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1. 发明申请

WO2007056380A2 AN ELECTROPLATING METHOD IN THE MANUFACTURE OF THE SURFACE MOUNT PRECISION METAL RESISTOR 审中-公开
标题翻译：表面安装精密金属电阻制造中的电镀方法
公开(公告)号：WO2007056380A2
公开(公告)日：2007-05-18
申请号：PCT/US2006/043366
申请日：2006-11-07
申请人： CHEN, Chung, Chin , HSIEH, Ching-Hsiung
发明人： HSIEH, Ching-Hsiung
IPC分类号： H01C1/012
CPC分类号： H01C17/281 , H01C7/001 , H01C7/06 , H01C17/006 , H01C17/02
摘要： The present invention relates to an electroplating method in the manufacture of the surface mount precision metal resistor, the manufacturing steps are as below: a flat-shaped metal substrate strip being die stamped with predefined resistance value; separating said metal substrate strip into electroplating portion and non-electroplating portion by the separating insulator; removing the impurities on the surface of said electroplating portion by the electrolytic cleansing; insetting all flat-shaped metal substrate strips onto the vertical rotating bucket for electroplating to form two copper electrode terminals; removing off the separating insulator on said non-electroplating portion; grinding and surface roughness process on both of the upper and lower surfaces of said two copper electrode terminals; die stamping and cutting said electroplated metal substrate strip into metal resistor chip one by one; wrapping said non-electroplating portion on each said metal resistor chip with packaging layer; and roller-electroplating with tin-layer on the surfaces of said two copper electrode terminals at each said packaged metal resistor chip, thus the final product of the surface mount precision metal resistor having been completely manufactured.
摘要翻译：本发明涉及一种制造表面贴装精密金属电阻器的电镀方法，其制造步骤如下：将具有预定电阻值冲压的扁平状金属基片条; 通过分离绝缘体将所述金属基材带分离成电镀部分和非电镀部分; 通过电解清洗去除所述电镀部分表面上的杂质; 将所有平面状金属基板条均匀地插入垂直旋转铲斗上进行电镀以形成两个铜电极端子; 去除所述非电镀部分上的分离绝缘体; 所述两个铜电极端子的上表面和下表面上的研磨和表面粗糙度处理; 模具冲压切割将电镀金属基片一个一个地放入金属电阻芯片; 在每个所述金属电阻器芯片上用包装层包裹所述非电镀部分; 并且在每个所述封装的金属电阻器芯片处在所述两个铜电极端子的表面上用锡层进行辊电镀，因此已经完全制造了表面安装精密金属电阻器的最终产品。

2. 发明申请

WO2007056380A3 AN ELECTROPLATING METHOD IN THE MANUFACTURE OF THE SURFACE MOUNT PRECISION METAL RESISTOR 审中-公开
标题翻译：表面安装精密金属电阻制造中的电镀方法
公开(公告)号：WO2007056380A3
公开(公告)日：2009-05-14
申请号：PCT/US2006043366
申请日：2006-11-07
申请人： CHEN CHUNG CHIN , HSIEH CHING-HSIUNG
发明人： HSIEH CHING-HSIUNG
IPC分类号： H01C17/00 , B05D5/12 , C25D5/02 , C25D7/00 , C25D17/16 , H01C1/142 , H01C17/28
CPC分类号： H01C17/281 , H01C7/001 , H01C7/06 , H01C17/006 , H01C17/02
摘要： The present invention relates to an electroplating method in the manufacture of the surface mount precision metal resistor, the manufacturing steps are as below: a flat-shaped metal substrate strip being die stamped with predefined resistance value; separating said metal substrate strip into electroplating portion and non-electroplating portion by the separating insulator; removing the impurities on the surface of said electroplating portion by the electrolytic cleansing; insetting all flat-shaped metal substrate strips onto the vertical rotating bucket for electroplating to form two copper electrode terminals; removing off the separating insulator on said non-electroplating portion; grinding and surface roughness process on both of the upper and lower surfaces of said two copper electrode terminals; die stamping and cutting said electroplated metal substrate strip into metal resistor chip one by one; wrapping said non-electroplating portion on each said metal resistor chip with packaging layer; and roller-electroplating with tin-layer on the surfaces of said two copper electrode terminals at each said packaged metal resistor chip, thus the final product of the surface mount precision metal resistor having been completely manufactured.
摘要翻译：本发明涉及一种制造表面贴装精密金属电阻器的电镀方法，其制造步骤如下：将具有预定电阻值冲压的扁平状金属基片条; 通过分离绝缘体将所述金属基材带分离成电镀部分和非电镀部分; 通过电解清洗去除所述电镀部分表面上的杂质; 将所有平面状金属基板条均匀地插入垂直旋转铲斗上进行电镀以形成两个铜电极端子; 去除所述非电镀部分上的分离绝缘体; 所述两个铜电极端子的上表面和下表面上的研磨和表面粗糙度处理; 模具冲压切割将电镀金属基片一个一个地放入金属电阻芯片; 在每个所述金属电阻器芯片上用包装层包裹所述非电镀部分; 并且在每个所述封装的金属电阻器芯片处在所述两个铜电极端子的表面上用锡层进行辊电镀，因此已经完全制造了表面安装精密金属电阻器的最终产品。

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