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    • 63. 发明申请
    • LED LIGHTING FIXTURE AND LIGHTING APPARATUS USING SAME
    • LED照明设备和照明设备
    • WO2011090311A3
    • 2011-11-10
    • PCT/KR2011000384
    • 2011-01-19
    • MYUNG BEOM-YOUNG
    • MYUNG BEOM-YOUNG
    • F21V29/00
    • F21V29/76F21S4/28F21V29/2212F21V29/745F21V29/75F21V29/763F21V29/767F21Y2103/10F21Y2115/10
    • Disclosed are an LED lighting fixture and a lighting apparatus using same. A heat transfer filler fills the entirety of the empty space in a light-source-accommodating unit of a heat sink which accommodates an LED light source unit. In addition, a transparent thermally conductive material is applied onto a front light-emitting surface of an LED device to close a light-emitting opening formed in the light-source-accommodating unit. A portion of the heat generated by the LED device is transferred to the heat sink via a PCB on which the LED device mounted, another portion of the heat generated by the LED device is transferred to the heat sink through the thermal conduction performed by the heat transfer filler and dissipated, and a final portion of the heat generated by the LED device is transferred to the heat sink through the thermal conduction performed by the transparent thermally conductive material and dissipated, and dissipated in the air outside the LED device. In addition, each LED device is designed such that a heat sink is arranged tightly and closely to each LED device, and thus a heat conduction path of the heat transfer filler is maximally shortened. The thermally conductive material absorbs heat directly from all of the contact portions of the LED device, and uniformly transfers the absorbed heat through thermal conduction via said shortest omnidirectional path, thereby effectively dissipating heat to prevent LED devices from overheating, and thus obtaining superior optical characteristics and lengthening the lifespan of LED devices. A plurality of the above-described LED lighting fixtures can be combined to form an indoor/outdoor LED lighting apparatus.
    • 公开了一种LED照明器具和使用其的照明装置。 传热填料填充容纳LED光源单元的散热器的光源容纳单元中的整个空间。 此外,透明导热材料被施加到LED装置的前发光表面以封闭形成在光源容纳单元中的发光开口。 由LED器件产生的热量的一部分经由其上安装有LED器件的PCB转移到散热器,由LED器件产生的另一部分热量通过由热量进行的热传导而传递到散热器 传输填料并消散,并且由LED器件产生的热量的最终部分通过由透明导热材料执行的热传导而被传递到散热器,并被耗散并在LED器件外部散发。 此外,每个LED器件被设计成使得散热器紧密地布置到每个LED器件,因此传热填料的热传导路径被最大程度地缩短。 导热材料直接从LED器件的所有接触部分吸收热量,并且通过所述最短全向路径的热传导均匀地传递吸收的热量,从而有效地散热以防止LED器件过热,从而获得优异的光学特性 延长LED设备的使用寿命。 可以组合多个上述LED照明装置,以形成室内/室外LED照明装置。
    • 65. 发明申请
    • VERSATILE SEALED LED LAMP
    • VERSATILE密封LED灯
    • WO2011019856A1
    • 2011-02-17
    • PCT/US2010/045236
    • 2010-08-11
    • STONEHAM, Edward
    • STONEHAM, Edward
    • F21S4/00
    • F21V29/71F21S4/28F21V29/004F21V29/2212F21V29/83F21Y2101/00F21Y2115/10
    • A lamp assembly (1800) may include a circuit board (201), one or more light-emitting devices (100) disposed on the circuit board (201), a heat sink (600) in thermal contact with a surface of the circuit board (201), a gasket (700) with a first surface in mechanical contact with the circuit board (201), a bezel (800) a surface (805) of which is in mechanical contact with a second surface of the gasket (700), and one or more fasteners (901) that may apply a force between the bezel (800) and the heat sink (600). A lamp array (2100) may include two or more lamp assemblies (1800), not all of which supply illumination with the same spectral characteristic, and a bearing mount (2000) that may support each lamp assembly (1800) and allow each to be oriented rotationally. A supply circuit (2500, 2600) may include a nonlinear resistive element (2501, 2601).
    • 灯组件(1800)可以包括电路板(201),设置在电路板(201)上的一个或多个发光器件(100),与电路板的表面热接触的散热器(600) (201),具有与所述电路板(201)机械接触的第一表面的垫圈(700),其表面(805)与所述垫圈(700)的第二表面机械接触的边框(800) 以及可以在挡板(800)和散热器(600)之间施加力的一个或多个紧固件(901)。 灯阵列(2100)可以包括两个或更多个灯组件(1800),并非所有的灯组件(1800)都具有相同的光谱特性的照明,以及可支撑每个灯组件(1800)并允许每个灯组件 旋转。 供电电路(2500,2600)可以包括非线性电阻元件(2501,2601)。