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11. 发明申请

WO2004067811A1 THE MANUFACTURING METHOD OF CUT ELECTRO-FORMING MEMBER WHITCH HAVE STEPPED FORM, AND CUT ELECTRO-FORMING MEMBER WHITCH HAVE STEPPED FORM MADE BY IT 审中-公开
标题翻译：切割电铸成型件的制造方法具有步进形式，切割电铸成型件具有步进形式
公开(公告)号：WO2004067811A1
公开(公告)日：2004-08-12
申请号：PCT/KR2004/000140
申请日：2004-01-27
申请人： KIM, Jeong-Sik
发明人： KIM, Jeong-Sik
IPC分类号： C25F5/00
CPC分类号： C25D1/02
摘要： A method of manufacturing a cut electroforming member which has a stepped form and a cut electroforming member made by it are disclosed, in which a nonconductive section is formed in a core material and the cut electroforming member has a stepped form. An electroforming process is performed in an electroforming tub by connecting a negative electrode to the core material having a nonconductive section and a positive electrode to a melted metal. A desired sectional shape for the electroforming member is formed at one end or both ends of the nonconductive section. In this case, the shape of the end of the nonconductive section is imprinted on the end of the cut electroforming member. The nonconductive section may be divided into an upper section and a lower section, and may be made by injecting a liquid material into its die and hardening it. The core material is covered with a forming material. To obtain a stepped form in the cut electroforming member, a nonconductive portion may be formed using a photoresist or an ultraviolet hardening section hardened by ultraviolet rays may be formed. Alternatively, a solid type nonconductive shape portion may be formed in the cut electroforming member. The solid type nonconductive shape portion may have an inclined stepped form.
摘要翻译：公开了一种制造具有台阶形状的切割电铸件和由其制成的切割电铸件的方法，其中在芯材中形成非导电部分，并且切割的电铸件具有台阶形式。通过将负极与具有非导电部分和正极的芯材料连接到熔融金属，在电铸槽中进行电铸工艺。在非导电部分的一端或两端形成用于电铸部件的期望的截面形状。在这种情况下，非导电部分的端部的形状被印刷在切割的电铸件的端部上。非导电部分可以分为上部和下部，并且可以通过将液体材料注入其模具并使其硬化而制成。芯材被成形材料覆盖。为了在切割电铸构件中获得阶梯形状，可以使用光致抗蚀剂形成非导电部分，或者可以形成通过紫外线硬化的紫外线硬化部分。或者，可以在切割的电铸构件中形成固体型非导电形状部分。固体型非导电形状部分可以具有倾斜的阶梯形状。

12. 发明申请

WO2004067810A1 THE MANUFACTURING METHOD OF CUT ELECTRO-FORMING MEMBER AND CUT ELECTRO-FORMING MEMBER MADE BY IT 审中-公开
标题翻译：切割电铸成型机的制造方法及切割电铸成型机
公开(公告)号：WO2004067810A1
公开(公告)日：2004-08-12
申请号：PCT/KR2004/000139
申请日：2004-01-27
申请人： KIM, Jeong-Sik
发明人： KIM, Jeong-Sik
IPC分类号： C25F5/00
CPC分类号： C25D1/02
摘要： A method of manufacturing a cut electroforming member and a cut electroforming member made by it are disclosed, in which an electroforming process is performed in an electroforming tub by connecting a negative electrode to a core material having a nonconductive section and a positive electrode to a melted metal. The electroforming member is cut at a predetermined length by the nonconductive section. A desired sectional shape for the electroforming member is formed at one end or both ends of the nonconductive section. In this case, the shape of the end of the nonconductive section is imprinted on the end of the cut electroforming member. The nonconductive section may be divided into an upper section and a lower section, and may be made by injecting a liquid material into its die and hardening it. The forming material is kept in a die at a melted state or a partially melted state and is covered on the core material when the core material passes through the die. The forming material is thinly coated with a conductive material after it is hardened. An electroforming layer is formed by connecting a negative electrode to the conductive coating portion and performing an electroforming process in an electroforming tub. The core material in the electroforming member is removed by a drawing process. The inside of the electroforming member is then washed.
摘要翻译：公开了一种制造切割电铸件和由其制成的切割电铸件的方法，其中通过将负极与具有非导电部分和正极的芯材连接而熔化的电铸槽中进行电铸工艺，金属。电铸部件通过非导电部分以预定长度切割。在非导电部分的一端或两端形成用于电铸部件的期望的截面形状。在这种情况下，非导电部分的端部的形状被压印在切割的电铸件的端部上。非导电部分可以分成上部和下部，并且可以通过将液体材料注入其模具并使其硬化而制成。成型材料在熔融状态或部分熔融状态下保持在模具中，并且当芯材通过模具时被覆盖在芯材上。成型材料在硬化之后用导电材料薄涂层。通过将负极连接到导电涂层部分并在电铸槽中进行电铸工艺来形成电铸层。通过拉丝工艺除去电铸件中的芯材。然后洗涤电铸构件的内部。

13. 发明申请

WO2004064155A1 ELECTRO-FORMING MASTER HAVING A PIN PORTION AND THE SAME MASTER-MANUFACTURING METHOD, AND METAL MINUTE PATTERN MADE BY THE MASTER 审中-公开
标题翻译：具有引脚部分的电子成型主体和主要制造方法以及主体制造的金属分钟图案
公开(公告)号：WO2004064155A1
公开(公告)日：2004-07-29
申请号：PCT/KR2003/002804
申请日：2003-12-23
申请人： KIM, Jeong-Sik
发明人： KIM, Jeong-Sik
IPC分类号： H01L23/52
CPC分类号： C25D1/00 , C25D1/10 , H01L21/2885 , H01L21/76838
摘要： An electro-forming master repeatedly manufactured by an electro-forming process, its manufacturing method, and a metal minute pattern formed by the electro-forming master are disclosed. The method for manufacturing an electro-forming master includes the steps of performing an electro-forming process in a surface of an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape of that of the metal minute pattern, forming metal layers in the conducting portion and a laminated exposing layer in the insulating portion, sequentially increasing the height of the metal layers and the laminated exposing layer, removing the laminated exposing layer from the electrode base to form a space portion when the metal layers and the laminated exposing layer reach a desired height, forming an insulating portion by filling an insulating material in the space portion, and removing the metal layers formed on the electrode base to form an insulating layer having a certain height on the surface of the electrode base as a pin portion.
摘要翻译：公开了一种通过电铸方法重复制造的电铸机，其制造方法以及由电铸母机形成的金属微型图案。电铸母版的制造方法包括以下步骤：在电绝缘部分的未电气连接的电极基体的表面上进行电铸工艺，并且具有与金属微细图案相同形状的导电部分在所述导电部分中形成金属层和在所述绝缘部分中形成层压曝光层，顺序地增加所述金属层和所述层叠曝光层的高度，从所述电极基底移除所述层压曝光层以形成所述金属层并且层压曝光层达到所需的高度，通过在该空间部分填充绝缘材料形成绝缘部分，并去除形成在电极基体上的金属层，以在电极基体的表面上形成具有一定高度的绝缘层作为销部分。

14. 发明申请

WO0124602A3 SUPPORTING APPARATUS FOR FARM PRODUCTS 审中-公开
标题翻译：支持农产品
公开(公告)号：WO0124602A3
公开(公告)日：2002-07-11
申请号：PCT/KR9900840
申请日：1999-12-30
申请人： KIM JEONG SIK
发明人： KIM JEONG SIK
IPC分类号： A01G9/12 , A01G13/00 , A01G17/14 , A01G17/04
CPC分类号： A01G13/00
摘要： A support apparatus includes a rope (3) for surrounding farm products (12), and supporting members (1) for suspending the rope above the ground.
摘要翻译：支撑装置包括用于围绕农产品（12）的绳索（3）和用于将绳索悬挂在地面上方的支撑构件（1）。

15. 发明申请

WO2011014011A3 PHOTORESIST COMPOSITION COMPRISING A CROSSLINKABLE CURING SUBSTANCE 审中-公开
标题翻译：包含可交联固化物质的光敏剂组合物
公开(公告)号：WO2011014011A3
公开(公告)日：2011-06-09
申请号：PCT/KR2010004969
申请日：2010-07-28
申请人： DONGJIN SEMICHEM CO LTD , JANG EU-JEAN , LEE JUN-GYEONG , HAN DONG-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , LEE JAE-WOO , KIM DEOG-BAE , KIM JAE-HYUN
发明人： JANG EU-JEAN , LEE JUN-GYEONG , HAN DONG-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , LEE JAE-WOO , KIM DEOG-BAE , KIM JAE-HYUN
IPC分类号： G03F7/032 , G03F7/004
CPC分类号： G03F7/0035 , G03F7/0382 , G03F7/405
摘要： Disclosed is a photoresist composition comprising a crosslinkable curing substance, able to form a pattern-protecting film on the surface of a photoresist pattern by first forming a photoresist pattern and then heating or exposing to light and heat, in a pattern-forming method employing the double patterning technique. The photoresist composition comprises: from 3 to 30 wt.% of a light-sensitive polymer; from 0.5 to 75 parts by weight of a crosslinking curing agent or agents represented by Chemical formula 1 and/or Chemical formula 2 of Claim 1, with respect to 100 parts by weight of the light-sensitive polymer; from 0.05 to 15 parts by weight of a photoacid generator, with respect to 100 parts by weight of the light-sensitive polymer; and a balance of solvent.
摘要翻译：本发明公开了一种包含可交联固化物质的光致抗蚀剂组合物，其能够通过首先形成光致抗蚀剂图案然后加热或暴露于光和热下，在光致抗蚀剂图案的表面上形成图案保护膜，双重图案化技术。该光致抗蚀剂组合物包含：3-30重量％的光敏聚合物; 相对于100重量份的光敏聚合物，0.5至75重量份的交联固化剂或由化学式1和/或权利要求1的化学式2表示的试剂; 0.05至15重量份的光酸产生剂，相对于100重量份的光敏聚合物; 和余量的溶剂。

16. 发明申请

WO2004064135A1 COMPOSITE SHAPE ELECTROFORMING MEMBER, ITS ELECTROFORMING MASTER AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：复合形状电铸部件及其制造方法及其制造方法
公开(公告)号：WO2004064135A1
公开(公告)日：2004-07-29
申请号：PCT/KR2004/000021
申请日：2004-01-09
申请人： KIM, Jeong-Sik
发明人： KIM, Jeong-Sik
IPC分类号： H01L21/306
CPC分类号： C25D1/00 , C25D1/10 , H01L21/2885 , H01L21/76838
摘要： A composite shape electroforming master, its electroforming master and a method for manufacturing the same are disclosed, in which the electroforming member has various sections. The electroforming master is made by the steps of forming an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape as that of the electroforming member, forming metal layers in the conducting portion by performing an electroforming process in the surface of the electrode base and exposing portions in the insulating portion, sequentially increasing the height of the metal layers and the height of the exposing portions, removing the exposing portions from the electrode base to form a space portion when the metal layers and the exposing portions reach a desired height, forming a pin portion by filling an insulating material in the space portion, and removing the metal layers remaining on the electrode base from the electrode base after the pin portion is hardened. The composite shape electroforming member can have various shapes by gradually varying the size and the position of the exposing portions when the exposing portions are formed using a film. That is, the pin portion of the insulating material protruded upward of the surface of the electrode base is formed with a varied section in a vertical direction by gradually varying the size and the position of the exposing portions. As a result, the electroforming member having various sections varied vertically can be obtained.
摘要翻译：公开了一种复合形状电铸母版，其电铸母版及其制造方法，其中电铸元件具有各种部分。电铸母版通过以下步骤制成：形成包括未电连接的绝缘部分的电极基体和具有与电铸部件相同形状的导电部分的步骤，通过在导电部分中进行电铸工艺形成金属层电极基体的表面和绝缘部分中的暴露部分，顺序地增加金属层的高度和暴露部分的高度，从金属层和暴露部分去除电极基底的暴露部分以形成空间部分部分达到期望的高度，通过在空间部分中填充绝缘材料形成销部分，并且在销部分硬化之后从电极基座去除残留在电极基座上的金属层。当使用膜形成曝光部分时，复合形状电铸件可以通过逐渐改变曝光部分的尺寸和位置而具有各种形状。也就是说，通过逐渐改变曝光部分的尺寸和位置，在垂直方向上形成从电极基体表面向上突出的绝缘材料的销部分形成变化的部分。结果，可以获得具有垂直变化的各种部分的电铸件。

17. 发明申请

WO2004053972A1 LEAD FRAME AND THE SAME MANUFACTURING METHOD USING ELECTROFORMING 审中-公开
标题翻译：引导框架和使用电化的相同制造方法
公开(公告)号：WO2004053972A1
公开(公告)日：2004-06-24
申请号：PCT/KR2003/002701
申请日：2003-12-10
申请人： KIM, Jeong-Sik
发明人： KIM, Jeong-Sik
IPC分类号： H01L21/50
CPC分类号： C25D1/003 , C25D1/22 , H01L21/4821
摘要： A lead frame and its manufacturing method are disclosed. The lead frame is detachably formed on overlapped electrode bases having the same pattern as that of the lead frame by performing an electroforming process in a lead frame master in which the electrode bases are filled with an insulating hetero-material, the lead frame master including a root portion formed by removing the upper one of the overlapped electrode bases and an insulating hetero-portion of a pin portion formed on the root portion, wherein the electrode bases are exposed in the insulating hetero-portion in a shape of the lead frame The insulating hetero-portion includes a material having elasticity. An example of the insulating hetero-portion having elasticity includes silicon as a main component. Metal plate of various materials may be used as the electrode bases.
摘要翻译：公开了引线框及其制造方法。引线框架通过在引线框架主机中进行电铸工艺而可拆卸地形成在具有与引线框架相同的图案的重叠电极基板上，其中电极基底填充有绝缘异质材料，引线框架主体包括通过去除重叠的电极基底中的上部一个和形成在根部上的引脚部分的绝缘异质部分而形成的根部，其中电极基体在引线框架的形状的绝缘异质部分中露出绝缘异质部分包括具有弹性的材料。作为具有弹性的绝缘性异质部的一例，以硅为主要成分。可以使用各种材料的金属板作为电极基底。

18. 发明申请

WO2012081863A3 PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION INCLUDING SAME, AND METHOD FOR FORMING RESIST PATTERN USING SAME 审中-公开
标题翻译：光敏聚合物，包括它们的光电组合物和使用其形成电阻图案的方法
公开(公告)号：WO2012081863A3
公开(公告)日：2012-08-23
申请号：PCT/KR2011009503
申请日：2011-12-09
申请人： DONGJIN SEMICHEM CO LTD , OH SEUNG-KEUN , LEE JAE-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , KIM JAE-HYUN
发明人： OH SEUNG-KEUN , LEE JAE-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , KIM JAE-HYUN
IPC分类号： G03F7/004 , H01L21/027
CPC分类号： G03F7/0045 , C08F220/38 , C08F2220/283 , G03F7/0046 , G03F7/0397
摘要： Disclosed are a photosensitive polymer, which allows penetration of extreme ultraviolet (EUV) waves but stops waves that are longer than ultraviolet waves in a photolithography process for forming a semiconductor element, a photoresist composition including same, and a method for forming a resist pattern using same. The photosensitive polymer is represented by chemical formula 1 of claim 1.
摘要翻译：公开了一种感光性聚合物，其可以在用于形成半导体元件的光刻工艺中使用极紫外（EUV）波的穿透而阻止比紫外线波长的波，包含其的光致抗蚀剂组合物，以及使用相同。感光性聚合物由权利要求1的化学式1表示。

19. 发明申请

WO2010095910A3 POLYPEPTIDE HAVING FUNCTION FOR DELAYING ANTHESIS OR SUPPRESSING GROWTH, POLYNUCLEOTIDE ENCODING THE SAME, AND USE THEREOF 审中-公开
标题翻译：具有延迟衰老或抑制生长的功能的多肽，编码其的多核苷酸及其用途
公开(公告)号：WO2010095910A3
公开(公告)日：2011-01-13
申请号：PCT/KR2010001112
申请日：2010-02-23
申请人： POSTECH ACAD IND FOUND , NAM HONG GIL , PARK KYUNG MOK , LEE DONG HEE , KIM JEONG SIK , LIM PYUNG OK
发明人： NAM HONG GIL , PARK KYUNG MOK , LEE DONG HEE , KIM JEONG SIK , LIM PYUNG OK
IPC分类号： C07K14/415 , A01H1/00 , C12N15/29 , C12N15/63
CPC分类号： C07K14/415 , C12N15/827
摘要： The present invention discloses a polypeptide having a function for delaying anthesis or suppressing growth, a polynucleotide encoding the same, and a use thereof. Specifically, the present invention discloses a polypeptide having a function of delaying anthesis or suppressing growth, a polynucleotide encoding the same, a method for manufacturing plants with a phenotype of anthesis delay, a method for manufacturing plants with a phenotype of growth suppression, a selecting transgenic plants, and a method for screening materials which delay anthesis or suppress growth of plants.
摘要翻译：本发明公开了具有延迟开花或抑制生长的功能的多肽，编码该多肽的多核苷酸及其用途。具体地，本发明公开了具有延迟开花或抑制生长的功能的多肽，编码该多肽的多核苷酸，具有开花延迟表型的植物的制造方法，具有生长抑制表型的植物的制造方法转基因植物，以及用于筛选延迟开花或抑制植物生长的材料的方法。

20. 发明申请

WO2010140870A2 METHOD FOR FORMING FINE PATTERN IN SEMICONDUCTOR DEVICE 审中-公开
标题翻译：在半导体器件中形成精细图案的方法
公开(公告)号：WO2010140870A2
公开(公告)日：2010-12-09
申请号：PCT/KR2010003615
申请日：2010-06-04
申请人： DONGJIN SEMICHEM CO LTD , LEE JUN-KYOUNG , JANG EU-JEAN , HAN DONG-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , LEE JAE-WOO , KIM DEOG-BAE , KIM JAE-HYUN
发明人： LEE JUN-KYOUNG , JANG EU-JEAN , HAN DONG-WOO , KIM JEONG-SIK , LEE JUNG-YOUL , LEE JAE-WOO , KIM DEOG-BAE , KIM JAE-HYUN
IPC分类号： H01L21/027
CPC分类号： H01L21/0271 , G03F7/0035 , G03F7/2051 , G03F7/40
摘要： The present invention relates to a method for forming a fine pattern in a semiconductor device, using a double exposure patterning process capable of forming a 2nd photoresist pattern by a simple exposure without using an exposure mask. The method for forming a fine pattern in a semiconductor device comprises: forming a 1st photoresist pattern on a semiconductor substrate having a layer to be etched formed thereon; heating (bake-hardening) the 1st photoresist pattern at 110 to 220 degrees Celsius to form an interlayer mirror film; forming a 2nd photoresist film on the resultant; and performing exposure and developing processes on the 2nd photoresist film without using an exposure mask but using light (low-energy light) having an energy value lower than a threshold energy (Eth) of the 2nd photoresist film, thereby forming a 2nd photoresist pattern between the 1st photoresist patterns by diffused reflection of the interlayer mirror film.
摘要翻译：本发明涉及一种在半导体器件中形成微细图案的方法，该方法使用能够通过简单曝光形成第二光致抗蚀剂图案的双曝光图案形成工艺，而不使用曝光掩模。在半导体器件中形成精细图案的方法包括：在其上形成有待蚀刻层的半导体衬底上形成第一光致抗蚀剂图案; 将第一光致抗蚀剂图案在110至220摄氏度下加热（烘烤硬化）以形成层间镜膜; 在所得物上形成第二光致抗蚀剂膜; 并且在不使用曝光掩模的情况下对第二光致抗蚀剂膜进行曝光和显影处理，但是使用具有低于第二光致抗蚀剂膜的阈值能量（Eth）的能量值的光（低能量光），从而在第二光致抗蚀剂图案之间形成第二光致抗蚀剂图案第一光致抗蚀剂图案通过层间反射膜的漫反射。

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