从晶体或多晶材料（优选以晶片（202）的形式）制造用于手术和其它用途的刀片的方法包括通过将晶片或多晶晶片安装并将沟槽加工到晶片中来制备晶体或多晶晶片。用于加工形成斜面刀片表面的沟槽的方法包括金刚石锯片锯，激光系统，超声波机器，热锻压机和路由器（620）。当使用路由器（620）时，在晶片（202）中钻出通孔（622）以限定沟槽的起始位置。在形成沟槽之后，将晶片放置在蚀刻剂溶液中，其均匀地蚀刻晶片，使得均匀地除去晶体或多晶材料层，产生单斜面或双斜面叶片，每个斜面具有一个或多个面。蚀刻后保留的晶片中几乎可以加工任何斜角。叶片边缘的最终半径为5-500nm，其与金刚石边缘刀片相同的口径，但是以成本的一小部分制造。

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