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1. 发明申请

WO2011036150A1 METHOD FOR CONNECTING AT LEAST ONE WIRE CONDUCTOR DISPOSED ON A SUBSTRATE WITH A CHIP OF A TRANSPONDER UNIT 审中-公开
标题翻译：将基底处理的至少一根导线连接到传感器单元的芯片上的方法
公开(公告)号：WO2011036150A1
公开(公告)日：2011-03-31
申请号：PCT/EP2010/063898
申请日：2010-09-21
申请人： ATS AUTOMATION TECHNOLOGY SERVICES , HYNES, Fergus , FINLAY, Garreth
发明人： HYNES, Fergus , FINLAY, Garreth
IPC分类号： G06K19/077 , H05K1/18
CPC分类号： G06K19/07749 , G06K19/0775 , H05K1/184 , H05K3/103 , H05K3/328 , H05K2201/0382 , H05K2201/0394 , H05K2201/10287 , H05K2201/10727
摘要： Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).
摘要翻译：用于将至少一个线导体（6）与芯片模块（5）的至少一个终端装置（22a，22b）连接起来用于产生包括线圈装置（2）和所述芯片模块（5）的应答器装置（1）的方法），其中，在第一方法步骤中，线圈装置（2）被布置并固定在基板（3）上，并且在另一方法步骤中，线圈装置（2）的导线（6）被连接所述芯片模块（5）的特征在于，在所述第一方法步骤期间，所述导线（6）的端部（7a，7b）被放置成以间隔开的方式延伸穿过所述容纳窗（4）在用于芯片模块（5）的容纳窗（4）的中心区域（Z）中，延伸穿过容纳窗（4）的导线（6）的部分区域（8a，8b）从所述中心区域（Z）通过定位装置（3）朝向容纳窗（4）的对应边缘（23a，23b）延伸，直到部分区域（8a，8b）的至少一部分延伸在端子区域（22a，22b）的期望位置之后，芯片模块（5）随后插入容纳窗口（4）中，然后将该部分与端子区域（22a，22b）以导电方式连接，。

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