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11. 发明申请

WO2004072585A2 WAFER BOND STRENGTH EVALUATION APPARATUS 审中-公开
标题翻译： WAFER BOND强度评估装置
公开(公告)号：WO2004072585A2
公开(公告)日：2004-08-26
申请号：PCT/US2004/003602
申请日：2004-02-05
申请人： ARIZONA BOARD OF REGENTS , ALFORD, Terry, L. , MITAN, Martin
发明人： ALFORD, Terry, L. , MITAN, Martin
IPC分类号： G01D
CPC分类号： G01N3/04 , G01N19/04 , G01N21/9501 , G01N2203/0066 , G01N2203/0494
摘要： An apparatus and method for measuring bond strength of a bonded wafer that allow for more reliable and reproducible measurements, thereby allowing a better comparison of bond strengths of various wafers. A wafer receptacle holds the bonded wafer to be measured securely in place. A Z-axis adjustment device with a precision actuator is adjusted to align a blade with a bond interface of a bonded wafer. An X-axis adjustment device with a precision actuator connected to a spring is adjusted to introduce the blade into the bond interface creating a crack, the length of which can be measured and used to determine bond strength. The stability and precision introduced by the Z-axis and X-axis adjustment devices also increase the reliability and reproducibility of the bond strength measurement.
摘要翻译：用于测量接合晶片的接合强度的装置和方法，其允许更可靠和可再现的测量，从而允许更好地比较各种晶片的结合强度。晶片插座将要测量的粘合晶片牢固地保持在适当位置。调整具有精密致动器的Z轴调节装置以使刀片与接合晶片的接合界面对准。调整具有连接到弹簧的精密致动器的X轴调节装置以将刀片引入接合界面，从而产生裂纹，该裂纹的长度可被测量并用于确定粘合强度。 Z轴和X轴调整装置引入的稳定性和精度也提高了粘结强度测量的可靠性和再现性。

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