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11. 发明申请

WO1992015188A1 ARRANGEMENT AT A COOLING SYSTEM FOR COOLING OF EQUIPMENT FOR TELECOMMUNICATION 审中-公开
标题翻译：用于冷却电气设备的冷却系统的布置
公开(公告)号：WO1992015188A1
公开(公告)日：1992-09-03
申请号：PCT/SE1992000039
申请日：1992-01-22
申请人： L.T.S. I SÖDERKÖPING AB , STERLING, Birger
发明人： L.T.S. I SÖDERKÖPING AB
IPC分类号： H05K07/20
CPC分类号： H05K7/20009
摘要： The invention relates to an arrangement for a cooling system for cooling telecommunications equipment. This is installed in rack cabinets positioned one after the other. A duct section (4) is present beneath each rack cabinet. The duct section is so arranged as to direct at least one jet of cool air (6) upwards along the front wall of the rack cabinet. This is executed with openings through which the cooling air can reach the equipment. The duct section (4) is so arranged as to support the rack cabinet at four support points (4b1) at the respective ends of the duct section (4). In conjunction with this the walls of the duct section (4) are reinforced locally in order to withstand the load. In this way the duct section (4) exhibits a smaller flow cross section in the end areas (4d, 4e) than in a central area (4f) situated between the end areas. A gentle transition is provided between the central area (4f) and the flow surfaces of the end areas (4d, 4e). The front area (4a) of the duct section (4) lies in the same plane as the front wall of the rack cabinet. A number of upward-facing gills (4a1) is arranged in the central area (4f) in order to produce the upward-facing jets of cool air. The cool air unit produces an excess pressure inside the cooling duct, which has an approximately constant level of static pressure.
摘要翻译：本发明涉及用于冷却电信设备的冷却系统的装置。这安装在一个接一个定位的机柜中。管架部分（4）位于每个机柜机架下方。管道部分被布置成沿着机架柜的前壁向上引导至少一个冷空气射流（6）。这是通过冷却空气可以到达设备的开口来执行的。管道部分（4）被布置成在管道部分（4）的相应端部处的四个支撑点（4b1）处支撑齿条柜。与此同时，管道部分（4）的壁被局部加强以承受负载。以这种方式，管道部分（4）在端部区域（4d，4e）中表现出比位于端部区域之间的中心区域（4f）中更小的流动横截面。在中心区域（4f）和端部区域（4d，4e）的流动表面之间提供平缓的过渡。管道部分（4）的前部区域（4a）位于与机架柜的前壁相同的平面内。为了产生向上的冷空气射流，在中央区域（4f）中布置有多个朝上的鳃（4a1）。冷空气单元在冷却管道内产生过大的压力，其具有大致恒定的静压水平。

12. 发明申请

WO1992007454A1 LIQUID COOLING SYSTEM EMPLOYING AIR PURGING MECHANISM 审中-公开
标题翻译：液体冷却系统采用空气净化机制
公开(公告)号：WO1992007454A1
公开(公告)日：1992-04-30
申请号：PCT/US1991007479
申请日：1991-10-10
申请人： UNISYS CORPORATION
发明人： UNISYS CORPORATION , TUSTANIWAKYJ, Jerry, Ihor , BAKKER, Johan, Pieter
IPC分类号： H05K07/20
CPC分类号： H05K7/20272 , F24D19/083 , H01L23/473 , H01L2924/0002 , Y10S165/917 , H01L2924/00
摘要： A leak tolerant liquid cooling system for electrical components (10) comprises a cooling circuit which contains a pump (17) and conduits (14, 16, 18, 20) that circulate a liquid coolant (LC) past the electrical components (10) and through the bottom chamber (15b) of a purge tank (15). This purge tank (15) also has a top chamber (15a) which is connected to the bottom chamber (15b) through a passageway (15d); and, the bottom chamber (15b) is sized such that the liquid coolant (LC) passes through it with a velocity which is low enough to let any air bubbles in the coolant rise and move by buoyancy through the passageway (15d) into the top chamber (15a). Air is purged from the top chamber (15a) through a valved output port (25) by forcing liquid coolant (LC) into the top chamber (15a) through a valved input port (24). To complete this purge quickly, the passageway (15d) between the purge tank chambers (15a and 15b) is configured in a way which hinders the flow of coolant (LC) from the top chamber (15a) to the bottom chamber (15b) while the coolant (LC) is being forced into the top chamber (15a). As the air purging occurs, the coolant (LC) continues to be pumped past the electrical components (10) through the cooling circuit. Since the pump (17) is not switched ON and OFF during purging, pressure surges in the cooling system do not occur, and switching noise in the voltages to the electrical components (10) is not generated.

13. 发明申请

WO1992003034A1 HEAT-CONDUCTIVE METAL CERAMIC COMPOSITE MATERIAL PANEL SYSTEM FOR IMPROVED HEAT DISSIPATION 审中-公开
标题翻译：用于改进热量散热的导热金属陶瓷复合材料面板系统
公开(公告)号：WO1992003034A1
公开(公告)日：1992-02-20
申请号：PCT/US1991005347
申请日：1991-07-29
申请人： CIRQON TECHNOLOGIES CORPORATION
发明人： CIRQON TECHNOLOGIES CORPORATION , CAPP, Michael, L. , CAPP, Arthur, O., Jr.
IPC分类号： H05K07/20
CPC分类号： H01L23/3733 , H01L23/3677 , H01L2924/0002 , H05K1/0206 , H05K1/0306 , H05K3/0029 , H05K2201/09036 , H05K2201/09827 , H01L2924/00
摘要： For use as a substrate (11) for a heat generating microelectric integrated circuit (12), a ceramic panel (11) is provided having small thickness in comparison to its length and breadth, having on at least the surface opposite the one bearing the microelectronic integrated circuit (12), a layer of heat conductive metal (13) and having a plurality of closely spaced, small cross section extensions (14) of the heat conductive metal layer (13) extending into the ceramic material (11) to a depth of at least about one fifth of its thickness. The substrate is particularly useful for the mounting of hybrid microelectronic circuits to improve the heat dissipation capability of the ceramic substrate (11).

14. 发明申请

WO1992002117A1 HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的散热结构
公开(公告)号：WO1992002117A1
公开(公告)日：1992-02-06
申请号：PCT/JP1991001006
申请日：1991-07-26
申请人： FUJITSU LIMITED , YAMAJI, Hiroshi , KANNO, Takashi , SATO, Takashi , MAGOME, Riichi , HONGHO, Tomoyuki
发明人： FUJITSU LIMITED
IPC分类号： H05K07/20
CPC分类号： H05K1/0204 , H01L23/40 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H05K2201/083 , H05K2201/10409 , H05K2201/10416 , H05K2201/10689 , H01L2924/00
摘要： By the structure, the heights of semiconductor devices mounted on a board are small. This raises the mounting density of boards ona shelf. The structure is detachably mounted on a board easily. An opening (1a) is provided in a circuit board (1), and a semiconductor device (2) is so mounted on the surface of the circuit board that the bottom face is in the opening. A heat transferring member (3, 11) is adhered to the bottom face of the semiconductor device. The other side of the member is exposed from the back side of the circuit board (1), passing through the opening (1a), and is adhered to a heat radiating plate (4) provided on the back of the board. Heat generated from the semiconductor device is transferred to the heat radiating plate (4) through the heat transferring member (3 or 11), and is radiated to the air from the surface of the plate (4) to cool the semiconductor device. The heat dissipating structure of the semiconductor device characterized in that, at least either one of the semiconductor device (2) and the heat radiating plate (4) is made of a magnetic material, and the both are adhered to the heat transferring member by the magnetic attraction of a permanent magnet (3 or 10) laid between the both.

15. 发明申请

WO1992002116A1 ELECTRIC APPLIANCE, IN PARTICULAR SWITCHING AND CONTROL APPLIANCE FOR MOTOR VEHICLES 审中-公开
标题翻译：电动机，特别是电动车辆的切换和控制装置
公开(公告)号：WO1992002116A1
公开(公告)日：1992-02-06
申请号：PCT/DE1991000516
申请日：1991-06-26
申请人： ROBERT BOSCH GMBH , JAKOB, Gert , MAGIERA, Michael , BENTZ, Willy , ERNST, Waldemar , KARR, Dieter
发明人： ROBERT BOSCH GMBH
IPC分类号： H05K07/20
CPC分类号： H05K5/0069 , H05K1/0203 , H05K1/0393 , H05K2201/10166 , H05K2201/10189 , H05K2201/10553
摘要： An electric appliance has a printed circuit board designed as a foil (11) arranged on a thermoconductive plate (10). The power components (14) to be cooled and the connecting block (17) are arranged on the side of the plate opposite to the printed circuit foil (11) and are connected to the printed circuit foil (11) through openings (16, 22) in the plate (10).

16. 发明申请

WO1991015103A1 ELECTRICAL ISOLATOR DEVICE 审中-公开
标题翻译：电气隔离器装置
公开(公告)号：WO1991015103A1
公开(公告)日：1991-10-03
申请号：PCT/US1991001819
申请日：1991-03-19
申请人： THE GUEST COMPANY, INC.
发明人： THE GUEST COMPANY, INC. , SOBOLESKI, Thomas, F.
IPC分类号： H05K07/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2924/0002 , H01L2924/00
摘要： An electrical isolator device (20) which comprises at least one heat sink (steel plate) (21), and a non-conductive housing (24) which partially encases the heat sink (21), such that at least one surface of the heat sink (21) is in contact with the non-conductive housing (24); whereby the surfaces of the heat sink (21) which are not in contact with the non-conductive housing (24) are exposed to the atmosphere to allow dissipation of heat therefrom.

17. 发明申请

WO1991011897A1 MOUNTING FOR ELECTRONIC COMPONENTS WHICH NEED TO BE COOLED 审中-公开
标题翻译：需要冷却的电子元件的安装
公开(公告)号：WO1991011897A1
公开(公告)日：1991-08-08
申请号：PCT/DE1990000990
申请日：1990-12-22
申请人： ROBERT BOSCH GMBH , HOFMEISTER, Werner , WITTENAUER, Michael
发明人： ROBERT BOSCH GMBH
IPC分类号： H05K07/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a mounting for an electronic component, in particular a power transistor, associated with a cooling body. Assembly is simplified if the electronic component is lodged in a pocket (21) which is open on one side so that the electronic component (4, 5) can be placed in contact with the cooling body (3). The electronic component (4, 5) can also be clamped to the cooling body (3) by a fastening means (10).

18. 发明申请

WO1991011091A1 BOARD-MOUNTED THERMAL PATH CONNECTOR 审中-公开
标题翻译：板安装式热路连接器
公开(公告)号：WO1991011091A1
公开(公告)日：1991-07-25
申请号：PCT/US1990002206
申请日：1990-04-23
申请人： CRAY RESEARCH, INC.
发明人： CRAY RESEARCH, INC. , MORTON, David, Mark
IPC分类号： H05K07/20
CPC分类号： H05K7/205 , H05K1/0204 , H05K2201/10416 , H05K2201/10689
摘要： The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.

19. 发明申请

WO1989006895A1 VERY HIGH-ACCELERATION TOLERANT CIRCUIT CARD PACKAGING STRUCTURE 审中-公开
标题翻译：非常高速加速电路卡包装结构
公开(公告)号：WO1989006895A1
公开(公告)日：1989-07-27
申请号：PCT/US1988004563
申请日：1988-12-20
申请人： HUGHES AIRCRAFT COMPANY
发明人： HUGHES AIRCRAFT COMPANY , LONGERICH, Ernest, P.
IPC分类号： H05K07/20
CPC分类号： H05K7/1434 , B41J2/17593 , H05K7/20236
摘要： A very high acceleration tolerant packaging structure (10) for protecting electronic circuit elements such as printed circuit cards (35) or ceramic cards. A rigid housing (15) has at least one planar member (35) for supporting electronic circuitry thereon, mounted within the housing so as to divide the interior of the housing into at least two chambers (50, 52). Each chamber is completely filled with a substantially incompressible fluid (60) so as to leave no air spaces or voids. The fluid in one chamber communicates with the fluid in another chamber only at a controllable rate. Preferably the planar members (35) have substantially the same shape as the cross sectional shape of the interior of the packaging system.

20. 发明申请

WO1981003734A1 HEAT PIN INTEGRATED CIRCUIT PACKAGING 审中-公开
标题翻译：热引脚集成电路封装
公开(公告)号：WO1981003734A1
公开(公告)日：1981-12-24
申请号：PCT/US1981000826
申请日：1981-06-19
申请人： DIGITAL EQUIP CORP
发明人： DIGITAL EQUIP CORP , OLSEN K , MCELROY J , HANNEMANN R , WEAVER B
IPC分类号： H05K07/20
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4006 , H01L23/473 , H01L2023/405 , H01L2924/0002 , H01L2924/3011 , H05K3/0061 , H05K3/325 , H05K2201/10409 , H05K2201/10416 , H01L2924/00
摘要： Heat pin integrated circuit packaging apparatus for dissipating heat from electronic components into a cooling device. The apparatus comprises: a mounting element, such as a printed circuit board (10), having at least one cavity (40), for mounting the electronic components (1) in an electrical circuit; a heat pin (50), for thermally conducting heat away from the electronic component (1); a thermal planar frame (60) having at least one opening or position (90) for capturing a heat pin (50), the thermal planar frame having an inwardly facing surface (80) exposed to the cooling device; and an arrangement for detachably coupling the electronic component (1) to the heat pin (50) such that the electronic component (1) is electrically coupled to the printed circuit board (10) and thermally coupled to the heat pin (50). Thus heat generated by the electronic component (1), flows into the heat pin (50) and is dissipated into the thermal planar frame (60) for cooling by any of a variety of cooling devices. of the transfer ports.
摘要翻译：热销集成电路封装装置，用于将热量从电子部件散热到冷却装置。该装置包括：具有至少一个空腔（40）的用于将电子部件（1）安装在电路中的诸如印刷电路板（10）的安装元件; 热引脚（50），用于将热量从电子部件（1）导热; 具有用于捕获热销（50）的至少一个开口或位置（90）的热平面框架（60），所述热平面框架具有暴露于所述冷却装置的向内的表面（80）; 以及用于将电子部件（1）可拆卸地联接到热销（50）的装置，使得电子部件（1）电耦合到印刷电路板（10）并热耦合到热销（50）。因此，由电子部件（1）产生的热量流入热销（50），并被散热到热平面框架（60）中，以便通过各种冷却装置中的任何一种进行冷却。的传输端口。

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