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    • 1. 发明申请
    • PHOTOCURABLE RESIN COMPOSITION
    • 可光固化树脂组合物
    • WO1991011474A1
    • 1991-08-08
    • PCT/JP1991000106
    • 1991-01-29
    • NIPPON PETROCHEMICALS CO., LTD.IKEDA, NobuoNARAHARA, HisaoIIZUKA, MinoruINOMATA, ToshiakiYAMAGUCHI, TatsuoOHMIKA, HiroyoshiSHIRATORI, Fumio
    • NIPPON PETROCHEMICALS CO., LTD.
    • C08F299/00
    • G03F7/0388C08C19/28C08F290/128C08F292/00C08K9/04C08L13/00
    • A photocurable resin composition comprising: (a) a modified resin prepared by the reaction of either a conjugate diene polymer having a number-average molecular weight of 500 to 5,000 and a vinyl content of at least 50 mole % or an adduct prepared from the diene polymer and an α,β-unsaturated dicarboxylic acid anhydride and having a softening of 70 to 200 °C as measured by the ring and ball softening point method of JIS K 2531-60 with an α,β-unsaturated monocarboxylic ester having an alcoholic hydroxyl group represented by general formula (I) to thereby effect the ring opening of at least 10 mole % of the acid anhydride groups of the adduct, wherein R1 and R2 each represents a hydrogen atom or a methyl group and R3 represents a residue of a C2 or higher hydrocarbon which may contain a heteroatom, (b) an inorganic or organic powder having a mean particle diameter of 5 νm or less, or a grafted inorganic powder prepared by grafting an (un)saturated and (un)substituted hydrocarbon residue onto an inorganic powder having a particle size of 0.1 νm or less, wherein the total number of carbon atoms of the hydrocarbon residues grafted onto one inorganic atom is 4 or above, and (c) a photopolymerization initiator.
    • 一种光固化性树脂组合物,包括:(a)一种由改性共轭二烯聚合物树脂反应具有500和5000之间的至少50摩尔%的乙烯基含量的平均分子量和制备,或 由二烯聚合物和不饱和二羧酸酐-α,β制备的加合物,并且通过珠法测得软化范围为70至200℃ 和JIS K 2531-60软化点环,与一元不饱和酯-α,具有由通式(I)表示的醇羟基基团,其中R1和R2各自代表氢原子或β 甲基,并且R3代表C2的残基或可以含有杂原子的高级烃的残基,以便使核酸的酸酐基团的至少10摩尔%开环 重刑; (B)一种有机或无机的粉末,其颗粒具有通过接枝在无机粉末饱和的取代的烃残基的无机粉末(未)和(UN)中制备的平均直径或小于5微米,或接枝, 所述颗粒具有等于或小于0.1μm的尺寸,来自所述烃残基并接枝到无机原子上的碳原子的总数等于或大于4; 和(c)光聚合引发剂。