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1. 发明申请

WO2008106555A3 PIEZOELECTRIC PACKAGE WITH IMPROVED LEAD STRUCTURE 审中-公开
标题翻译：具有改进引线结构的压电封装
公开(公告)号：WO2008106555A3
公开(公告)日：2008-12-04
申请号：PCT/US2008055190
申请日：2008-02-27
申请人： IPTRADE INC , PLETNER BARUCH , KESSENICH GRACE R
发明人： PLETNER BARUCH , KESSENICH GRACE R
IPC分类号： H01L41/053 , F16F15/00 , H01L41/08 , H01L41/22
CPC分类号： H01L41/23 , F16F2224/0283 , H01L41/053 , H01L41/08 , Y10T156/10
摘要： A piezoelectric package (22) comprises at least one piezoelectric plate (24) having a first planar surface (26) and a second planar surface (28) that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer (34) electrically coupled to the first planar surface, and a second electrically conductive layer (36) electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (40), e.g., a rigid fiber composite material, encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers. Preferably, the conductive layers are of porous structure and have an area greater than the planar surface of the piezoelectric plate.
摘要翻译：压电封装（22）包括具有彼此电隔离的第一平面（26）和第二平面（28）的至少一个压电板（24）。压电封装还包括电耦合到第一平面表面的第一导电层（34）和电耦合到第二平坦表面的第二导电层（36）。压电封装还包括第一电绝缘材料（40），例如刚性纤维复合材料，封装压电板和第一和第二导电层的至少一部分。优选地，导电层具有多孔结构并且具有大于压电板的平坦表面的面积。

2. 发明申请

WO2010008381A1 UNIMORPH/BIMORPH PIEZOELECTRIC PACKAGE 审中-公开
标题翻译： UNIMORPH / BIMORPH压电封装
公开(公告)号：WO2010008381A1
公开(公告)日：2010-01-21
申请号：PCT/US2008/070095
申请日：2008-07-15
申请人： IPTRADE, INC. , PLETNER, Baruch , KESSENICH, Grace Rose , HORTH, Wesley Theron
发明人： PLETNER, Baruch , KESSENICH, Grace Rose , HORTH, Wesley Theron
IPC分类号： H01L41/09 , H01L41/053
CPC分类号： H01L41/0475 , H01L41/053 , H01L41/0926 , H01L41/23
摘要： A piezoelectric package (24) comprises upper and lower piezoelectric plates (26), each having opposing electrodes (30). The piezoelectric package further comprises an electrically insulative structure (32) encapsulating the piezoelectric plates. The package further comprises first and second external connectors (34) mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. A scalable piezoelectric package comprises a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cell together, such that the external connector of each of the piezoelectric cell is electrically coupled to the piezoelectric plate of each remaining piezoelectric plate of the piezoelectric cell.
摘要翻译：压电封装（24）包括上和下压电板（26），每个具有相对的电极（30）。压电封装还包括封装压电板的电绝缘结构（32）。该封装还包括安装到绝缘结构的第一和第二外部连接器（34）。连接器分别具有以不同顺序电耦合到电极的连接器端子，并且具有相同的几何布置，使得单个接口装置可以选择性地配合到任一个连接器。可压缩压电封装包括多个压电单元，每个压电单元包括电压耦合到相应压电单元的压电元件的压电元件和外部连接器。压电封装还包括至少一个细胞间导体，将压电元件电耦合在一起，使得每个压电单元的外部连接器电耦合到压电单元的每个剩余的压电板的压电板。

3. 发明申请

WO2008106555A2 PIEZOELECTRIC PACKAGE WITH IMPROVED LEAD STRUCTURE 审中-公开
标题翻译：具有改进引线结构的压电封装
公开(公告)号：WO2008106555A2
公开(公告)日：2008-09-04
申请号：PCT/US2008/055190
申请日：2008-02-27
申请人： IPTRADE, INC. , PLETNER, Baruch , KESSENICH, Grace R.
发明人： PLETNER, Baruch , KESSENICH, Grace R.
IPC分类号： H01L41/053 , H01L41/08 , H01L41/22 , F16F15/00
CPC分类号： H01L41/23 , F16F2224/0283 , H01L41/053 , H01L41/08 , Y10T156/10
摘要： A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.
摘要翻译：压电封装包括具有彼此电隔离的第一平面和第二平面的压电板。压电封装还包括电耦合到第一平面表面的第一导电层和电耦合到第二平坦表面的第二导电层。压电封装还包括封装压电板和第一和第二导电层的至少一部分的第一电绝缘材料（例如刚性纤维复合材料）。

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