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1. 发明申请

WO2004016833A3 ELECTROCHEMICAL SCALE INHIBITION 审中-公开
标题翻译：电化学尺寸抑制
公开(公告)号：WO2004016833A3
公开(公告)日：2004-07-08
申请号：PCT/CA0301200
申请日：2003-08-11
申请人： ALCAN INT LTD , BREAULT RAYMOND
发明人： BREAULT RAYMOND
IPC分类号： C25F1/04 , C23F13/02
CPC分类号： C23F13/02
摘要： The invention relates to a process of reducing scaling of a metal surface exposed to an aqueous solution from which scale may form after a period of exposure. The process comprises applying a cathodic potential to the surface for at least some of the period of exposure. In some cases, e.g. when an article is made of a ferrous metal, it is advantageous to coat the article with a different metal (e.g. copper or an alloy of copper) before applying the cathodic potential to avoid hydrogen generation and excessive current flow. An article to be protected from scaling may also advantageously be electrically isolated from other parts of an apparatus.
摘要翻译：本发明涉及一种降低暴露于水溶液中的金属表面的垢的方法，其在暴露一段时间后可形成氧化皮。该方法包括在暴露周期的至少一些期间向表面施加阴极电位。在某些情况下，例如当物品由黑色金属制成时，在施加阴极电位之前，用不同的金属（例如铜或铜的合金）涂覆制品是有利的，以避免产生氢气和过量的电流。要防止结垢的物品也可以有利地与设备的其它部分电隔离。

2. 发明申请

WO2004016833A2 ELECTROCHEMICAL SCALE INHIBITION 审中-公开
标题翻译：电化学阻垢
公开(公告)号：WO2004016833A2
公开(公告)日：2004-02-26
申请号：PCT/CA2003/001200
申请日：2003-08-11
申请人： ALCAN INTERNATIONAL LIMITED , BREAULT, Raymond
发明人： BREAULT, Raymond
IPC分类号： C25F1/04
CPC分类号： C23F13/02
摘要： The invention relates to a process of reducing scaling of a metal surface exposed to an aqueous solution from which scale may form after a period of exposure. The process comprises applying a cathodic potential to the surface for at least some of the period of exposure. In some cases, e.g. when an article is made of a ferrous metal, it is advantageous to coat the article with a different metal (e.g. copper or an alloy of copper) before applying the cathodic potential to avoid hydrogen generation and excessive current flow. An article to be protected from scaling may also advantageously be electrically isolated from other parts of an apparatus.
摘要翻译：本发明涉及一种减少暴露于水溶液中的金属表面的结垢的方法，所述水溶液在暴露一段时间后可能形成水垢。该方法包括在暴露的至少一段时间内对表面施加阴极电位。在某些情况下，例如当制品由黑色金属制成时，在施加阴极电位以避免氢气产生和过量电流流动之前，用不同金属（例如铜或铜合金）涂覆制品是有利的。要防止结垢的物品也可以有利地与装置的其他部分电隔离。

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