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1. 发明申请

WO2009120414A1 REFLOW SOLDER OVEN WITH COOLING DIFFUSER 审中-公开
标题翻译：用冷却器将反射炉焊接起来
公开(公告)号：WO2009120414A1
公开(公告)日：2009-10-01
申请号：PCT/US2009/033611
申请日：2009-02-10
申请人： ILLINOIS TOOL WORKS INC. , DAUTENHAHN, Jonathan M.
发明人： DAUTENHAHN, Jonathan M.
IPC分类号： B23K1/012
CPC分类号： B23K1/012
摘要： A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.
摘要翻译：用于回流炉的扩散板包括上表面和其中的多个喷嘴开口。多个喷嘴开口中的每一个具有凸起的围绕部分，用于限制扩散板的上表面上的冷凝流体流过喷嘴。排水孔允许上表面上的浓缩流量向下流过板。

2. 发明申请

WO2003061892A1 FLUX COLLECTION METHOD AND SYSTEM 审中-公开
标题翻译：通路采集方法与系统
公开(公告)号：WO2003061892A1
公开(公告)日：2003-07-31
申请号：PCT/US2003/001504
申请日：2003-01-17
申请人： SPEEDLINE TECHNOLOGIES, INC. , MILLER, Richard, W. , DAUTENHAHN, Jonathan, M. , APELL, Marc, C.
发明人： MILLER, Richard, W. , DAUTENHAHN, Jonathan, M. , APELL, Marc, C.
IPC分类号： B23K1/008
CPC分类号： B23K1/008
摘要： Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven. A flux management system includes a cooling chamber having a cooling medium through which the gas passes. The vaporized flux condenses on the surfaces of the cooling chamber and drips into a collection pan, thereby preventing it from dripping onto circuit boards passing through the oven. The flux management system may further include a self-cleaning feature that includes a compressed gas, which is allowed to enter the cooling chamber through a solenoid valve. The compressed gas may then be directed through a heater, which increases the temperature of the cooling chamber, thereby causing a decrease in viscosity of the flux, which allows it to flow freely into a drain tube. The flux may then be transported by gravity into a collection container.
摘要翻译：提供了焊剂管理系统和方法，用于从回流焊炉的气体中过滤蒸发的焊剂。助熔剂管理系统包括具有气体通过的冷却介质的冷却室。蒸发的通量在冷却室的表面冷凝并滴入收集盘，从而防止其滴落在通过烤箱的电路板上。助熔剂管理系统还可以包括自清洁特征，其包括压缩气体，其被允许通过电磁阀进入冷却室。压缩气体然后可以被引导通过加热器，这增加了冷却室的温度，从而导致焊剂的粘度降低，这允许其自由地流入排水管。然后可以通过重力将通量输送到收集容器中。

3. 发明申请

WO2012005997A1 COMPRESSION BOX FOR REFLOW OVEN HEATING AND RELATED METHOD 审中-公开
标题翻译：用于冷却烤箱加热的压缩箱及相关方法
公开(公告)号：WO2012005997A1
公开(公告)日：2012-01-12
申请号：PCT/US2011/041946
申请日：2011-06-27
申请人： ILLINOIS TOOL WORKS INC. , DAUTENHAHN, Jonathan M.
发明人： DAUTENHAHN, Jonathan M.
IPC分类号： B23K1/00 , B23K1/008 , B23K1/012 , H05K3/34
CPC分类号： B23K1/0016 , B23K1/008 , B23K1/012 , H05K3/3494
摘要： A reflow oven chamber assembly (50) that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing (52) disposed within the reflow oven chamber, one or more heating elements (66) disposed in the chamber housing, and one or more compression box assemblies (68) disposed in the chamber housing (52). The compression box assembly (68) includes a compression box housing (74) having an intake port (88, 90) located adjacent the heating element, an intake duct (92) disposed in the compression box (68), and a diffuser plate (86) disposed above the intake duct. The intake duct (92) has an inlet opening (106, 108) in fluid communication with the intake port (88, 90) of the compression box housing (74) and an outlet opening (110). The compression box assembly is configured to draw heated air into the compression box housing from the reflow oven chamber through the intake port and into the inlet opening of the intake duct and exhaust air out of the outlet opening of the intake duct to the diffuser plate. A method of distributing heated air within a reflow soldering oven is further disclosed.
摘要翻译：构造成安装在回流炉的回流炉室内的回流炉室组件（50）包括设置在回流炉室内的室壳体（52），设置在室壳体中的一个或多个加热元件（66）以及设置在腔室壳体（52）中的一个或多个压缩箱组件（68）。压缩箱组件（68）包括压缩箱壳体（74），其具有邻近加热元件定位的进气口（88,90），设置在压缩箱（68）中的进气管道（92）和扩散板 86）设置在进气管的上方。进气管道（92）具有与压缩箱壳体（74）的进气口（88,90）流体连通的入口（106,108）和出口开口（110）。压缩箱组件被构造成将加热的空气从回流炉室通过进气口并且进入进气管道的入口并将排出空气从进气管道的出口开口排出到扩散板。进一步公开了在回流焊炉中分配加热空气的方法。

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