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    • 81. 发明申请
    • HOT MELT ADHESIVE FORMULATION HEAT CURABLE BY EPOXY CROSSLINKING
    • 环氧交联固化热熔胶粘剂配方热量
    • WO9112293A3
    • 1991-10-03
    • PCT/US9100815
    • 1991-02-06
    • EXXON CHEMICAL PATENTS INC
    • TSE MUN FU
    • C09J123/08C09J123/26
    • C09J123/26C08L2666/22C08L2666/34C09J123/08Y10S525/936
    • A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an alpha , beta -ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.
    • 公开了一种可热固化的热熔粘合剂体系。 该体系使用环氧交联乙烯聚合物组分,与其相容的增粘剂和环氧官能度至少为2的环氧交联剂。乙烯聚合物组分可以是α,β-烯键式不饱和羧酸的乙烯共聚物, 或与二羧酸酐组合使用的烯属不饱和醇的乙烯共聚物。 二羧酸酐和/或环氧树脂可以被封装以抑制过早交联。 该配制剂在中等温度下作为热熔体施加到基材表面,随后通过将粘合剂组合物加热到更高的固化温度而固化。