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1. 发明申请

WO2004017386A2 CARRIER INCLUDING A MULTI-VOLUME DIAPHRAGM FOR POLISHING A SEMICONDUCTOR WAFER AND A METHOD THEREFOR 审中-公开
标题翻译：载体包括用于抛光半导体波形的多体积波片及其方法
公开(公告)号：WO2004017386A2
公开(公告)日：2004-02-26
申请号：PCT/US2001/007685
申请日：2001-03-27
申请人： SPEEDFAM-IPEC CORPORATION a Delaware Corporation , GROMKO, Robert, D. , SHULTZ, Stephen, C. , HERB, John, D. , LEE, James, F. , LEE, Junedong
发明人： GROMKO, Robert, D. , SHULTZ, Stephen, C. , HERB, John, D. , LEE, James, F. , LEE, Junedong
IPC分类号： H01L21/00
CPC分类号： B24B37/30
摘要： The present invention delineates a carrier for an apparatus (10) which polishes a surface of a semiconductor wafer (56, 124). In a preferred embodiment, the carrier includes a rigid plate (34) connected to one or more diaphragms (40, 42) of soft, flexible material that provide pressurizable cavities (50, 52) having respective surfaces for contacting the back surface of the wafer. A plurality of conduits (28a, 28c) are used to selectively pressurize the diaphragm cavities. The carrier head may also include an inter-diaphragm cavity (54) formed between a portion of one diaphragm, a portion of another diaphragm, and the semiconductor wafer. The inter-diaphragm cavity is provided with its own conduit (28b) by which a source of pressurized fluid and a source of vacuum are selectively connected to the inter-diaphragm cavity. During operation, pressure and/or vacuum may be applied through one or more cavities to chuck (90) a wafer, and to pressurize (96) the cavities during polishing.
摘要翻译：本发明描绘了对半导体晶片（56,124）的表面进行抛光的装置（10）的载体。在优选实施例中，载体包括连接到柔性柔性材料的一个或多个隔膜（40,42）的刚性板（34），其提供具有用于接触晶片的后表面的相应表面的可加压空腔（50,52）。多个导管（28a，28c）用于选择性地对隔膜腔加压。载体头还可以包括形成在一个隔膜的一部分，另一个隔膜的一部分和半导体晶片之间的隔膜间腔体（54）。隔膜间腔设置有自己的导管（28b），通过该导管（28b），加压流体源和真空源选择性地连接到隔膜间腔。在操作期间，压力和/或真空可以通过一个或多个空腔施加以卡盘（90）晶片，并且在抛光期间加压（96）空腔。

2. 发明申请

WO0174534A3 A WORKPIECE CARRIER WITH ADJUSTABLE PRESSURE ZONES AND BARRIERS 审中-公开
标题翻译：具有可调节压力区和障碍物的工作载体
公开(公告)号：WO0174534A3
公开(公告)日：2002-02-07
申请号：PCT/US0109099
申请日：2001-03-20
申请人： SPEEDFAM IPEC CORP , KOROVIN NIKOLAY N , SCHULTZ STEPHEN C , HERB JOHN D , FARMER JAMES L
发明人： KOROVIN NIKOLAY N , SCHULTZ STEPHEN C , HERB JOHN D , FARMER JAMES L
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/304 , B24B37/04 , B24B41/06
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus and method are disclosed for planarizing a wafer in a carrier (156) with adjustable pressure zones (111-114) and adjustable barriers (101-104) between zones. The carrier has an independently controlled central zone (111) and concentric surrounding zones (112-114) for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones (111-114) may be created by mounting an elastic web diaphragm (100) to a carrier housing (154) that has a plurality of recesses (111-114). A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses (131-134). The plurality of ring shaped ribs (101-104) thereby defines a central zone surrounded by one or more concentric surrounding zones (112, 114). The zones (111-114) and barriers (101-104) may be individually pressurized by utilizing corresponding fluid communication paths (141-144) during the planarization process.
摘要翻译：公开了一种用于在具有可调压区（111-114）和区之间的可调壁（101-104）的载体（156）中平坦化晶片的装置和方法。载体具有独立控制的中心区域（111）和同心围绕区域（112-114），用于在晶片在化学机械抛光工具中被压靠在研磨表面上时将压力分布在晶片的背面。压力区（111-114）可以通过将弹性腹板隔膜（100）安装到具有多个凹部（111-114）的托架壳体（154）上而形成。相应的多个弹性环形肋可以从腹板隔膜相对于凹槽（131-134）延伸。多个环形肋（101-104）由此限定由一个或多个同心围绕区域（112,114）围绕的中心区域。可以在平坦化过程期间通过利用相应的流体连通路径（141-144）来单独加压区域（111-114）和阻挡层（101-104）。

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