专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06628242B1 High impedence structures for multifrequency antennas and waveguides 失效
标题翻译：多频天线和波导的高阻抗结构
公开(公告)号：US06628242B1
公开(公告)日：2003-09-30
申请号：US09644876
申请日：2000-08-23
申请人： Jonathan Bruce Hacker , Moonil Kim , John A. Higgins
发明人： Jonathan Bruce Hacker , Moonil Kim , John A. Higgins
IPC分类号： H01Q1523
CPC分类号： H01P3/12 , H01P1/2005 , H01Q9/0414 , H01Q15/008 , H01Q15/23 , H01Q21/061
摘要： A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies. It can also be used in waveguides that transmit multiple signal frequencies signals in one polarization or that are cross-polarized. As a waveguide it maintains a near-uniform density E and H fields, resulting in near uniform signal power density across the waveguide's cross-section.
摘要翻译：多层高阻抗结构对多个频率信号呈现高阻抗，每层具有不同的频率。每个层包括电介质基底，以及在基底顶表面上的辐射元件阵列，例如平行的导电条或导电贴片，在最底层的底表面上具有导电层。后续层的辐射元件与延伸穿过衬底的导电通孔垂直对准，以将辐射元件连接到接地平面。每个层在特定信号频率下呈现为E场的一系列并联谐振L-C电路，导致该频率处的高阻抗表面。新结构可用作微带贴片天线的基板，以在多个频率上提供谐振器和背板之间的最佳电距离。它也可以用于以一个极化或交叉极化传输多个信号频率信号的波导。作为波导，它保持近均匀的密度E和H场，导致波导横截面上的近似均匀的信号功率密度。

IPRDB

热门服务

关于我们

友情链接

联系方式