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1. 发明申请

WO2009088862A3 SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS 审中-公开
标题翻译：使用气流分流器冷却电子设备的系统和方法
公开(公告)号：WO2009088862A3
公开(公告)日：2010-02-25
申请号：PCT/US2008088542
申请日：2008-12-30
申请人： APPLE INC , ALI IHAB A , MATHEW DINESH , WILSON THOMAS W JR , HENDREN KEITH
发明人： ALI IHAB A , MATHEW DINESH , WILSON THOMAS W JR , HENDREN KEITH
IPC分类号： G06F1/20 , H01L23/34
CPC分类号： G06F1/203 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.
摘要翻译：电子设备可以设置有用于散热的发热部件和冷却模块。在一些实施例中，冷却部件可以包括构造成产生空气流出的风扇，以及分配器，其不仅构造成在分隔器的第一表面和发热部件之间引导流出物的第一部分，而且还沿着分隔器的第二表面引导流出物的第二部分。在其他实施例中，冷却部件可以包括分隔器和压力夹。压力夹的第一部分可以构造成在分隔器的第一表面上施加压力，使得压力可以保持分隔器的第二表面的一部分与发热部件接触。

2. 发明申请

WO2008057706A3 EMBEDDED THERMAL-ELECTRIC COOLING MODULES FOR SURFACE SPREADING OF HEAT 审中-公开
标题翻译：用于表面热膨胀的嵌入式热电冷却模块
公开(公告)号：WO2008057706A3
公开(公告)日：2008-07-03
申请号：PCT/US2007081042
申请日：2007-10-11
申请人： APPLE INC , ALI IHAB A
发明人： ALI IHAB A
IPC分类号： G06F1/20
CPC分类号： G06F1/203
摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.
摘要翻译：便携式计算设备包括具有外表面和内表面的外壳。计算装置中的固态冷却机构联接到内表面。该固态冷却机构被配置为保持外表面的至少一部分上的温度差小于预定值。

3. 发明申请

WO2008067046A1 ENHANCED VENT FOR OUTLET FOR A COOLING SYSTEM 审中-公开
标题翻译：用于冷却系统的出风口的增强通风口
公开(公告)号：WO2008067046A1
公开(公告)日：2008-06-05
申请号：PCT/US2007/081039
申请日：2007-10-11
申请人： APPLE INC. , ALI, Ihab A. , NIGEN, Jay S.
发明人： ALI, Ihab A. , NIGEN, Jay S.
IPC分类号： G06F1/20
CPC分类号： G06F1/203
摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver to pump heat from inside an enclosed area to outside of the enclosed area. The first fluid-flow port accommodates a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.
摘要翻译：冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。第一热交换器包括强制流体驱动器，以将热量从封闭区域内部排出到封闭区域的外部。第一流体流动口容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。注意，第一流体流动端口和第二流体流动端口近似共面。此外，给定的流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处较小的相关横截面面积，其在封闭区域的外部比在给定流体的边缘处更接近 -flow端口靠近封闭区域的内部。

4. 发明申请

WO2008054969A1 THIN, PASSIVE COOLING SYSTEM 审中-公开
标题翻译：薄，被动冷却系统
公开(公告)号：WO2008054969A1
公开(公告)日：2008-05-08
申请号：PCT/US2007/081041
申请日：2007-10-11
申请人： APPLE INC. , ALI, Ihab A.
发明人： ALI, Ihab A.
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , H05K7/20481 , H05K7/20518
摘要： A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.
摘要翻译：系统包括电源和封闭电源的隔热机构。该热屏蔽机构包括限定电源所在的空腔的三维壳体，以及定位成覆盖由壳体的边缘限定的空腔的开口的板。注意，壳体包含三层，其中第二层夹在第一层和第三层之间。该第二层具有第一各向异性热导率。此外，该板包括具有第二各向异性热导率的材料。

5. 发明申请

WO2009088862A2 SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS 审中-公开
标题翻译：使用气流分流器冷却电子设备的系统和方法
公开(公告)号：WO2009088862A2
公开(公告)日：2009-07-16
申请号：PCT/US2008/088542
申请日：2008-12-30
申请人： APPLE INC. , ALI, Ihab, A. , MATHEW, Dinesh , WILSON, Thomas, W., Jr. , HENDREN, Keith
发明人： ALI, Ihab, A. , MATHEW, Dinesh , WILSON, Thomas, W., Jr. , HENDREN, Keith
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.
摘要翻译：电子设备可以设置有用于散热的发热部件和冷却模块。在一些实施例中，冷却部件可以包括构造成产生空气流出的风扇，以及分配器，其不仅构造成在分隔器的第一表面和发热部件之间引导流出物的第一部分，而且还沿着分隔器的第二表面引导流出物的第二部分。在其他实施例中，冷却部件可以包括分隔器和压力夹。压力夹的第一部分可以构造成在分隔器的第一表面上施加压力，使得压力可以保持分隔器的第二表面的一部分与发热部件接触。

6. 发明申请

WO2008150596A3 NOTEBOOK COMPUTER WITH HYBRID DIAMOND HEAT SPREADER 审中-公开
标题翻译：笔记本电脑与混合金刚石散热器
公开(公告)号：WO2008150596A3
公开(公告)日：2009-03-12
申请号：PCT/US2008061797
申请日：2008-04-28
申请人： APPLE INC , ALI IHAB A , LIANG FRANK F , HERESZTYN AMAURY
发明人： ALI IHAB A , LIANG FRANK F , HERESZTYN AMAURY
IPC分类号： H01L23/373
CPC分类号： H01L23/3732 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.
摘要翻译：描述设备的实施例。该装置包括集成电路和耦合到集成电路的散热器。该散热器包括碳的同素异形体的第一层。注意，碳的同素异形体具有大致的面心立方晶体结构。此外，碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

7. 发明申请

WO2008150596A2 NOTEBOOK COMPUTER WITH HYBRID DIAMOND HEAT SPREADER 审中-公开
标题翻译：笔记本电脑与混合金刚石散热器
公开(公告)号：WO2008150596A2
公开(公告)日：2008-12-11
申请号：PCT/US2008/061797
申请日：2008-04-28
申请人： APPLE INC. , ALI, Ihab A. , LIANG, Frank F. , HERESZTYN, Amaury
发明人： ALI, Ihab A. , LIANG, Frank F. , HERESZTYN, Amaury
IPC分类号： H01L23/373 , G06F1/16
CPC分类号： H01L23/3732 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.
摘要翻译：描述设备的实施例。该装置包括集成电路和耦合到集成电路的散热器。该散热器包括碳的同素异形体的第一层。注意，碳的同素异形体具有大致的面心立方晶体结构。此外，碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

8. 发明申请

WO2008057706A2 EMBEDDED THERMAL-ELECTRIC COOLING MODULES FOR SURFACE SPREADING OF HEAT 审中-公开
标题翻译：嵌入式热电冷却模块用于热表面扩散
公开(公告)号：WO2008057706A2
公开(公告)日：2008-05-15
申请号：PCT/US2007/081042
申请日：2007-10-11
申请人： APPLE INC. , ALI, Ihab A.
发明人： ALI, Ihab A.
IPC分类号： G06F1/20
CPC分类号： G06F1/203
摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.
摘要翻译：便携式计算设备包括具有外表面和内表面的壳体。计算装置中的固态冷却机构联接到内表面。该固态冷却机构被配置为保持横跨外表面的至少一部分的温度差小于预定值。

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