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    • 139. 发明申请
    • 金属積層体
    • 金属层压板
    • WO2007114081A1
    • 2007-10-11
    • PCT/JP2007/056070
    • 2007-03-23
    • 三井化学株式会社児玉 洋一
    • 児玉 洋一
    • C09J179/08B32B15/088C09J163/00
    • C09J179/08B32B7/12B32B15/08B32B2307/306C08L79/08C08L2666/20C09J163/00H05K1/0393H05K3/386H05K2201/0355
    • Disclosed is an adhesive for metal laminates which has excellent heat resistance and desmear property and enables to bond a polymer film substrate and a metal foil at a low temperature. Also disclosed is a metal laminate using such an adhesive. Specifically disclosed is an adhesive used for bonding the substrate and the metal foil of a metal laminate comprising a polymer film substrate and a metal foil. This adhesive contains a polyimide having a glass transition temperature of not more than 200°C, which is obtained by reacting a diamine component (A1) containing not less than 5 mol% but less than 20 mol% of a compound represented by the general formula (1) below with a tetracarboxylic acid dianhydride component (A2), and an epoxy resin (B). (1) (In the formula, n represents an integer of 1-50, Y represents an alkylene group having 2-10 carbon atoms, and when n is not less than 2, Y's may represent the same or different groups.)
    • 公开了一种金属层压体的粘合剂,其具有优异的耐热性和去污性,并且能够在低温下粘合聚合物膜基材和金属箔。 还公开了使用这种粘合剂的金属层压体。 具体公开了一种用于粘合包含聚合物膜基材和金属箔的金属层压板的基材和金属箔的粘合剂。 该粘合剂含有玻璃化转变温度不高于200℃的聚酰亚胺,其通过使含有不少于5摩尔%但小于20摩尔%的由通式表示的化合物的二胺组分(A1) (A)和四羧酸二酐组分(A2)和环氧树脂(B)。 (1)(式中,n表示1-50的整数,Y表示碳原子数2〜10的亚烷基,n为2以上时,Y表示相同或不同的基)。