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    • 7. 发明申请
    • MICRO-STRUCTURED OPTICALLY CLEAR ADHESIVES
    • 微结构光学清洁粘合剂
    • WO2013062996A1
    • 2013-05-02
    • PCT/US2012/061528
    • 2012-10-24
    • 3M INNOVATIVE PROPERTIES COMPANYSUWA, ToshihiroEVERAERTS, Albert I.MIKAMI, HaruyukiKINOSHITA, Yasuhiro
    • SUWA, ToshihiroEVERAERTS, Albert I.MIKAMI, HaruyukiKINOSHITA, Yasuhiro
    • C09J5/00C09J7/00
    • C09J5/06C09J7/00C09J7/29Y10T156/10Y10T428/24479Y10T428/24612
    • A micro-structured optically clear adhesive, including a first major surface and a second major surface, wherein at least one of the first and second major surfaces comprises a micro- structured surface of interconnected micro-structures in at least one of the planar dimensions (x-y), is disclosed. The micro-structured optically clear adhesive has a tan delta value of at least about 0.3 at a lamination temperature and is non-crosslinked or lightly crosslinked. The micro- structured surface may include indentations having a depth of between about 5 and about 80 microns. A method of laminating a first substrate and a second substrate without the use of a vacuum is provided. The method includes providing a micro-structured optically clear adhesive, removing a release liner from a first side of the micro-structured optically clear adhesive, contacting the first side of the micro-structured optically clear adhesive with a surface of the first substrate, removing a micro-structured release liner from a second side of the micro-structured optically clear adhesive to expose a micro-structured surface, and contacting the micro- structured surface with a surface of the second substrate.
    • 一种微结构光学透明粘合剂,包括第一主表面和第二主表面,其中第一和第二主表面中的至少一个包括至少一个平面尺寸的互连微结构的微结构化表面( xy)。 微结构光学透明粘合剂在层压温度下具有至少约0.3的tanδ值,并且是非交联或轻度交联的。 微结构化表面可以包括深度在约5-约80微米之间的凹陷。 提供了不使用真空层压第一基板和第二基板的方法。 该方法包括提供微结构光学透明粘合剂,从微结构光学透明粘合剂的第一侧移除释放衬垫,将微结构光学透明粘合剂的第一侧与第一衬底的表面接触,除去 微结构的释放衬垫,其从所述微结构光学透明粘合剂的第二侧暴露微结构化表面,并使所述微结构化表面与所述第二衬底的表面接触。