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1. 发明申请

WO2007042336A2 SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE 审中-公开
标题翻译：用于集成设备的基板级组件，其制造工艺以及相关的集成设备
公开(公告)号：WO2007042336A2
公开(公告)日：2007-04-19
申请号：PCT/EP2006064298
申请日：2006-07-14
申请人： ST MICROELECTRONICS SRL , COMBI CHANTAL , VIGNA BENEDETTO , ZIGLIOLI FEDERICO GIOVANNI , BALDO LORENZO , MAGUGLIANI MANUELA , LASALANDRA ERNESTO , RIVA CATERINA
发明人： COMBI CHANTAL , VIGNA BENEDETTO , ZIGLIOLI FEDERICO GIOVANNI , BALDO LORENZO , MAGUGLIANI MANUELA , LASALANDRA ERNESTO , RIVA CATERINA
IPC分类号： B81B7/02
CPC分类号： B81B7/0061 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81C1/0023 , H01L2224/48091 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： In a substrate-level assembly (22), a device substrate (20) of semiconductor material has a top face (20a) and houses a first integrated device (1; 16), in particular provided with a buried cavity (3), formed within the device substrate (20), and with a membrane (4), suspended over the buried cavity (3) in the proximity of the top face (20a). A capping substrate (21) is coupled to the device substrate (20) above the top face (20a) so as to cover the first integrated device (1; 16), in such a manner that a first empty space (25) is provided above the membrane (4). Electrical-contact elements (28a, 28b) electrically connect the integrated device (1; 16) with the outside of the substrate-level assembly (22). In one embodiment, the device substrate (20) integrates at least a further integrated device (1', 10) provided with a respective membrane (4'); and a further empty space (25'), fluidically isolated from the first empty space (25), is provided over the respective membrane (4') of the further integrated device (1', 10).
摘要翻译：在衬底级组件（22）中，半导体材料的器件衬底（20）具有顶面（20a）并容纳第一集成器件（1; 16），所述第一集成器件特别设置有埋入腔（3）在器件衬底（20）内并且具有在顶面（20a）附近悬置在掩埋腔（3）上的膜（4）。封盖衬底（21）在顶面（20a）上方与器件衬底（20）耦合，以便以这样的方式覆盖第一集成器件（1; 16）：提供第一空的空间（25）在膜（4）上方。电接触元件（28a，28b）将集成装置（1; 16）与衬底级组件（22）的外部电连接。在一个实施例中，所述装置基底（20）集成了至少另一个集成装置（1'，10），所述集成装置设置有相应的膜（4'）; 并且在另一集成装置（1'，10）的相应的膜（4'）上设置与第一空的空间（25）流体隔离的另一个空的空间（25'）。

2. 发明申请

WO2008089969A3 ELECTRONIC DEVICE COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES 审中-公开
标题翻译：包含差分传感器MEMS器件和钻孔基板的电子器件
公开(公告)号：WO2008089969A3
公开(公告)日：2008-12-31
申请号：PCT/EP2008000495
申请日：2008-01-23
申请人： ST MICROELECTRONICS SRL , BALDO LORENZO , COMBI CHANTAL , CORTESE MARIO FRANCESCO
发明人： BALDO LORENZO , COMBI CHANTAL , CORTESE MARIO FRANCESCO
IPC分类号： B81B7/00 , G01D11/24 , G01L9/00 , G01L13/02
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2201/0264 , B81C2203/0154 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).
摘要翻译：电子设备（1,1a，1b，1c，1d，1e）包括：设置有至少一个通过开口（5）的基板（2），具有差动传感器功能的MEMS装置（7）第二表面（9,10），并且包括对与其第一和第二相对的有效表面（11a，11b）相对应存在的流体的化学和/或物理变化敏感的至少一个部分（11）的类型，离开第一有源表面（11a）的MEMS器件（7）的第一表面（9）暴露，并且第二表面（10）设置有暴露所述第二相对的有效表面（11b）的另外的开口（12），电子其特征在于，所述MEMS器件（7）的所述第一表面（9）面向所述基板（2）并且与所述第一表面（9）隔开预定距离，所述敏感部分（11）与所述基板通过基板（2）的开口（5），并且还包括：保护封装（14,14a，14b），其中至少部分地将MEMS器件（7）和衬底（2）并入，以使得分别暴露于衬底（2）的通过开口（5）的第一和第二相对的有效表面（11a，11b）和进一步打开第二表面（10）的开口（12）。

3. 发明申请

WO2008089969A2 ELECTRONIC DEVICE COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES 审中-公开
标题翻译：包含微分传感器MEMS器件和钻孔衬底的电子器件
公开(公告)号：WO2008089969A2
公开(公告)日：2008-07-31
申请号：PCT/EP2008/000495
申请日：2008-01-23
申请人： STMICROELECTRONICS S.R.L. , BALDO, Lorenzo , COMBI, Chantal , CORTESE, Mario, Francesco
发明人： BALDO, Lorenzo , COMBI, Chantal , CORTESE, Mario, Francesco
IPC分类号： B81B7/00 , G01L9/00 , G01L13/02 , G01D11/24
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2201/0264 , B81C2203/0154 , G01L19/141 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).
摘要翻译：一种电子装置（1,1a，1b，1c，1d，1e），包括：设置有至少一个通过开口（5）的衬底（2），具有功能的MEMS装置（7），所述差动传感器设置有第一和第二表面（9,10），并且所述类型包括至少一个对与第一和第二相对的有效表面相对应的流体的化学和/或物理变化敏感的部分（11）（11a，11b），所述MEMS器件（7）的第一表面（9）离开所述第一有源表面（11a）并且所述第二表面（10）设置有另一开口（12），所述另一开口（12）暴露所述第二对置所述电子装置（1,1d，1e）的特征在于，所述MEMS装置（7）的所述第一表面（9）面向所述衬底（2）且与所述衬底（2）隔开预定距离，所述敏感表面部分（11）与衬底（2）的通过开口（5）对准，并且其还包括：保护包装（14，，其至少部分地并入MEMS器件（7）和衬底（2），从而使第一和第二相对的有源表面（11a，11b）分别暴露于衬底的通过开口（5）（2）和第二表面（10）的另一开口（12）。

4. 发明申请

WO2007042336A3 SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE 审中-公开
公开(公告)号：WO2007042336A3
公开(公告)日：2007-04-19
申请号：PCT/EP2006/064298
申请日：2006-07-14
申请人： STMicroelectronics S.r.l. , COMBI, Chantal , VIGNA, Benedetto , ZIGLIOLI, Federico Giovanni , BALDO, Lorenzo , MAGUGLIANI, Manuela , LASALANDRA, Ernesto , RIVA, Caterina
发明人： COMBI, Chantal , VIGNA, Benedetto , ZIGLIOLI, Federico Giovanni , BALDO, Lorenzo , MAGUGLIANI, Manuela , LASALANDRA, Ernesto , RIVA, Caterina
IPC分类号： B81B7/02 , B81B7/00
摘要： In a substrate-level assembly (22), a device substrate (20) of semiconductor material has a top face (20a) and houses a first integrated device (1; 16), in particular provided with a buried cavity (3), formed within the device substrate (20), and with a membrane (4), suspended over the buried cavity (3) in the proximity of the top face (20a). A capping substrate (21) is coupled to the device substrate (20) above the top face (20a) so as to cover the first integrated device (1; 16), in such a manner that a first empty space (25) is provided above the membrane (4). Electrical-contact elements (28a, 28b) electrically connect the integrated device (1; 16) with the outside of the substrate-level assembly (22). In one embodiment, the device substrate (20) integrates at least a further integrated device (1', 10) provided with a respective membrane (4'); and a further empty space (25'), fluidically isolated from the first empty space (25), is provided over the respective membrane (4') of the further integrated device (1', 10).

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