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1. 发明申请

WO2020123122A1 INTEGRATION OF MATERIALS REMOVAL AND SURFACE TREATMENT IN SEMICONDUCTOR DEVICE FABRICATION 审中-公开
公开(公告)号：WO2020123122A1
公开(公告)日：2020-06-18
申请号：PCT/US2019/062740
申请日：2019-11-22
申请人： MATTSON TECHNOLOGY, INC. , BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD.
发明人： YANG, Michael , CHUNG, Hua , LU, Xinliang , LI, Haochen , XIE, Ting , ZHANG, Qi
IPC分类号： H01L21/02 , H01J37/32 , H01L21/285 , H01L21/3213 , H01L21/67
摘要： Processes for surface treatment of a workpiece are provided. In one example implementation, organic radicals (e.g., methyl CH 3 radicals) can be generated by exciting and/or dissociating hydrogen and/or inert gas (e.g., Ar, He, etc) molecules in a remote plasma source and a subsequent reaction with organic molecule (alkanes and alkenes). The organic radicals (e.g., methyl CH 3 radicals) can be exposed to the silicon and/or silicon germanium surfaces. After exposure to the organic radicals, the silicon and/or silicon germanium surfaces can be stable in air for a time period (e.g., days) with reduced surface oxidation such that the silicon and/or silicon germanium surfaces can be effectively protected from oxidation. As such, native surface oxide removal process before subsequent process steps can be eliminated.

2. 发明申请

WO2020040850A1 HIGH PERFORMANCE ANTENNAS FOR SMART APPLIANCES 审中-公开
公开(公告)号：WO2020040850A1
公开(公告)日：2020-02-27
申请号：PCT/US2019/037651
申请日：2019-06-18
申请人： AVX ANTENNA INC. D/B/A ETHERTRONICS INC.
发明人： KENNEDY, Chris
IPC分类号： H01Q1/38 , H01Q1/24
摘要： High performance antennas for smart appliances are described herein. An antenna for use with a smart controller for an appliance can include a length of memory metal. The antenna can be configured to maintain the length while undisturbed, deform while under external stress, and return to or near to the length after deformation. Additionally, one end of the length of memory metal is in operative communication with a communication circuit associated with the smart controller.

3. 发明申请

WO2019182940A1 SUPPORT PLATE FOR LOCALIZED HEATING IN THERMAL PROCESSING SYSTEMS 审中-公开
公开(公告)号：WO2019182940A1
公开(公告)日：2019-09-26
申请号：PCT/US2019/022681
申请日：2019-03-18
申请人： MATTSON TECHNOLOGY, INC.
发明人： BREMENSDORFER, Rolf , KEPPLER, Johannes , YANG, Michael X. , HULSMANN, Thorsten
IPC分类号： H01L21/67 , H01L21/683 , H01L21/687
摘要： Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., arears proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.

4. 发明申请

WO2019089576A1 ANTIMICROBIAL BACKLIT DEVICE 审中-公开
公开(公告)号：WO2019089576A1
公开(公告)日：2019-05-09
申请号：PCT/US2018/058188
申请日：2018-10-30
申请人： HUBBELL INCORPORATED
发明人： WEEKS, JR., Thomas Warren , VELTRI, Thomas James , WOLF, John Lawrence , NICKLES, Blake Ashton , BAILEY, Christopher Lane
IPC分类号： A61L2/08
摘要： Antimicrobial backlit devices and methods are provided. In one example embodiment, a device can have an antimicrobial lighting system. The antimicrobial lighting system includes a light source associated with a display device. The light source includes a plurality of lighting elements. One or more of the lighting elements of the plurality of lighting elements can be configured to emit high intensity narrow spectrum (HINS) light proximate the display device (e.g., onto or through the display device).

5. 发明申请

WO2019070404A1 SURFACE TREATMENT OF SILICON AND CARBON CONTAINING FILMS BY REMOTE PLASMA WITH ORGANIC PRECURSORS 审中-公开
公开(公告)号：WO2019070404A1
公开(公告)日：2019-04-11
申请号：PCT/US2018/051714
申请日：2018-09-19
申请人： MATTSON TECHNOLOGY, INC.
发明人： YANG, Michael X. , CHUNG, Hua , LU, Xinliang
IPC分类号： H01L21/306 , H01L21/02
摘要： Surface treatment processes for treating low-k dielectric materials are provided. One example implementation can include a method for processing a workpiece. The workpiece can include a silicon and carbon containing film material. The method can include treating the workpiece with a surface treatment process. The surface treatment process can include generating one or more species in a first chamber; mixing one or more hydrocarbon molecules with the species to create a mixture comprising one or more organic radicals; and exposing the silicon and carbon containing layer on the workpiece to the mixture in a second chamber.

6. 发明申请

WO2019005568A1 BALANCING CIRCUIT FOR AN ULTRACAPACITOR MODULE 审中-公开
公开(公告)号：WO2019005568A1
公开(公告)日：2019-01-03
申请号：PCT/US2018/038671
申请日：2018-06-21
申请人： AVX CORPORATION
发明人： HOCK, Joseph M.
IPC分类号： H01G11/16
摘要： Balancing circuits for an ultracapacitor module are provided. In some implementations, the balancing circuit can include a comparator. The comparator can have a sensing input. The comparator can be configured to compare an input voltage associated with the ultracapacitor received at the sensing input to a reference voltage and to provide an output via an output node of the comparator. The balancing circuit can include a switching circuit coupled to the ultracapacitor. The switching circuit can be controlled to discharge the ultracapacitor based at least in part on the output of the comparator circuit. The balancing circuit can further include a feedback element coupled between the switching circuit and the sensing input of the comparator.

7. 发明申请

WO2018052494A1 STRIP PROCESS FOR HIGH ASPECT RATIO STRUCTURE 审中-公开
标题翻译：高纵横比结构的条形工艺
公开(公告)号：WO2018052494A1
公开(公告)日：2018-03-22
申请号：PCT/US2017/033047
申请日：2017-05-17
申请人： MATTSON TECHNOLOGY, INC.
发明人： VANIAPURA, Vijay M. , MA, Shawming , HOU, Li
IPC分类号： H01L21/033 , H01L21/3065 , H01L21/02
摘要： Processes for removing a mask layer (e.g., doped amorphous carbon mask layer) from a substrate with high aspect ratio structures are provided. In one example implementation, a process can include depositing a polymer layer on at least a portion of a top end of a high aspect ratio structure on a substrate. The process can further include removing at least a portion of the polymer layer and the doped amorphous carbon film form the substrate using a plasma strip process. In example embodiments, depositing a polymer layer can include plugging one or more high aspect ratio structures with the polymer layer. In example embodiments, depositing a polymer layer can include forming a polymer layer on a sidewall of one or more high aspect ratio structures.
摘要翻译：提供了用于从具有高纵横比结构的衬底去除掩模层（例如，掺杂的无定形碳掩模层）的工艺。在一个示例实施方式中，工艺可以包括在衬底上的高纵横比结构的顶端的至少一部分上沉积聚合物层。该工艺可以进一步包括使用等离子剥离工艺去除至少一部分聚合物层和掺杂的无定形碳膜形成衬底。在示例实施例中，沉积聚合物层可以包括用聚合物层堵塞一个或多个高纵横比结构。在示例实施例中，沉积聚合物层可以包括在一个或多个高纵横比结构的侧壁上形成聚合物层。

8. 发明申请

WO2018034715A1 SEPARATION GRID FOR PLASMA CHAMBER 审中-公开
标题翻译：等离子室分离格
公开(公告)号：WO2018034715A1
公开(公告)日：2018-02-22
申请号：PCT/US2017/031847
申请日：2017-05-10
申请人： MATTSON TECHNOLOGY, INC.
发明人： VANIAPURA, Vijay M. , MA, Shawming , NAGORNY, Vladimir , PAKULSKI, Ryan M.
IPC分类号： H01J37/32
CPC分类号： H01J37/3244 , H01J37/32357 , H01J37/32422 , H01J37/32522 , H01J37/32623 , H01J37/32724 , H01J2237/32 , H01L21/67248
摘要： Separation grids for plasma processing apparatus are provided. In some embodiments, a plasma processing apparatus includes a plasma chamber. The plasma processing apparatus includes a processing chamber. The processing chamber can be separated from the plasma chamber. The apparatus can include a separation grid. The separation grid can separate the plasma chamber and the processing chamber. The apparatus can include a temperature control system. The temperature control system can be configured to regulate the temperature of the separation grid to affect a uniformity of a plasma process on a substrate. In some embodiments, a separation grid can have a varying thickness profile across a cross-section of the separation grid to affect a flow of neutral species through the separation grid.
摘要翻译：提供了等离子体处理设备的分离栅格。在一些实施例中，等离子体处理设备包括等离子体室。等离子体处理装置包括处理室。处理室可以与等离子体室分离。该设备可以包括分离网格。分离栅格可以分离等离子体室和处理室。该设备可以包括温度控制系统。温度控制系统可以被配置为调节分离栅格的温度以影响衬底上的等离子体处理的均匀性。在一些实施方式中，分离格栅可以在分离格栅的横截面上具有变化的厚度分布，以影响通过分离格栅的中性物质的流动。

9. 发明申请

WO2017147122A1 CONFIGURABLE LIGHTING SYSTEM 审中-公开
标题翻译：可配置的照明系统
公开(公告)号：WO2017147122A1
公开(公告)日：2017-08-31
申请号：PCT/US2017/018827
申请日：2017-02-22
申请人： HUBBELL INCORPORATED
发明人： BAILEY, Chris , YADAV, Pritam
IPC分类号： H05B37/02 , A61B5/00 , H05B33/00 , H05B33/08 , H05B37/00
CPC分类号： H05B37/0281 , H05B33/0872 , H05B37/0272 , Y02B20/42
摘要： Apparatus, systems, and methods for controlling light output in a lighting system based on defined light profiles are provided. In one example implementation, a light fixture can include a first light emitting diode (LED) array having one or more LED light sources and a second LED array having one or more LED light sources. The light fixture can include a power circuit configured to provide power to the first LED array and the second LED array according to a power distribution among the first LED array and the second LED array. The light fixture can include one or more control devices configured to control the power circuit to adjust the power distribution among the first LED array and the second LED array based at least in part on a signal indicative of a real time clock and a defined light profile associated with a user identified to be present in a space illuminated by the light fixture.
摘要翻译：提供了用于基于定义的光分布来控制照明系统中的光输出的装置，系统和方法。在一个示例实施方式中，灯具可以包括具有一个或多个LED光源的第一发光二极管（LED）阵列和具有一个或多个LED光源的第二LED阵列。灯具可以包括电力电路，该电力电路被配置为根据第一LED阵列和第二LED阵列之间的电力分配向第一LED阵列和第二LED阵列提供电力。灯具可以包括一个或多个控制装置，其被配置为控制电力电路以至少部分地基于指示实时时钟和限定的光轮廓的信号来调整第一LED阵列和第二LED阵列之间的功率分布与被识别出现在由灯具照亮的空间中的用户相关联。

10. 发明申请

WO2017139589A3 TOGGLE CONTROL FOR LIGHTING SYSTEM 审中-公开
公开(公告)号：WO2017139589A3
公开(公告)日：2017-08-17
申请号：PCT/US2017/017389
申请日：2017-02-10
申请人： HUBBELL INCORPORATED
发明人： YADAV, Pritam , WEEKS, JR., T. Warren , HAMILTON, Douglas M.
IPC分类号： F21L4/02 , H05B33/08
摘要： Lighting systems and methods implementing toggle control are provided. In one example implementation, a lighting system can include a first LED array having one or more LED devices and a second LED array having one or more LED devices. The system can further include a single throw circuit interrupter configured to receive power from a power source. The system can further include a power conversion circuit configured to convert an input power received via the toggle switch to a power output for the first LED array and the second LED array. The power conversion circuit can be configured to control a power distribution ratio between the first LED array and the second LED array based at least in part on a detected toggle input (e.g., a toggle pattern) implemented using the single throw circuit interrupter.

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