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31. 发明申请

WO2019132966A1 MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS 审中-公开
公开(公告)号：WO2019132966A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068914
申请日：2017-12-29
申请人： INTEL CORPORATION
发明人： ELSHERBINI, Adel A. , ELSHAZLY, Amr , CHANDRASEKHAR, Arun , LIFF, Shawna M. , SWAN, Johanna M.
IPC分类号： H01L25/065 , H01L23/12 , H01L23/48
摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

32. 发明申请

WO2019132957A1 MICROELECTRONIC ASSEMBLIES 审中-公开
公开(公告)号：WO2019132957A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068901
申请日：2017-12-29
申请人： INTEL CORPORATION
发明人： ELSHERBINI, Adel A. , MORROW, Patrick , BRAUNISCH, Henning , JUN, Kimin , MUELLER, Brennen , LIFF, Shawna M. , SWAN, Johanna M. , FISCHER, Paul B.
IPC分类号： H01L23/367 , H01L23/485 , H01L23/538
摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may a die having a front side and a back side, the die comprising a first material and conductive contacts at the front side; and a thermal layer attached to the back side of the die, the thermal layer comprising a second material and a conductive pathway, wherein the conductive pathway extends from a front side of the thermal layer to a back side of the thermal layer.

33. 发明申请

WO2018125026A1 SUPERCONDUCTING QUBIT DEVICE PACKAGES 审中-公开
公开(公告)号：WO2018125026A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/068629
申请日：2016-12-27
申请人： INTEL CORPORATION
发明人： ROBERTS, Jeanette M. , ELSHERBINI, Adel A. , LIFF, Shawna , SWAN, Johanna M. , CAUDILLO, Roman , YOSCOVITS, Zachary R. , THOMAS, Nicole K. , PILLARISETTY, Ravi , GEORGE, Hubert C. , CLARKE, James S.
IPC分类号： G06N99/00 , B82Y10/00
摘要： One superconducting qubit device package disclosed herein includes a die having a first face and an opposing second face, and a package substrate having a first face and an opposing second face. The die includes a quantum device including a plurality of superconducting qubits and a plurality of resonators on the first face of the die, and a plurality of conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or of the plurality of resonators. The second face of the package substrate also includes conductive contacts. The device package further includes first level interconnects disposed between the first face of the die and the second face of the package substrate, coupling the conductive contacts at the first face of the die with associated conductive contacts at the second face of the package substrate.

34. 发明申请

WO2018063675A1 ELECTRICAL CONNECTORS FOR HIGH DENSITY ATTACH TO STRETCHABLE BOARDS 审中-公开
标题翻译：用于高密度安装在可拉伸板上的电连接器
公开(公告)号：WO2018063675A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049159
申请日：2017-08-29
申请人： INTEL CORPORATION
发明人： OSTER, Sasha N. , ELSHERBINI, Adel A. , EID, Feras , ALEKSOV, Aleksandar , BAXI, Amit Sudhir , SWAN, Johanna M. , MAGESHKUMAR, Vincent S.
IPC分类号： H01R13/629 , A44B19/24
CPC分类号： H01R4/58 , A44B17/0041 , A44B19/24 , H01R13/03 , H01R43/26
摘要： A system can include a first portion of a fabric fastener, a second portion of the fabric fastener, wherein the first portion and the second portion are configured to mechanically connect with each other and to resist separation from each other once connected, and wherein the first and second portions include a plurality of corresponding electrical contacts configured to form a plurality of individual electrical connections when the first portion is mechanically connected with the second portion.
摘要翻译：系统可以包括织物紧固件的第一部分，织物紧固件的第二部分，其中第一部分和第二部分被配置为彼此机械连接并且防止从每个部分分离并且其中所述第一部分和所述第二部分包括多个对应的电触点，所述多个对应的电触点被配置为当所述第一部分与所述第二部分机械连接时形成多个单独的电连接。

35. 发明申请

WO2018063417A1 SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING INCREASED HUMAN PERCEPTION OF HAPTIC FEEDBACK SYSTEMS 审中-公开
标题翻译：用于实现增加的对感知反馈系统的感知的系统，方法和设备
公开(公告)号：WO2018063417A1
公开(公告)日：2018-04-05
申请号：PCT/US2016/055086
申请日：2016-10-01
申请人： INTEL CORPORATION
发明人： DOGIAMIS, Georgios C. , ALEKSOV, Aleksandar , SWAN, Johanna M.
IPC分类号： G06F1/16 , G06F3/01
摘要： In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.
摘要翻译：根据所公开的实施例，提供了用于实现触觉反馈系统的增加的人类感知的系统，方法和装置。例如，根据一个实施例公开了一种可穿戴设备，其中具有：可穿戴设备壳体; 可穿装置壳体内的多个致动器，每个致动器独立地或组合地振动; 其中所述多个致动器中的每一个的一个表面暴露在所述可穿装置壳体的表面处; 围绕可穿装置壳体内的多个致动器中的每一个的侧面的弹性体，以将致动器保持在可穿装置壳体内的适当位置; 以及从多个致动器中的每一个到可穿戴设备的内部半导体组件的电互连。披露了其他相关的实施例。

36. 发明申请

WO2017171863A1 TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS 审中-公开
标题翻译：模块堆积和相关配置的技术
公开(公告)号：WO2017171863A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025672
申请日：2016-04-01
申请人： INTEL CORPORATION
发明人： HUA, Fay , PELTO, Christopher M. , RAO, Valluri R. , BOHR, Mark T. , SWAN, Johanna M.
IPC分类号： H01L25/07 , H01L25/10
摘要： Embodiments of the present disclosure describe techniques for fabricating a stacked integrated circuit (IC) device. A first wafer that includes a plurality of first IC dies may be sorted to identify first known good dies of the plurality of first IC dies. The first wafer may be diced to singulate the first IC dies. A second wafer that includes a plurality of second IC dies may be sorted to identify second known good dies of the plurality of second IC dies. The first known good dies may be bonded to respective second known good dies of the second wafer. In some embodiments, the first known good dies may be thinned after bonding the first known good dies to the second wafer. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了用于制造堆叠集成电路（IC）器件的技术。包括多个第一IC管芯的第一晶圆可以被分类以识别多个第一IC管芯中的第一已知良好管芯。可切割第一晶片以切割第一IC管芯。包括多个第二IC管芯的第二晶圆可以被分类以识别多个第二IC管芯中的第二已知良好管芯。第一已知良好管芯可以结合到第二晶圆的各自的第二已知良好管芯。在一些实施例中，可在将第一已知良好裸片结合到第二晶片之后将第一已知良好裸片薄化。其他实施例可以被描述和/或要求保护。

37. 发明申请

WO2022060515A1 DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES 审中-公开
公开(公告)号：WO2022060515A1
公开(公告)日：2022-03-24
申请号：PCT/US2021/046401
申请日：2021-08-18
申请人： INTEL CORPORATION
发明人： ALEKSOV, Aleksandar , ELSHERBINI, Adel A. , LIFF, Shawna M. , SWAN, Johanna M. , EID, Feras , OSBORNE, Randy B. , LE, Van H.
IPC分类号： H01L23/538 , H01L23/00
摘要： Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include an interposer, including an organic dielectric material, and a microelectronic component coupled to the interposer by direct bonding.

38. 发明申请

WO2021040955A1 MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE CIRCUITRY 审中-公开
公开(公告)号：WO2021040955A1
公开(公告)日：2021-03-04
申请号：PCT/US2020/044128
申请日：2020-07-30
申请人： INTEL CORPORATION
发明人： KAMGAING, Telesphor , DOGIAMIS, Georgios , EID, Feras , ALEKSOV, Aleksandar , SWAN, Johanna M.
IPC分类号： H01L23/66 , H01L23/50 , H01L23/367 , H03H9/25 , H01L23/522
摘要： Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.

39. 发明申请

WO2020005666A1 MICROELECTRONIC ASSEMBLIES HAVING INTERPOSERS 审中-公开
公开(公告)号：WO2020005666A1
公开(公告)日：2020-01-02
申请号：PCT/US2019/037970
申请日：2019-06-19
申请人： INTEL CORPORATION
发明人： ALEKSOV, Aleksandar , SWAN, Johanna M.
IPC分类号： H01L23/00 , H01L23/528 , H01L23/13 , H01L25/065
摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a high bandwidth interconnect, a first interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the first interposer is electrically coupled to the high bandwidth interconnect, and a second interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the second interposer is electrically coupled to the high bandwidth interconnect, and wherein the first interposer is electrically coupled to the second interposer via the high bandwidth interconnect.

40. 发明申请

WO2018052581A1 STRETCHABLE AND FLEXIBLE ELECTRICAL SUBSTRATE INTERCONNECTIONS 审中-公开
标题翻译：可伸缩和灵活的电子基板互连
公开(公告)号：WO2018052581A1
公开(公告)日：2018-03-22
申请号：PCT/US2017/046014
申请日：2017-08-09
申请人： INTEL CORPORATION
发明人： BAXI, Amit Sudhir , MAGESHKUMAR, Vincent S. , ELSHERBINI, Adel A. , OSTER, Sasha N. , EID, Feras , ALEKSOV, Aleksandar , SWAN, Johanna M.
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
摘要翻译：电路互连可用于生物测量数据感测和反馈应用。电路互连可用于设备设备到设备连接（例如，物联网（IoT）设备），包括需要可拉伸和刚性衬底之间连接的应用。电路互连可以包括多引脚搭扣配合连接机构，其中连接机构提供刚性衬底和柔性或可拉伸衬底之间的电互连。电路互连和柔性或可拉伸基板的组合提供了改进的电连接可靠性，允许更大的可伸缩性和电路迹线的灵活性，并允许将可伸缩电路迹线连接到刚性PCB的更多选择。

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