会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明申请
    • INTERCOM SYSTEM HAVING NETWORKING FUNCTIONALITY
    • 具有网络功能的对讲系统
    • WO2006107058A1
    • 2006-10-12
    • PCT/JP2006/307165
    • 2006-03-29
    • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.CHEN, Po-FeiCHANG, Wen-Yao
    • CHEN, Po-FeiCHANG, Wen-Yao
    • H04M11/02H04L12/28
    • H04M11/025
    • An intercom system having networking functionality includes a door intercom device (1), a registration unit (3), a transmission unit (4), and a controller (2). The door intercom device (1) includes a button, a microphone and a speaker, and generates a trigger signal upon operation of the button by a visitor. The registration unit (3) is for storing a list of end terminals having networking functionality and their network identification data. The transmission unit (4) is for establishing a network connection with the end terminals (5), and is capable of exchanging voice signals with the end terminals under the control of the controller. Upon receipt of the trigger signal, the controller searches the list in the registration unit, and commands the transmission unit to activate a connection with a corresponding end terminal in the list. After the connection is established, the visitor can communicate with the user of the end terminal through the door intercom device.
    • 具有网络功能的对讲系统包括门对讲设备(1),注册单元(3),传输单元(4)和控制器(2)。 门对讲设备(1)包括按钮,麦克风和扬声器,并且在访问者操作按钮时产生触发信号。 注册单元(3)用于存储具有网络功能的终端终端及其网络识别数据的列表。 发送单元(4)用于与终端(5)建立网络连接,并且能够在控制器的控制下与终端交换语音信号。 在接收到触发信号时,控制器在注册单元中搜索列表,并命令传输单元激活与列表中对应的终端的连接。 建立连接后,访问者可以通过门对讲设备与终端终端的用户进行通信。
    • 10. 发明申请
    • MANUFACTURING METHOD FOR SEMICONDUCTOR CHIPS
    • 半导体晶片的制造方法
    • WO2006068284A1
    • 2006-06-29
    • PCT/JP2005/023991
    • 2005-12-21
    • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.ARITA, KiyoshiNAKAGAWA, Akira
    • ARITA, KiyoshiNAKAGAWA, Akira
    • H01L21/78H01L21/68H01L23/544
    • H01L21/6835H01L21/78H01L22/32
    • The semiconductor chip manufacturing process is carried out in processes including a protective sheet sticking process for sticking a protective sheet onto a first surface of a semiconductor wafer so that the sheet comes in contact with the TEG, a mask placing process for placing a mask on a second surface that is a surface opposite from the first surface, a plasma etching process for performing plasma etching from the second surface to remove portions corresponding to dividing regions and separate device-formation-regions into individual semiconductor chips, and a TEG removing process for removing the TEG in a state where it remains unremoved in the dividing regions and stuck to the protective sheet together with the protective sheet by peeling off the protective sheet.
    • 半导体芯片制造工艺在包括用于将保护片粘贴到半导体晶片的第一表面上的保护片粘附工艺的工艺中进行,以使片材与TEG接触,用于将掩模放置在掩模上的掩模放置工艺 第二表面,其是与第一表面相对的表面;等离子体蚀刻工艺,用于从第二表面执行等离子体蚀刻,以将与分割区域相对应的部分和分离的器件形成区域分离成单独的半导体芯片;以及TEG去除工艺,用于去除 TEG处于分割区域中不会被移除的状态,并且通过剥离保护片而与保护片一起粘在保护片上。